TexLi, 2016. — 180 p. — ISBN: 9535124064 9535124056This book covers key conventional and emerging cooling techniques and coolants for electronics cooling. The book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
It includes following thematic topics:
Cooling approaches and coolants
Boiling and phase change-based technologies
Heat pipes-based cooling
Microchannels cooling systems
Heat loop cooling technology
Nanofluids as coolants
Theoretical development for the junction temperature of package chips.
Contents
Preface
Introductory Chapter: Electronics Cooling - An Overview
Boiling of Immiscible Mixtures for Cooling of Electronics
Heat Pipe and Phase Change Heat Transfer Technologies for Electronics Cooling
Heat Pipes for Computer Cooling Applications
MEMS-Based Micro-heat Pipes
Performance Evaluation of Nanofluids in an Inclined Ribbed Microchannel for Electronic Cooling Applications
Reciprocating Mechanism-Driven Heat Loop (RMDHL) Cooling Technology for Power Electronic Systems
Theoretical Derivation of Junction Temperature of Package Chip
