This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community.
Author(s): Xavier Baillin, Christian Joachim, Gilles Poupon (eds.)
Series: Advances in Atom and Single Molecule Machines
Edition: 1
Publisher: Springer International Publishing
Year: 2015
Language: English
Pages: VIII, 189
Tags: Nanochemistry; Nanotechnology; Multicellular Systems
Front Matter....Pages i-viii
Utilization of Peridynamic Theory for Modeling at the Nano-Scale....Pages 1-16
DNA Metallization Processes and Nanoelectronics....Pages 17-32
Evaluation of Leakage Current in 1-D Silicon Dangling-Bond Wire Due to Dopants....Pages 33-40
Direct Integration of Carbon Nanotubes in Si Microsystems....Pages 41-58
Nanopackaging Requests for Atomic Scale Circuits and Molecule-Machines....Pages 59-81
Single-Crystal Au Triangles as Reconfigurable Contacts for Atomically Smooth Surfaces: Ultra-High Vacuum Transfer-Printing....Pages 83-91
Site-Selective Self-Assembly of Nano-Objects on a Planar Substrate Based on Surface Chemical Functionalization....Pages 93-112
Silicon Technologies for Nanoscale Device Packaging ....Pages 113-135
Designing Carbon Nanotube Interconnects for Radio Frequency Applications....Pages 137-154
Packaging of Buckyballs/Buckytubes in Transparent Photo-Active Inorganic Polymers: New Hope in the Area of Electronics and Optoelectronics ....Pages 155-173
Novel Nanostructured Passives for RF and Power Applications: Nanopackaging with Passive Components....Pages 175-189
