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Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging

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This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.

Author(s): Jong-Hoon Lee
Series: Synthesis Lectures on Computational Electromagnetics
Edition: 1
Publisher: Morgan and Claypool Publishers
Year: 2008

Language: English
Pages: 118

Foreword......Page 1
ABSTRACT......Page 4
reference-c.pdf......Page 0
INTRODUCTION......Page 7
Introduction......Page 11
[{(2.1)}] 3D INTEGRATED SOP CONCEPT......Page 15
[{(3.1)}] MULTILAYER LCP SUBSTRATES......Page 21
[{(3.2.1)}] Package Fabrication......Page 33
[{(3.2.2)}] RF MEMS Switch Performance with Packaged Cavities......Page 34
[{(4.1.1)}] Single Patch Resonator......Page 35
RECTANGULAR CAVITY RESONATOR......Page 49
Investigation of an Ideal Compact Soft Surface Structure......Page 85
Topologies......Page 101
Author Biography......Page 117
xxxx......Page 109