Modern Manufacturing Technology: Spotlight on Future summarizes the emergence and development of modern manufacturing techniques (MMTs) with a focus on metallic and advanced material-based additive manufacturing technologies and their potential applications. Further, it explores advanced machining techniques for production of novel nanomaterials. The book also covers modern sophisticated techniques for the fabrication of ultrafine electronic devices such as micro-electromechanical systems (MEMS), nano-electromechanical systems (NEMS), semiconductors, and optical systems. A dedicated chapter on manufacturing technology for Industry 4.0 is included.
Features:
- Describes the background of manufacturing techniques in brief including the advent of and introduction to MMTs
- Reviews various types of MMTs established in recent years and their accelerated growth and development innovation-driven applications
- Overviews the physical and chemical techniques used for nanomaterials production
- Explores the fabrication mechanisms of MEMS, NEMS, semiconductors and optical devices
- Provides a conceptual overview of additive manufacturing technologies
This book is geared to undergraduate and postgraduate students and professionals in mechanical and manufacturing engineering, and the manufacturing industry.
Author(s): Jitendra Kumar Katiyar, Ranjeet Kumar Sahu
Publisher: CRC Press
Year: 2021
Language: English
Pages: 142
City: Boca Raton
Cover
Half Title
Title Page
Copyright Page
Table of Contents
Preface
Authors
1 Introduction to Modern Manufacturing Techniques
1.1 Need for MMTs
1.2 Classification of MMTs
1.3 Advanced Casting Techniques
1.3.1 Ceramic Shell Investment Casting
1.3.1.1 Applications
1.3.2 Expandable Pattern Casting
1.3.2.1 Applications
1.3.3 Plaster Mold Casting
1.3.3.1 Applications
1.3.4 Ceramic Mold Casting
1.3.4.1 Applications
1.3.5 Vacuum Mold Casting
1.3.6 Slush Casting
1.3.7 Squeeze Casting
1.3.7.1 Applications
1.3.8 Spin Casting
1.3.9 Rapid Solidification
1.3.10 Single Crystal Casting
1.3.11 Stir Casting
1.3.12 Semisolid Casting
1.3.12.1 Thixo Casting
1.3.12.2 Rheo Casting
1.3.12.3 Thixo Molding
1.3.12.4 Strain-Induced Melt Activation (SIMA)
1.4 Advanced Forming Techniques
1.4.1 Explosive Forming
1.4.1.1 Standoff Method
1.4.1.2 Contact Method
1.4.2 Electro-Hydraulic Forming (EHF)
1.4.3 Electromagnetic Forming (EMF)
1.4.4 Peen Forming
1.4.5 Superplastic Forming
1.4.6 Thixo Forming
1.4.7 Ceramic Forming
1.4.8 Glass Forming
1.4.9 Incremental Sheet Metal Forming
1.5 Advanced Joining Techniques
1.5.1 Magnetic Pulse Welding
1.5.2 Friction Stir Welding
1.5.3 Explosive Welding
1.5.4 Electron Beam Welding
1.5.5 Laser Beam Welding
1.5.6 Microwave Welding
1.6 Advanced Composites Manufacturing Techniques
1.6.1 Fabrication Techniques for Polymer-Based Nanocomposites
1.6.2 Fabrication Techniques for Metal-Based Nanocomposites
1.6.2.1 Liquid-State Fabrication of MMC
1.6.2.2 Solid-State Fabrication of MMC
1.6.2.3 In Situ Fabrication of MMC
1.6.3 Fabrication Techniques for Ceramic-Based Nanocomposites
1.6.3.1 Polymer Infiltration and Pyrolysis (PIP)
1.6.3.2 Chemical Vapor Infiltration (CVI)
1.6.3.3 Liquid Silicon Infiltration (LSI)
1.6.3.4 Direct Melt Oxidation (DIMOX)
1.6.3.5 Sol-Gel Infiltration
1.6.3.6 Slurry Infiltration
1.7 Advanced Machining Techniques
1.7.1 Thermal-Assisted Techniques
1.7.2 Plasma-Assisted Machining
1.7.3 Laser-Assisted Machining
1.7.4 Electron Beam Assisted Machining
1.7.5 Ion Beam Machining
1.8 Advanced Finishing Techniques
1.9 Nanoparticles Production Techniques
1.10 Future of Advanced Manufacturing
References
2 Additive Manufacturing – “An Evolutionary Pace”
2.1 Background of Additive Manufacturing
2.2 Glimpse of Non-metal Additive Manufacturing Techniques
2.2.1 Stereolithography (STL)
2.2.2 Selective Laser Sintering (SLS)
2.2.3 Laminated Object Manufacturing (LOM)
2.2.4 Fused Deposition Modeling (FDM) or Fused Filament Fabrication (FFF)
2.2.5 Solid Ground Curing (SGC)
2.2.6 3D Ink-Jet Printing
2.2.7 Multi-Jet Modeling (MJM)
2.3 Advent of Metal Additive Manufacturing Techniques
2.4 Conceptual Realization of Metal Additive Manufacturing Techniques
2.4.1 Powder Bed Fusion Technique
2.4.2 Direct Energy Deposition Technique
2.4.3 Metal Binder Jetting Technique
2.4.4 Bound Powder Extrusion (Bound Powder Deposition) Technique
2.4.5 Wire Arc Additive Manufacturing Technique
2.4.6 Promising Applications of Metal 3D Printing
2.5 Future Directions
2.6 Summary
References
3 Advanced Machining in the Age of Nanotechnology
3.1 Nanotechnology in Current Millennium
3.2 Science of Nanoparticles
3.3 Glimpse of Nanoparticle Applications
3.4 Nanoparticles Production Techniques
3.4.1 Ball Milling
3.4.2 Wire Explosion
3.4.3 Inert Gas Condensation
3.4.4 Sputtering
3.4.5 Submerged Arc Nanoparticle Synthesis System (SANSS)
3.4.6 Combustion Flame
3.4.7 Plasma Processing
3.4.8 Spray Pyrolysis
3.4.9 Solution Precipitation
3.4.10 Sol-Gel Processing
3.4.11 Micro-Emulsion
3.4.12 Polyol Technique
3.4.13 Aerosol Synthesis
3.4.14 Chemical Vapor Condensation
3.4.15 Boiling Flask-3-Neck
3.4.16 Microu fl idic Reactor
3.5 Exploitation of Nanotechnology Concept in Advanced Machining
3.5.1 Pulsed Laser Ablation
3.5.2 Electrochemical (or Electrochemical Micromachining) Technique
3.5.3 Micro-Electrical Discharge Machining (Micro-EDM)
3.5.4 Micro-Electro Chemical Discharge Machining (Micro-ECDM)
3.6 Challenges of Nano-Based Manufacturing
3.7 Summary
References
4 Ultrafine Electronic Devices Manufacturing Techniques
4.1 Semiconductor
4.1.1 Semiconductor Doping
4.1.1.1 Diffusion Technique
4.1.1.2 Ion Implantation
4.2 Importance of Semiconductors
4.3 Materials
4.3.1 Silicon Wafer Fabrication
4.3.1.1 CZ Crystal Growing
4.3.1.2 Floating Zone
4.4 Measurement of Wafer Characteristic
4.4.1 Hot Point Probe
4.4.2 Four-Point Probe
4.4.3 Fourier Transform Infrared Spectroscopy
4.5 Oxidation
4.6 Deposition
4.6.1 Physical Vapor Deposition (PVD)
4.6.1.1 Evaporative Deposition
4.6.1.2 Electron Beam PVD
4.6.1.3 Sputtering
4.6.2 Chemical Vapor Deposition (CVD)
4.7 Lithography
4.7.1 Photolithography
4.8 Etching
4.8.1 Wet Etching
4.8.2 Dry Etching
4.8.2.1 Sputtering
4.8.2.2 Plasma Etching
4.8.2.3 Reactive Ion Etching
4.8.2.4 Cryogenic Dry Etching
4.9 Metallization
4.10 Wire Bonding
4.10.1 Ball or Capillary Bonding
4.10.2 Wedge Bonding
4.11 Packaging
4.11.1 Through Hole Mount Package
4.11.2 Surface Mount Package
4.11.3 Chip-Scale Package
4.11.3.1 Wafer Level Chip-Scale Package
4.11.3.2 Wire Bonded Ball Grid Array
4.11.3.3 Flip-Chip Ball Grid Array
4.12 MEMS Technology
4.12.1 Materials for MEMS
4.12.2 Fabrication Process
4.12.2.1 Bulk Micromachining
4.12.2.2 Surface Micromachining
4.12.2.3 LIGA
4.12.3 Application of MEMS
4.12.4 Issues of MEMS
4.12.5 Future of MEMS
4.13 NEMS Technology
4.13.1 Materials and Fabrication of NEMS
4.13.2 Application of NEMS
4.13.3 Future of NEMS
4.14 Summary
References
5 A New Vista of Manufacturing Technology for Industry 4.0
5.1 Background and Impact of Industrial Revolutions
5.2 Introduction to Industry 4.0
5.3 Transforming Landscape in Modern Manufacturing
5.4 Major Challenges
5.5 Case Study
5.6 Summary
References
Index
