Polymeric Materials for Electronics Packaging and Interconnection

Content: Polymeric materials for electronics packaging and interconnection : an overview / John H. Lupinski and Robert S. Moore --
Cure studies of PMDA-ODA- and BTDA-ODA-based polyimides by fluorescence spectroscopy / Eric D. Wachsman, Peter S. Martin, and Curtis W. Frank --
Dynamic Fourier transform-IR analysis of cure reactions and kinetics of polyimides / Randy W. Snyder and Paul C. Painter --
Polyimide hydrolysis : measurement by Fourier transform-IR spectroscopy / Coralie A. Pryde --
Dielectric characterization of water in polyimide and poly(amide-imide) thin films / Allyson J. Beuhler, Neal R. Nowicki, and Joanne M. Gaudette --
Calculated final-state effects of the PMDA-ODA polyimide X-ray photoemission spectrum / A.R. Rossi and B.D. Silverman --
Effect of diamic acid additives on dielectric constants of polyimides / Diane M. Stoakley and Anne K. St. Clair --
Organic dielectric materials with reduced moisture absorption and improved electrical properties / D.L. Goff, E.L. Yuan, H. Long, and Herbert J. Neuhaus --
Synthesis and characterization of the t-butyl ester of the oxydianiline-pyromellitic dianhydride polyamic acid / F.M. Houlihan, B.J. Bachman, C.W. Wilkins, Jr., and Coralie A. Pryde --
Curing of binary mixtures of polyimides / C. Feger --
Polyimides for dielectric layers / L.M. Baker, P.J. Brown, and J.L. Markham --
Siloxane polyimides for interlayer dielectric applications / P.P. Policastro, John H. Lupinski, and P.K. Hernandez --
Electrophoretic deposition of polyimides : electrocoating on the cathode / Stephen L. Buchwalter --
Accelerated testing of polyimide coatings for neural prostheses / J. McHardy, D.I. Basiulis, G. Angsten, L.R. Higley, and R.N. Leyden --
Conduction transients in polyimides / Herbert J. Neuhaus and Stephen D. Senturia --
Polymer insulating layers for multilayer hybrid circuits / L.M. Baker, J.L. Markham, and R.D. Small --
Fabrication and properties of thermoset films derived from bis-benzocyclobutene for multilayer applications / S.F. Hahn, P.H. Townsend, D.C. Burdeaux, and J.A. Gilpin --
Synthesis of poly(arylene ether phenylquinoxaline) / James L. Hedrick and Jeff W. Labadie --
High-performance silicone gel as integrated-circuit-device chip protection : cure study and electrical reliability / C.P. Wong --
Silicone gels for semiconductor applications : chemistry and properties / Gust J. Kookootsedes --
Advantages of silicone gel for packaging of devices with very large scale integration (VLSI) / Kanji Otsuka, Hisashi Ishida, Yasuyuki Utsumi, Takashi Miwa, and Yuji Shirai --
Modeling of triple-track and comb-pattern leakage current measurements / Philip R. Troyk, David Conroy, and James E. Anderson --
Silicone gels and coatings for integrated-circuit packaging / Justin C. Bolger --
Ultraviolet-curable silicones for integrated-circuit protection / Michael A. Lutz and Kristen A. Scheibert --
Moisture transport phenomena in epoxies for microelectronics applications / D.J. Belton, E.A. Sullivan, and M.J. Molter --
Heterogeneous conduction processes in integrated-circuit encapsulation / D.A. Hoffmann, James E. Anderson, L.J. Bousse, and Curtis W. Frank --
Novel coatings that maintain low surface-water concentrations / James E. Anderson, V. Markovac, I. Kim, and Philip R. Troyk --
Thermal stress in epoxy molding compounds and packaged devices / W.F. van den Bogert, M.J. Molter, S.A. Gee, D.J. Belton, and V.R. Akylas --
Characterization of stresses in polymer films for microelectronics applications / Rolf W. Biernath and David S. Soane --
Stress factors in molding compounds / A.A. Gallo --
New transfer molding compounds / E.W. Walles, John H. Lupinski, S. Bandes, and M. Rosenfield --
Chemistry of stable brominated epoxies / C.S. Wang, D.B. Fritz, and A. Mendoza --
Performance of stable brominated epoxies in encapsulants for microelectronic devices / D.B. Fritz and C.S. Wang --
New polymeric materials for electronics packaging / H. Hacker, K.-R. Hauschildt, J. Huber, H. Laupenmühlen, and D. Wilhelm --
Degradation of brominated epoxy resin and effects on integrated-circuit-device wirebonds / M. Nakao, T. Nishioka, M. Shimizu, H. Tabata, and K. Ito --
Enhancement of gold-aluminum wirebond reliability in plastic encapsulated very large scale integration (VLSI) devices through C-Br bond stabilization / Muhib M. Khan, Homi Fatemi, Jeremias Romero, and Eugene Delenia --
Ordered polymers for interconnection substrates / Richard Lusignea, Joseph Piche, and Richard Mathisen --
Three-dimensional circuit interconnections with thermoplastic performance polymers / David C. Frisch and John F. Rowe --
Significance of developments in new substrate materials / Edward Donnelly.