This new edition of the classic Satellite Thermal Control Handbook, is a thorough, technical survey of the various technologies used to achieve thermal control of all types of spacecraft, as well as the design and analysis methods used by thermal engineers. Features: Spacecraft Systems Overview; Spacecraft Thermal Environments; Thermal Design Examples; Thermal Surface Finishes; Insulation; Radiators; Heaters; Mounting and Interfaces; Louvers; Heat Switches; Phase Change Materials; Pumped Fluid Loops; Thermoelectric Coolers; Heat Pipes; Thermal Design Analysis; Thermal Contact Resistance; Precision Temperature Control; Space Shuttle Integration; Thermal Testing; Future Technologies
Author(s): David G. Gilmore
Edition: 2
Publisher: Aerospace Press
Year: 2002
Language: English
Pages: 837
Cover......Page 1
Spacecraft Thermal Control Handbook
Volume I: Fundamental Technologies......Page 2
ISBN 9781884989117......Page 3
Preface......Page 4
Table of Contents......Page 10
1.2 Spacecraft Configurations......Page 15
1.3 Earth Orbits......Page 21
1.4 Interplanetary Orbits......Page 25
1.5 Missions......Page 29
2.1 Environments of Earth Orbit......Page 35
2.2 Standard Earth Orbits......Page 50
2.3 Environments of Interplanetary Missions......Page 62
2.4 Aerobraking Environments......Page 74
2.5 Launch and Ascent Environments......Page 77
2.6 References......Page 81
3.2 Spin-Stabilized Satellites......Page 84
3.3 Three-Axis-Stabilized Satellites......Page 85
3.4 Propulsion Systems......Page 86
3.5 Batteries......Page 90
3.6 Antennas......Page 92
3.7 Sun, Earth, and Star Sensors......Page 94
3.8 Cooled Devices......Page 97
3.9 Solar Arrays......Page 99
3.10 The Huygens Probe......Page 100
3.11 System Overview: The Hubble Space Telescope......Page 108
4.2 Common Thermal Surface Finishes......Page 151
4.3 Causes of Thermal Surface Degradation......Page 155
4.4 Degradation Rates for Common Thermal Finishes......Page 164
4.5 LDEF Results......Page 167
4.6 Electrical Grounding......Page 170
4.7 References......Page 171
5.1 Introduction......Page 172
5.2 Blanket Performance......Page 173
5.4 Materials......Page 180
5.5 Provisions for Venting......Page 193
5.6 Attachments......Page 194
5.7 Provisions for Electrical Grounding......Page 197
5.8 Fabrication......Page 198
5.10 High-Temperature Blankets......Page 204
5.11 Suggestions......Page 205
5.12 Insulation for In-Atmosphere Applications......Page 209
5.13 References......Page 216
6.1 Introduction......Page 217
6.4 Body-Mounted Radiators......Page 219
6.5 Deployable Radiators......Page 221
6.6 Radiator Freezing......Page 225
6.7 Radiator Effectiveness......Page 227
6.8 Experimental Radiators......Page 230
6.9 References......Page 232
7.2 Heater Types......Page 233
7.3 Control......Page 234
7.4 Failure Modes of Mechanical Thermostats......Page 237
7.5 Circuits......Page 238
7.6 Computer-Controlled Heater System Example......Page 241
7.7 Radioisotope Heater Units......Page 251
8.2 Unit Conduction Cooling......Page 256
8.3 Bolted-Joint Conductance without Interface Filler......Page 269
8.4 Bolted-Joint Conductance with Interface Filler......Page 284
8.5 Complex Configurations and Special Topics......Page 293
8.6 Nomenclature......Page 329
8.7 References......Page 332
9.1 Introduction......Page 339
9.2 Vane Louvers......Page 340
9.3 Analysis of Vane Louvers......Page 343
9.4 Designing Louvers for Operation in Sunlight......Page 354
9.5 Pinwheel Louvers......Page 357
9.6 References......Page 360
10.1 Introduction......Page 361
10.2 Heat-Switch Applications......Page 362
10.3 Heat-Switch Integration......Page 363
10.4 Paraffin Heat Switches......Page 365
10.5 Cryogenic Heat Switches......Page 374
10.6 References......Page 378
11.1 Phase-Change-Material Applications......Page 380
11.2 Phase-Change Materials......Page 384
11.3 When To Use a PCM......Page 387
11.4 PCM Design Details......Page 390
11.6 References......Page 409
12.1 Introduction......Page 411
12.2 Fluid-Flow Concepts and Basic Equations......Page 413
12.3 Forced Convection in Pipes and Tubes......Page 421
12.4 System Hardware......Page 424
12.5 Analysis of a Fluid Loop......Page 448
12.6 Computer Software for System Analysis......Page 449
12.7 PFL Application......Page 450
12.8 References......Page 474
13.2 Background......Page 479
13.3 Characteristics......Page 481
13.4 Optimizations......Page 482
13.6 Interfaces......Page 484
13.7 XRT Focal-Plane TEC Mounting......Page 485
13.8 Design Development......Page 486
13.10 Application Example......Page 487
13.11 Reference......Page 493
14.1 Overview......Page 494
14.2 Types of Heat Pipe......Page 495
14.3 Analysis......Page 501
14.4 Testing......Page 505
14.5 Heat-Pipe Applications and Performance......Page 506
14.7 LHPs and CPLs......Page 507
14.8 Selecting a Design......Page 523
14.9 References......Page 526
15.2 Spacecraft Project Phases......Page 528
15.3 Thermal Design/Analysis Process Overview......Page 539
15.4 Fundamentals of Thermal Modeling......Page 542
15.5 Thermal Design Analysis Example: POAM......Page 557
15.6 Margins......Page 577
15.7 TMM Computer Codes......Page 580
15.8 Radiation Analysis Codes......Page 597
15.9 References......Page 602
16.1 Introduction......Page 604
16.2 Contact Heat-Transfer Background......Page 605
16.3 Parameters Influencing Thermal Joint Resistance......Page 607
16.4 Thermal Joint Resistance Models......Page 608
16.5 The Effect of Oxidation on Thermal Contact Resistance......Page 628
16.6 The Effect of Interstitial Materials on Thermal Contact Resistance......Page 631
16.7 References......Page 641
17.1 Introduction......Page 644
17.2 The Space Interferometry Mission......Page 645
17.3 The Hydrogen Maser Clock......Page 660
17.5 References......Page 671
18.1 Introduction......Page 672
18.2 Engineering-Compatibility Assessment......Page 674
18.3 Safety Assessment......Page 680
18.4 The Cargo Integration Review......Page 681
18.5 Orbiter Payload-Bay Thermal Environment......Page 682
18.6 Middeck Payload Accommodations......Page 702
18.7 Ferry-Flight Accommodations......Page 705
18.8 Optional Services......Page 706
19.1 Introduction......Page 714
19.2 Definitions......Page 715
19.3 Design Environments......Page 720
19.4 Development Thermal Testing......Page 730
19.5 Unit Thermal Testing......Page 732
19.7 System Thermal Testing......Page 747
19.8 Launch Site Thermal Testing......Page 761
19.9 References......Page 762
20.1 Introduction......Page 763
20.2 Technology Drivers......Page 764
20.4 Future Technologies and Innovations......Page 765
20.5 Summary......Page 790
20.6 References......Page 791
Appendix A: Surface Optical Property Data......Page 794
Appendix B: Material Thermal Properties......Page 805
Appendix C: Thermally Conductive Filler Materials and Suppliers......Page 821
C......Page 832
H......Page 833
M......Page 834
S......Page 835
T......Page 836
W......Page 837
