RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also:
- Presents methods and techniques used for measuring and testing of the electronic materials properties.
- Engages in an in-depth discussion of ceramic materials for RF/MW packaging.
- Offers numerical simulation methods and techniques used in analysis of electronic devices and materials.
- Discusses thermal management issues for RF/MW packaging.
- Creates a RF/Microwave Packaging Roadmap for Portable Devices.
Author(s): Rick Sturdivant (auth.), Ken Kuang, Franklin Kim, Sean S. Cahill (eds.)
Edition: 1
Publisher: Springer US
Year: 2010
Language: English
Pages: 285
Tags: Electronics and Microelectronics, Instrumentation; Microwaves, RF and Optical Engineering; Circuits and Systems
Front Matter....Pages i-xvi
Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies....Pages 1-23
Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages....Pages 25-42
Polymeric Microelectromechanical Millimeter Wave Systems....Pages 43-68
Millimeter-Wave Chip-on-Board Integration and Packaging....Pages 69-90
Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules....Pages 91-113
RF/Microwave Substrate Packaging Roadmap for Portable Devices....Pages 115-128
Ceramic Systems in Package for RF and Microwave....Pages 129-163
Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications....Pages 165-188
LTCC Substrates for RF/MW Application....Pages 189-206
High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging....Pages 207-232
High Performance Microelectronics Packaging Heat Sink Materials....Pages 233-265
Technology Research on AlN 3D MCM....Pages 267-279
Back Matter....Pages 281-285
