System Design for Telecommunication Gateways provides a thorough review of designing telecommunication network equipment based on the latest hardware designs and software methods available on the market. Focusing on high-end efficient designs that challenge all aspects of the system architecture, this book helps readers to understand a broader view of the system design, analyze all its most critical components, and select the parts that best fit a particular application. In many cases new technology trends, potential future developments, system flexibility and capability extensions are outlined in preparation for the longevity typical for products in the industry.
Key features:
- Combines software and hardware aspects of the system design.
- Defines components and services supported by open-source and commercial basic and extended software platforms, including operating systems, middleware, security, routing, management layer and more.
- Focuses on disruptive technologies.
- Provides guidelines for developing software architectures based on multi-threaded, multi-process, multi-instance, multi-core, multi-chip, multi-blade and multi-chassis designs.
- Covers a number of advanced high-speed interconnect and fabric interface technologies and their commercial implementations.
- Presents different system form factors from compact pizza-box styles to medium and large bladed systems, including IBM BladeCenter, ATCA and microTCA-based chassis. Describes different mezzanine cards, such as PMC, PrPMC, XMC, AMC and others.
Author(s): Alexander Bachmutsky
Publisher: Wiley
Year: 2010
Language: English
Pages: 509
Tags: Библиотека;Компьютерная литература;Компьютерные сети;
SYSTEM DESIGN FOR
TELECOMMUNICATION
GATEWAYS......Page 3
Contents......Page 9
List of Figures......Page 11
List of Tables......Page 19
Abbreviations......Page 21
1 Introduction......Page 27
2.1 System Architecting......Page 29
2.2 Platform-Based Approach......Page 32
2.3 System Verification......Page 40
3.1 Different Form Factors......Page 43
3.1.1 Proprietary 1U/2U/4U Chassis......Page 44
3.1.2 Standard-Based Systems......Page 61
3.1.3 IBM Blade Center......Page 106
3.1.4 Comparison of Form Factors......Page 109
3.2 Stacking Chassis......Page 110
3.3 Cluster Computing......Page 112
3.4 Inter-Blade Interconnect......Page 114
3.4.1 Switch Fabric Technologies......Page 115
3.4.2 Bandwidth Estimation and QoS in the Switch Fabric......Page 120
3.4.3 Commercial Switch Fabric......Page 123
3.5 Hardware Solutions for Data, Control and Management Planes Processing......Page 131
3.5.1 General Purpose CPUs......Page 134
3.5.2 FPGAs and ASICs......Page 136
3.5.3 Network Processors......Page 160
3.5.4 Classification Processors and Co-Processors......Page 184
3.5.5 Content Processors......Page 186
3.5.6 Multicore Processors......Page 215
3.5.7 Graphic Processors......Page 301
3.5.8 Massively Parallel Processor Array Chips......Page 312
3.5.9 Traffic Management......Page 313
3.5.10 Data Plane and Control Plane Scalability......Page 323
3.5.11 Redundancy for Carrier Grade Solutions......Page 324
4.1.1 Operating Systems......Page 329
4.1.2 Networking Stacks......Page 335
4.2 Expanded Software Platform......Page 343
4.2.1 Middleware......Page 344
4.2.2 Management Plane......Page 428
4.2.3 Deep Packet Inspection and Other Software......Page 438
4.3 Single-Threaded and Multi-X Software Designs......Page 443
4.3.1 Industry Opinions about Different Design Types......Page 444
4.3.2 Single-Threaded Design......Page 445
4.3.3 Multi-Threaded Design......Page 449
4.3.4 Multi-Process Design......Page 451
4.3.5 Multi-Instance Design......Page 454
4.3.6 Co-Location and Separation of Platform and Application......Page 458
4.3.7 Multicore Design......Page 460
4.3.8 Fine-Grained Task-Oriented Programming Model......Page 462
4.3.9 Multicore Performance Tuning......Page 469
4.4 Partitioning OS and Virtualization......Page 475
4.4.1 Commercial and Open Source Embedded Hypervisor Offerings......Page 485
4.4.2 Hypervisor Benchmarking......Page 489
References......Page 491
Trademarks......Page 493
Index......Page 495
