Nanotechnologies are frequently being applied to the biotechnology area, especially in nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials at the device level. Nano-Bio- Electronic, Photonic and MEMS Packaging discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for bio devices and much more, including:
- Offering a comprehensive overview of nano and bio packaging
- Discussing nano materials as power energy sources
- Analyzing nanotubes, superhydrophobic self-clean Lotus surfaces
- Covering nano chemistry for bio sensor / bio medical device packaging
Nano-Bio- Electronic, Photonic and MEMS Packaging
is the perfect book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.
Author(s): C. P. Wong, Kyoung-sik (Jack) Moon (auth.), C.P. Wong, Kyoung-Sik Moon, Yi (Grace) Li (eds.)
Edition: 1
Publisher: Springer US
Year: 2010
Language: English
Pages: 761
Tags: Nanotechnology;Electrochemistry;Electronics and Microelectronics, Instrumentation;Biomedical Engineering;Biophysics and Biological Physics
Front Matter....Pages -
Nanomaterials for Microelectronic and Bio-packaging....Pages 1-17
Nano-conductive Adhesives for Nano-electronics Interconnection....Pages 19-45
Biomimetic Lotus Effect Surfaces for Nanopackaging....Pages 47-85
Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials....Pages 87-138
Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation, and Their Electronic Applications....Pages 139-166
1D Nanowire Electrode Materials for Power Sources of Microelectronics....Pages 167-183
Mechanical Energy Harvesting Using Wurtzite Nanowires....Pages 185-216
Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging....Pages 217-246
Introduction to Nanoparticle-Based Integrated Passives....Pages 247-276
Thermally Conductive Nanocomposites....Pages 277-314
Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension....Pages 315-347
On-Chip Thermal Management and Hot-Spot Remediation....Pages 349-429
Some Aspects of Microchannel Heat Transfer....Pages 431-477
Nanoprobes for Live-Cell Gene Detection....Pages 479-504
Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips....Pages 505-563
Packaging of Biomolecular and Chemical Microsensors....Pages 565-611
Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging....Pages 613-663
Molecular Dynamics Applications in Packaging....Pages 665-694
Nanoscale Deformation and Strain Analysis by AFM/DIC Technique....Pages 695-718
Nano-Scale and Atomistic-Scale Modeling of Advanced Materials....Pages 719-758
Back Matter....Pages 759-761
