Power Distribution Networks with On-Chip Decoupling Capacitors, 2nd edition is dedicated to distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. This book provides a broad and cohesive treatment of power distribution systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors. The book provides insight and intuition into the behavior and design of on-chip power distribution systems.
This book has four primary objectives. The first objective is to describe the impedance characteristics of the overall power distribution system, from the voltage regulator through the printed circuit board and package onto the integrated circuit to the terminals of the on-chip circuitry. The second objective is to discuss the inductive characteristics of on-chip power distribution grids and the related circuit behavior of these structures. The third objective is to present design methodologies for efficiently placing on-chip decoupling capacitors in nanoscale integrated circuits. Finally, the fourth objective is to suggest novel architectures for distributing power across an integrated circuit, as well as provide new methodologies to efficiently analyze and design on-chip power grids.
Organized into subareas to provide a more intuitive flow to the reader, this edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
Author(s): Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman (auth.)
Edition: 2
Publisher: Springer-Verlag New York
Year: 2011
Language: English
Pages: 644
Tags: Circuits and Systems; Electronics and Microelectronics, Instrumentation; Processor Architectures
Front Matter....Pages i-xxv
Front Matter....Pages 1-4
Introduction....Pages 5-25
Inductive Properties of Electric Circuits....Pages 27-58
Properties of On-Chip Inductive Current Loops....Pages 59-70
Electromigration....Pages 71-87
Decoupling Capacitance....Pages 89-138
Scaling Trends of On-Chip Power Distribution Noise....Pages 139-158
Conclusions....Pages 159-159
Front Matter....Pages 161-164
High Performance Power Distribution Systems....Pages 165-202
On-Chip Power Distribution Networks....Pages 203-219
Computer-Aided Design and Analysis....Pages 221-252
Closed-Form Expressions for Fast IR Drop Analysis....Pages 253-277
Conclusions....Pages 279-279
Front Matter....Pages 281-284
Inductive Properties of On-Chip Power Distribution Grids....Pages 285-301
Variation of Grid Inductance with Frequency....Pages 303-311
Inductance/Area/Resistance Tradeoffs....Pages 313-321
Inductance Model of Interdigitated Power and Ground Distribution Networks....Pages 323-335
On-Chip Power Noise Reduction Techniques....Pages 337-347
Noise Issues in On-Chip Power Distribution Networks....Pages 349-359
Conclusions....Pages 361-361
Front Matter....Pages 363-366
Effective Radii of On-Chip Decoupling Capacitors....Pages 367-397
Front Matter....Pages 363-366
Efficient Placement of Distributed On-Chip Decoupling Capacitors....Pages 399-422
Simultaneous Co-Design of Distributed On-Chip Power Supplies and Decoupling Capacitors....Pages 423-432
Conclusions....Pages 433-433
Front Matter....Pages 435-437
Impedance Characteristics of Multi-Layer Grids....Pages 439-457
Multi-Layer Interdigitated Power Distribution Networks....Pages 459-485
Conclusions....Pages 487-487
Front Matter....Pages 489-491
Multiple On-Chip Power Supply Systems....Pages 493-510
On-Chip Power Distribution Grids with Multiple Supply Voltages....Pages 511-547
Decoupling Capacitors for Multi-Voltage Power Distribution Systems....Pages 549-577
Conclusions....Pages 579-579
Front Matter....Pages 581-581
Closing Remarks....Pages 583-587
Back Matter....Pages 589-644
