Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.
The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.
The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.
- Discusses how the reliability of packaging components is a prime concern to electronics manufacturers
- Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques
- Includes program files and macros for additional study
Author(s): E-H Wong, Y.-W. Mai
Series: Woodhead Publishing Series in Electronic and Optical Materials
Edition: 1
Publisher: Woodhead Publishing
Year: 2015
Language: English
Pages: 482
Tags: Приборостроение;Микро- и наносистемная техника;
Content:
Related titles, Page ii
Front Matter, Page iii
Copyright, Page iv
Woodhead Publishing Series in Electronic and Optical Materials, Pages ix-xiii
Foreword, Page xv
Preface, Pages xvii-xviii
1 - Introduction, Pages 1-24
2 - Robust design of microelectronic assemblies against mismatched thermal expansion, Pages 27-99
3 - Advances in creep-fatigue modelling of solder joints, Pages 101-121
4 - Moisture properties and their characterisations, Pages 125-165
5 - Advances in diffusion and vapour pressure modelling, Pages 167-198
6 - The physics of failure of portable electronic devices in drop impact, Pages 201-220
7 - Subsystem testing of solder joints against drop impact, Pages 221-260
8 - Fatigue resistance of solder joints: Strain-life representation, Pages 261-300
9 - Fatigue crack growth in solder joints at high strain rate, Pages 301-326
10 - Dynamic deformation of a printed circuit board in drop-shock, Pages 327-378
11 - Stresses in solder joints due to the bending deformation of printed circuit boards in microelectronics assemblies, Pages 379-409
12 - Rate-dependent stress–strain properties of solders, Pages 411-446
Index, Pages 447-457
