Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: • Thorough exploration of moisture’s effects based on lectures and tutorials by the authors • Consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging • Emerging theories and cutting-edge industrial applications presented by the leading professionals in the field Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Author(s): X. J. Fan, S.W.R. Lee (auth.), X.J. Fan, E. Suhir (eds.)
Series: Micro- and Opto-Electronic Materials, Structures, and Systems
Edition: 1
Publisher: Springer US
Year: 2010
Language: English
Pages: 558
Tags: Electronics and Microelectronics, Instrumentation; Optical and Electronic Materials; Engineering, general
Front Matter....Pages i-xvii
Fundamental Characteristics of Moisture Transport, Diffusion, and the Moisture-Induced Damages in Polymeric Materials in Electronic Packaging....Pages 1-28
Mechanism of Moisture Diffusion, Hygroscopic Swelling, and Adhesion Degradation in Epoxy Molding Compounds....Pages 29-69
Real-Time Characterization of Moisture Absorption and Desorption....Pages 71-89
Modeling of Moisture Diffusion and Whole-Field Vapor Pressure in Plastic Packages of IC Devices....Pages 91-112
Characterization of Hygroscopic Deformations by Moiré Interferometry....Pages 113-130
Characterization of Interfacial Hydrothermal Strength of Sandwiched Assembly Using Photomechanics Measurement Techniques....Pages 131-151
Hygroscopic Swelling of Polymeric Materials in Electronic Packaging: Characterization and Analysis....Pages 153-179
Modeling of Moisture Diffusion and Moisture-Induced Stresses in Semiconductor and MEMS Packages....Pages 181-219
Methodology for Integrated Vapor Pressure, Hygroswelling, and Thermo-mechanical Stress Modeling of IC Packages....Pages 221-243
Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit (IC) Devices: Application and Extension of the Theory of Thin Plates of Large Deflections....Pages 245-278
Continuum Theory in Moisture-Induced Failures of Encapsulated IC Devices....Pages 279-299
Mechanism-Based Modeling of Thermal- and Moisture-Induced Failure of IC Devices....Pages 301-331
New Method for Equivalent Acceleration of IPC/JEDEC Moisture Sensitivity Levels....Pages 333-358
Moisture Sensitivity Level (MSL) Capability of Plastic-Encapsulated Packages....Pages 359-388
Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages....Pages 389-409
Industrial Applications of Moisture-Related Reliability Problems....Pages 411-434
Underfill Selection Against Moisture in Flip Chip BGA Packages....Pages 435-460
Moisture Sensitivity Investigations of 3D Stacked-Die Chip-Scale Packages (SCSPs)....Pages 461-478
Automated Simulation System of Moisture Diffusion and Hygrothermal Stress for Microelectronic Packaging....Pages 479-501
Moisture-Driven Electromigrative Degradation in Microelectronic Packages....Pages 503-522
Interfacial Moisture Diffusion: Molecular Dynamics Simulation and Experimental Evaluation....Pages 523-549
Back Matter....Pages 551-570
