This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
Author(s): Kazuo Kondo, Morihiro Kada, Kenji Takahashi (eds.)
Edition: 1
Publisher: Springer International Publishing
Year: 2015
Language: English
Pages: XIX, 408
Tags: Electrochemistry; Electrical Engineering; Semiconductors; Mechanical Engineering; Biomedical Engineering
Front Matter....Pages i-xix
Research and Development History of Three-Dimensional Integration Technology....Pages 1-23
Recent Research and Development Activities of Three-Dimensional Integration Technology....Pages 25-41
TSV Processes....Pages 43-96
Wafer Handling and Thinning Processes....Pages 97-138
Wafer and Die Bonding Processes....Pages 139-165
Metrology and Inspection....Pages 167-200
TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability....Pages 201-233
Trends in 3D Integrated Circuit (3D-IC) Testing Technology....Pages 235-268
Dream Chip Project at ASET....Pages 269-400
Back Matter....Pages 401-408
