Content: A sensitive positive-working cross-linked methacrylate electron resist / E.D. Roberts --
Radiation degradation and film solubility rates of poly(butene-1-sulfone) / Larry Stillwagon --
Poly(methyl methacrylate-co-3-oximino-2-butanone methacrylate-co-methacrylonitrile) : a deep-UV photoresist / E. Reichmanis and C.W. Wilkins, Jr. --
Compositional analysis of a terpolymer photoresist by raman spectroscopy / F.J. Purcell, E. Russavage, E. Reichmanis, and C.W. Wilkins, Jr. --
Effect of composition on resist dry-etching susceptibility : vinyl polymers and photoresists / J.N. Helbert and M.A. Schmidt --
Poly(N-alkyl-o-nitroamides) : a new class of thermally stable, photosensitive polymers / S.A. MacDonald and C.G. Willson --
A new approach to high-resolution lithography based on conducting organic charge transfer salts / E.M. Engler, Y. Tomkiewicz, J.D. Kuptsis, R.G. Schad, V.V. Patel, and M. Hatzakis --
Polyimide for multilevel very large-scale integration (VLSI) / Gay Samuelson --
Polyimide coatings for microelectronic applications / Y.K. Lee and J.D. Craig --
Development of polyimide isoindoloquinazolinedione in multilevel interconnections for large-scale integration (LSI) / Atsushi Saiki, Kiichiro Mukai, Seiki Harada, and Yasuo Miyadera --
Characterizing polyimide films for semiconductor application / A.M. Wilson, D. Laks, and S.M. Davis --
Implications of electronic and ionic conductivities of polyimide films in integrated circuit fabrication / George A. Brown --
Improved room-temperature vulcanized (RTV) silicone elastomers as integrated circuit (IC) encapsulants / Ching-Ping Wong --
Synthesis and properties of branched epoxy resins / Jon F. Geibel --
Characterization of cured epoxy powder coatings by solvent absorption / W.A. Romanchick and J.F. Geibel --
Thermal degradation of polymers for molded integrated circuit (IC) devices : the effect of a flame retardant / R.M. Lum and L.G. Feinstein --
Electrical switching and memory phenomena in semiconducting organic thin films / R.S. Potember and T.O. Poehler.
Author(s): Eugene D. Feit and Cletus W. Wilkins, Jr. (Eds.)
Series: ACS Symposium Series 184
Publisher: American Chemical Society
Year: 1982
Language: English
Pages: 252
City: Washington, D.C
Title Page......Page 1
Half Title Page......Page 3
Copyright......Page 4
ACS Symposium Series......Page 5
FOREWORD......Page 6
PdftkEmptyString......Page 0
PREFACE......Page 7
1 A Sensitive Positive-Working Cross-Linked Methacrylate Electron Resist......Page 9
Properties of sensitive cross-linking resists......Page 10
Thermal stability of lightly cross-linked films......Page 16
Uses of sensitive cross-linked resists......Page 22
Literature Cited......Page 24
2 Radiation Degradation and Film Solubility Rates of Poly(butene-1-sulfone)......Page 26
Results and Discussion......Page 27
Literature Cited......Page 34
3 Poly(methyl methacrylate-co-3-oximino-2-butanone methacrylate-co-methacrylonitrile) A Deep-UV Photoresist......Page 35
RESULTS AND DISCUSSION......Page 36
CONCLUSION......Page 48
Literature Cited......Page 49
4 Compositional Analysis of a Terpolymer Photoresist by Raman Spectroscopy......Page 50
Experimental......Page 53
Results and Discussion......Page 54
Literature Cited......Page 63
5 Effect of Composition on Resist Dry-Etching Susceptibility Vinly Polymers and Photoresists......Page 65
Experimental......Page 67
Results and Discussion......Page 68
Acknowledgment......Page 75
Literature Cited......Page 76
6 Poly(N-alkyl-o-nitroamides) A New Class of Thermally Stable, Photosensitive Polymers......Page 77
Synthesis and Thermal Properties......Page 79
Application......Page 83
Literature Cited......Page 85
BACKGROUND......Page 86
RESULTS......Page 89
CONCLUSION......Page 93
Literature Cited......Page 94
Experimental......Page 95
Results and Discussion......Page 97
Summary......Page 106
Literature Cited......Page 107
9 Polyimide Coatings for Microelectronic Applications......Page 109
EXPERIMENTAL......Page 110
RESULTS AND DISCUSSIONS......Page 111
THE MECHANISM BY WHICH ORGANOSILANES PROMOTE ADHESION IS POSTULATED......Page 114
CURE CYCLE......Page 117
Literature Cited......Page 123
10 Development of Polyimide Isoindoloquinazolinedione in Multilevel Interconnections for Large-Scale Integration (LSI)......Page 124
Experiments......Page 126
Results and Discussions......Page 127
Conclusions......Page 137
Literature Cited......Page 139
Experimental......Page 140
Results & Discussion......Page 142
Conclusions......Page 149
Literature Cited......Page 151
Bulk Electronic Conductivity......Page 152
Sodium Ion Conductivity......Page 157
Summary......Page 168
Literature Cited......Page 170
13 Improved Room-Temperature Vulcanized (RTV) Silicone Elastomers as Integrated Circuit (IC) Encapsulants......Page 171
Experimental Discussion......Page 177
Results and Discussion......Page 180
Literature Cited......Page 182
14 Synthesis and Properties of Branched Epoxy Resins......Page 184
Synthesis of Branched Epoxy Resins......Page 185
Results and Discussion......Page 189
Experimental......Page 195
Literature Cited......Page 196
DISCUSSION OF TEST PARAMETERS......Page 197
MEK ABSORPTION AS A MEASURE OF HOMOGENEITY......Page 200
MEK ABSORPTION VERSUS THE STATE OF CURE......Page 202
MEK ABSORPTION VERSUS CTBN RUBBER CONCENTRATION......Page 205
EXPERIMENTAL......Page 208
LITERATURE CITED......Page 209
Materials......Page 211
Apparatus......Page 212
Electrical/Electronic Grade Novolac Epoxy Results......Page 213
Semiconductor Grade Silicone-Epoxy Results......Page 215
Semiconductor Grade Epoxy Results......Page 222
Discussion......Page 227
Acknowledgments......Page 229
Literature Cited......Page 230
Switching and Memory Device: Materials and Fabrication......Page 231
Electrical Behavior......Page 233
Infrared Reflectance Spectra of Cu-TCNQ Semiconducting Films......Page 238
Acknowledgments......Page 243
Literature Cited......Page 244
C......Page 245
E......Page 246
I......Page 247
O......Page 248
P......Page 249
S......Page 251
W......Page 252
