During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Author(s): J. Haisma (auth.), Dr. Marin Alexe, Prof. Dr. Ulrich Gösele (eds.)
Series: Springer Series in MATERIALS SCIENCE 75
Edition: 1
Publisher: Springer-Verlag Berlin Heidelberg
Year: 2004
Language: English
Pages: 504
Tags: Condensed Matter Physics; Characterization and Evaluation of Materials; Optical and Electronic Materials; Surfaces and Interfaces, Thin Films; Electrical Engineering
Front Matter....Pages I-XV
Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding....Pages 1-60
Basics of Silicon-on-Insulator (SOI) Technology....Pages 61-83
Silicon-on-insulator by the Smart Cut™ Process....Pages 85-105
ELTRAN® Technology Based on Wafer Bonding and Porous Silicon....Pages 107-156
Wafer Bonding for High-Performance Logic Applications....Pages 157-191
Application of Bonded Wafers to the Fabrication of Electronic Devices....Pages 193-261
Compound Semiconductor Heterostructures by Smart Cut™: SiC On Insulator, QUASIC™ Substrates, InP and GaAs Heterostructures on Silicon....Pages 263-314
Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach....Pages 315-326
Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers....Pages 327-357
High-Density Hybrid Integration of III–V Compound Optoelectronics with Silicon Integrated Circuits....Pages 359-376
Layer Transfer by Bonding and Laser Lift-Off....Pages 377-415
Single-Crystal Lithium Niobate Films by Crystal Ion Slicing....Pages 417-450
Wafer Bonding of Ferroelectric Materials....Pages 451-471
Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications....Pages 473-494
Back Matter....Pages 495-503
