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Using FloTHERM – SW Tool (Based on QRD Reference Design with MSM8x26 Chipset) + 10 thermal package models

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Author(s): Qualcomm Technologies Inc.
Series: Training Slides
Edition: 80-VU794-13 Rev. B
Publisher: Qualcomm Technologies Inc.
Year: 2014

Language: English
Pages: 73
City: San Diego, CA
Tags: qualcomm,datasheet,80-VU794-13,HS11-NB792-5HW,HS11-NB792-6HW,HS11-NH006-5HW,HS11-NH006-6HW,HS11-NH382-5HW,HS11-NH382-6HW,HS11-NJ120-5HW,HS11-NJ121-5HW,HS11-NJ121-6HW,HS11-NL713-6HW,flotherm

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├── HS11-NB792-5HW QCA1990 30WLNSP THERMAL PACKAGE MODEL ICEPAK.zip
├── HS11-NB792-6HW QCA1990 30WLNSP THERMAL PACKAGE MODEL FLOTHERM.zip
├── HS11-NH006-5HW SMB1360 30WLNSP THERMAL PACKAGE MODEL ICEPAK.zip
├── HS11-NH006-6HW SMB1360 30WLNSP THERMAL PACKAGE MODEL FLOTHERM.zip
├── HS11-NH382-5HW QFE2340 THERMAL PACKAGE MODEL ICEPAK.zip
├── HS11-NH382-6HW QFE2340 30WLNSP THERMAL PACKAGE MODEL FLOTHERM.zip
├── HS11-NJ120-5HW QFE1040 40WLNSP THERMAL PACKAGE MODEL ICEPAK.zip
├── HS11-NJ121-5HW QFE3320 THERMAL PACKAGE MODEL ICEPAK.zip
├── HS11-NJ121-6HW QFE3320 135WLNSP THERMAL PACKAGE MODEL FLOTHERM.zip
└── HS11-NL713-6HW WTR4905 60WLNSP THERMAL PACKAGE MODEL FLOTHERM.zip