With its unique promise to revolutionize science, engineering, technology, and other fields, nanotechnology continues to profoundly impact associated materials, components, and systems, particularly those used in telecommunications. These developments are leading to easier convergence of related technologies, massive storage data, compact storage devices, and higher-performance computing. Nanotechnology for Telecommunications presents vital technical scientific information to help readers grasp issues and challenges associated with nanoscale telecommunication system development and commercialization—and then avail themselves of the many opportunities to be gleaned. This book provides technical information and research ideas regarding the use of nanotechnology in telecommunications and information processing, reflecting the continuing trend toward the use of optoelectronics. Nanotech will eventually lead to a technology cluster that offers a complete range of functionalities for systems used in domains including information, energy, construction, environmental, and biomedical. Describing current and future developments that hold promise for significant innovations in telecommunications, this book is organized to provide a progressive understanding of topics including: Background information on nanoscience and nanotechnology Specific applications of nanotechnology in telecommunications Nanostructured optoelectronic materials MEMS, NEMS, and their applications in communication systems Quantum dot Cellular Automata (QCA) and its applications in telecommunication systems How nonohmic nonlinear behavior affects both digital and analog signal processing Concepts regarding quantum switching and its applications in quantum networks The scale of the physical systems that use nanoscale electronic devices is still large, and that presents serious challenges to the establishment of interconnections between nanoscale devices and the outside world. Also addressing consequent social implications of nanotech, this book reviews a broad range of the nano concepts and their influence on every aspect of telecommunications. It describes the different levels of interconnections in systems and details the standardized assembly process for a broad specrum of micro-, nano-, bio-, fiber-optic, and optoelectronic components and functions. This book is a powerful tool for understanding how to harness the power of nanotech through integration of materials, processes, devices, and applications.
Author(s): Sohail Anwar, M. Yasin Akhtar Raja, Salahuddin Qazi, Mohammad Ilyas
Edition: 1
Publisher: CRC Press
Year: 2010
Language: English
Commentary: index is missing
Pages: 451
Tags: Специальные дисциплины;Наноматериалы и нанотехнологии;Научные статьи и сборники
Contents......Page 6
Preface......Page 8
Acknowledgments......Page 12
Editors......Page 14
Contributors......Page 18
1.1 Introduction......Page 20
1.1.1 What Is Nanotechnology?......Page 21
1.2.1 How Did the Field of Nanotechnology Evolve?......Page 22
1.3.1 What Is the Difference between Bulk and Nano-Sized Properties of Materials?......Page 27
1.4.1 What Are the Applications of Nanotechnology?......Page 28
1.5.1 What Would Be the Impact of Nanotechnology on Education and Workforce of the Future?......Page 35
1.6.1 What Are the Social Implications of Nanotechnology?......Page 36
1.7 Conclusion......Page 39
References......Page 40
2.1 Introduction......Page 42
2.2 Dimensions: A Snapshot......Page 43
2.3 Global Standards......Page 47
2.4 Impact and Promise of Nanotechnology for Telecommunications......Page 48
2.5 Transparent Transaction: A Scenario......Page 53
2.6 Ongoing Research and Nanotechnology: Some Samples......Page 54
2.7 The Promise and Future of Nanotechnology......Page 55
2.8 Concerns about Nanotechnology......Page 56
2.9 Preparing Students for Nanotechnology......Page 57
2.10 Conclusion......Page 58
References......Page 59
3. Nanotechnology in Fiber-Optic Telecommunications: Power-Control Applications......Page 62
3.2.1 The Need for Optical Power-Control Devices......Page 63
3.2.2 Optical Power-Control Devices......Page 64
3.2.3 Important Related Definitions......Page 65
3.3 Nanostructures and The irInteraction with Light......Page 67
3.4 Single Nanoparticle......Page 68
3.5 Nanostructure......Page 69
3.6 Nanostructure Construction......Page 70
3.7.1 Optical Fuses......Page 71
3.7.2 Optical Limiters......Page 83
3.8.1 General......Page 86
3.8.2 Examples of Performance Results and Test Methods under Standardization Activities......Page 88
3.9 Conclusion......Page 90
References......Page 91
4. Nanotubes and Their Applications in Telecommunications......Page 94
4.1 Introduction......Page 95
4.2 Background......Page 96
4.2.1 Fabrication Methods of Nanotubes......Page 100
4.3 Characteristics of Carbon Nanotubes......Page 101
4.4 Characterization of Carbon Nanotubes Using Raman Microspectroscopy......Page 117
4.5 Standard Test Methods for Measurement of Electrical Properties of Carbon Nanotubes......Page 119
4.6 Schrödinger–Hamiltonian Dynamical of Particles Motion along Nanotubes......Page 120
4.7.2 Carbon Nanotubes as Neural Communicators......Page 123
4.7.3 Nanotubes as Microwave Diodes in Spacecrafts and Satellites......Page 124
4.7.4 Carbon Nanotubes in Fiber-Optics Telecommunications......Page 126
4.7.5 Carbon Nanotubes for Wireless Communications and Radio Transmission......Page 128
4.8 Conclusion......Page 131
References......Page 133
5.1 Introduction......Page 136
5.2 Nanotechnology Enables Unique Applications......Page 137
5.3 Superlattices and Quantum Wells......Page 138
5.4 The Importance of Silicon......Page 140
5.5 Silicon Optoelectronics and Nanotechnology......Page 142
5.6 Light Emission from Nanoscale Silicon......Page 144
5.7 Characterization of Silicon Nanoparticles by Raman Spectroscopy......Page 149
5.8 Photonic Bandgap Crystals......Page 152
5.10 Ideas May Work......Page 155
5.11 Conclusion......Page 156
References......Page 157
6.1 Introduction......Page 160
6.2 Main Focus of the Chapter......Page 162
6.3 III-Nitrides-Based Nanostructures for Photonic Devices......Page 163
6.4 Nanostructure-Based Photonic Materials and Devices......Page 165
6.5 Photonic Devices Fabrication Using Nanostructures......Page 167
6.6 High-Efficiency Multiquantum-Wells Deep-UV LEDs with High Al Content......Page 176
6.7 Conclusion......Page 178
References......Page 179
7.1 Introduction......Page 182
7.2 Chip-to-Chip Communication......Page 183
7.3 Intra-Chip Communication......Page 186
7.3.1 Architecture Overview......Page 187
7.3.2 Building Blocks......Page 188
7.3.3 The Big Picture......Page 192
References......Page 194
8.1 Introduction......Page 198
8.2.1 Crystalline Colloidal Array Photonic Crystal......Page 200
8.2.2 Diffraction Properties of Crystalline Colloidal Array Photonic Crystals......Page 202
8.3.1 Thermally Switchable Photonic Crystals......Page 204
8.3.2 Photoswitchable Photonic Crystals......Page 207
8.3.3 Nanogel Nanosecond Photonic Crystal Optical Switching......Page 217
8.4 Conclusion......Page 219
References......Page 220
9.1 Introduction......Page 226
9.2 Scaling......Page 227
9.3 Materials......Page 228
9.5 Applications of MEMS......Page 230
9.6 Processing of MEMS and NEMS......Page 231
9.6.2 Isotropic Etching......Page 232
9.6.3 Isotropic (Orientation-Dependent) Etching......Page 233
9.6.6 LIGA......Page 235
9.7.2 Nanofabrication Tools......Page 236
9.7.3 Nanolithography......Page 237
9.7.4 Self-Assembly......Page 238
9.7.5 Ion-Beam-Induced Self-Assembly of Nanostructures......Page 239
9.8 Reliability of MEMS and NEMS Structures......Page 241
References......Page 242
10.1 Introduction......Page 248
10.2.1 Physical Level......Page 250
10.2.2 Device Level......Page 251
10.4 Model Order Reduction......Page 253
10.5 System Level......Page 254
10.6 Conclusion......Page 257
References......Page 258
11. MEMS-Based Wireless Communications......Page 260
11.1 Introduction......Page 261
11.2.1 MEMS-Based Inductors......Page 263
11.2.2 MEMS Variable Capacitor......Page 274
11.2.3 RF MEMS Switch......Page 279
11.3.1 Low Actuation Design......Page 283
11.3.3 Reliability Issues of MEMS Switches......Page 284
11.4 Packaging of RF MEMS......Page 285
11.4.1 Wafer-Level Packaging......Page 286
11.5.1 Surface Micromachining......Page 287
11.6 Conclusion......Page 288
References......Page 289
12.1 Introduction......Page 294
12.2 CMOS versus QCA......Page 295
12.3.2 Quantum Mechanical Concepts......Page 296
12.3.3 Quantum Cells......Page 298
12.4 QCA Digital Logic Implementation......Page 299
12.5 Modeling and Simulation of QCA cells......Page 301
12.5.1 Master Equation......Page 304
12.5.2 Monte Carlo Approach......Page 306
12.5.3 Coherence Vector Simulation......Page 307
12.6 Digital Data Storage......Page 309
12.6.1 Decoders......Page 310
12.6.2 QDCROM......Page 311
12.7.1 Side-Channel Attacks and Countermeasures......Page 317
12.7.2 SCQCA Logic......Page 319
12.8 Conclusion......Page 323
References......Page 324
13.1 Introduction......Page 328
13.2 Ohmic (Linear) Transport Defined (Twentieth Century Paradigm)......Page 329
13.3 Discovery of Sat Law (Twenty-First Century Paradigm)......Page 331
13.4 Charge Transport in 2D and 1D Resistors......Page 336
13.5 Power Consumption......Page 337
13.6 Nonohmic Circuit Behavior......Page 339
13.7 CMOS Circuit Design......Page 341
13.8 Transit Time Delay......Page 343
13.9 RC Time Delay......Page 344
13.10 Conclusion......Page 350
References......Page 351
14. Packaging and Assembly of Microelectronic Devices and Systems......Page 354
14.1 Introduction......Page 355
14.2 Classification of Electronic Devices (Level 0)......Page 356
14.2.1 Microelectronic Devices......Page 358
14.2.2 Optoelectronic Devices......Page 360
14.2.3 Microsystems......Page 364
14.3 Device Packaging (Level 1)—Component......Page 366
14.3.1 Substrates......Page 367
14.3.2 Wire-Bonded Device Attach......Page 369
14.3.3 Flip Chip Device Attach......Page 371
14.3.4 I/O Redistribution—Chip Level and Wafer Level......Page 373
14.3.5 Single-Chip Packaging......Page 374
14.3.6 Multi-Chip Packaging......Page 375
14.4.1 Solder-Based Component Attach Process......Page 376
14.4.2 Electrically Conductive Adhesive-Based Component Attach Process......Page 386
14.5 Conclusion......Page 389
Bibliography......Page 390
15.1 Introduction to Classical Switching Technologies......Page 392
15.2 Quantum Bits and Quantum Circuits......Page 395
15.3 Quantum Networks and Quantum Switching......Page 397
15.3.1 Architecture 1—Cycle Implementation......Page 398
15.3.2 Architecture 2—Quantum Superposition......Page 399
15.3.3 Architecture 3—Destination Address Sorting......Page 401
15.4 Conclusion......Page 402
References......Page 403
16.1 Introduction......Page 404
16.2 Main Focus......Page 408
16.3 University-Based Research and Development Activities......Page 417
References......Page 418
17.1 Introduction......Page 420
17.2 Overview of Nanotechnology-Based Commercial Products......Page 421
17.3 Path to Nanotechnology Commercialization......Page 423
17.4 Barriers to Nanotechnology Commercialization......Page 425
17.5 Key Success Factors for Nanotechnology Commercialization......Page 427
References......Page 429
B......Page 442
D......Page 443
H......Page 444
M......Page 445
N......Page 446
Q......Page 447
S......Page 448
T......Page 450
W......Page 451
