Microsystems and Nanotechnology

Microsystems and Nanotechnology......Page 6
From the Editors......Page 8
Table of Contents......Page 12
Contributors......Page 26
Fundamentals of Microsystem and Nanotechnology......Page 30
1.1 Introduction......Page 32
1.2.1 Progress of CMOS Technology......Page 33
1.2.2 The Second-Order Effects in Small-Size MOSFETs......Page 34
1.2.3.1 New Structures for Nano-MOSFETs......Page 39
1.2.3.2 New Materials for CMOS......Page 41
1.2.4 High-Performance ULSI Interconnection......Page 42
1.3 Non-CMOS Nanoelectronic Devices......Page 43
1.3.1 Quantum-Resonant Tunneling Devices......Page 44
1.3.2 Single Electron Transistor......Page 47
1.3.3 Carbon NanoTubes (CNT) Electronics......Page 49
1.3.4 Spin Electronics......Page 51
1.3.5 Superconductor Electronics......Page 55
1.3.6 Molecular Electronics......Page 58
1.3.7 Nanoelectromechanical System (NEMS)......Page 60
1.4 Quantum Information Processing......Page 61
1.4.1 Basic Concept of Quantum Information Processing......Page 62
1.4.2 Energy Analysis of Quantum Computers......Page 64
1.4.3 Physical Realization of Quantum Computation......Page 67
References......Page 68
2 Micro/Nano Fluidics Mechanics and Transducers......Page 74
2.1 Introduction......Page 75
2.2 Physical Constants......Page 76
2.3 Fluidic Systems Based on Hydrodynamic Force......Page 79
2.4.1 Single Cell Manipulation......Page 80
2.5 Electrokinetic Force Fields......Page 81
2.5.2 Electroosmosis......Page 82
2.5.3 AC Electroosmosis......Page 83
2.5.5 Electrophoresis......Page 85
2.5.6 Dielectrophoresis......Page 86
2.6.1 Sample Concentration......Page 87
2.6.2 Mixing......Page 89
2.6.3 Separation......Page 90
2.6.4 Electrochemical DNA Detection......Page 91
2.6.5 Protein Detection......Page 93
2.7 Conclusions......Page 95
References......Page 96
3 Material Issues for Microsystems......Page 100
3.1.1.1 Brittle Fracture......Page 101
3.1.1.2 Fatigue Fracture......Page 102
3.1.2 Stiction, Friction, and Wear......Page 103
3.1.3 Fractograph Analysis......Page 104
3.2.1 Micro Tensile Testing......Page 105
3.2.3 Bulge Test......Page 108
3.2.4 Nanoindentation......Page 111
3.2.5 Beam Bending Test......Page 113
3.2.6 Test for Fatigue Characteristic and Fracture Toughness K1c of MEMS Materials......Page 115
3.3.1 Mechanical Properties of Silicon and Silicides......Page 118
3.3.1.1 Young’s Modulus of Silicon and Silicides......Page 121
3.3.1.2 Fracture Strength and Fracture Toughness of Silicon and Silicides......Page 124
3.3.1.3 Fatigue Property of Silicon......Page 126
3.3.2.1 Properties of Parylene......Page 128
3.3.2.3 Patterning of the Parylene Film[43]......Page 130
3.3.2.4 Parylene Film’s Application in Microsystems......Page 131
3.4.1 Self-Assembled Monolayer (SAM) Film......Page 134
3.4.1.1 Thiol-Based SAMs Film......Page 135
3.4.1.2 Silane-Based SAM Film......Page 136
3.4.2.1 Extra-Thin Diamond-Like Carbon (DLC)......Page 137
3.4.2.2 Ultra Thin Al2O3 Coating for Micro Structure with High Aspect Ratio......Page 138
References......Page 139
4.1.1 Crystal Structure of ZnO......Page 144
4.1.2 Piezoelectricity of ZnO Nanowire......Page 145
4.1.3 Combination of Piezoelectric and Semiconducting Properties......Page 149
4.2.1 PE-FET and Force Sensor......Page 151
4.2.2 Chemical/Humidity Nanosensors......Page 155
4.2.3 Mechanical-Electrical Strain Sensors......Page 157
4.3.1 Single Nanowire Nanogenerator......Page 161
4.3.2 Direct Current Nanogenerator......Page 164
4.3.3 Flexible Nanogenerator and Power Fiber......Page 169
4.4 Outlook......Page 173
References......Page 174
5.1 Electron Transport in Nanoscale Junctions......Page 178
5.2.1 Landauer Formula and Quantized Conductance......Page 180
5.2.3 Conductance of a Single Molecule......Page 181
5.3.1 Electron Tunneling in STM......Page 183
5.3.2 Scanning Tunneling Spectroscopy of Single Molecules......Page 184
5.4.1 Single Electron Phenomena......Page 186
5.4.2 The Atomic-Like State in Nanocrystal Quantum Dots......Page 187
5.4.3 SET in 3D Nanocluster and the Quantum Size Effect......Page 188
5.4.4 SET in 2D Nanoclusters and Nonclassical Capacitance......Page 189
5.4.5 Suppression of Quantum Confinement Effects in Amorphous Metal Nanoparticles......Page 190
5.4.6 Single Electron Tunneling in Single Molecules......Page 193
5.5.1 Aviram-Ratner Mechanism for a Single Molecule Rectifier......Page 195
5.5.2 Single Molecule Rectifier with AR Mechanism......Page 196
5.5.3 Single C59N Molecule as a Rectifier......Page 197
5.6.1 Resonant Tunneling and NDR Effect in Nanostructures......Page 198
5.6.2 NDR Effect Involving Two C60 Molecules......Page 200
5.6.4 Local Orbital Symmetry Matching Mechanism for NDR Effect......Page 201
5.7.2 Kondo Effect in Single Atoms Adsorbed on Surfaces......Page 203
5.7.3 Kondo Effect in Single Magnetic Molecules......Page 204
5.8.1 IETS of Single Molecules......Page 206
5.8.2 Spin-Flip Spectroscopy of Single Magnetic Atoms......Page 207
References......Page 209
Microsystem......Page 214
6.1 What is MEMS......Page 216
6.2 MEMS Technology......Page 217
6.2.2 Fundamental MEMS Techniques......Page 218
6.2.2.1 Bulk Micromachining......Page 219
6.2.2.2 Surface Micromachining......Page 220
6.2.2.4 Wafer Bonding......Page 222
6.3 A Brief History of MEMS......Page 223
6.3.2 The Beginning of Mechanical Miniaturization......Page 224
6.3.3 MEMS Applications and Prospects......Page 227
6.4.1 ‘Multidiscipline’ and ‘System’ as the Key Words......Page 228
6.4.2 Promising Future Directions......Page 229
References......Page 230
7.1 Introduction......Page 236
7.1.2 Chemical Sensors......Page 238
7.1.3 Biological Sensors......Page 239
7.2 Resonant Mechanical Sensors......Page 240
7.2.1 Resonant Pressure Sensors......Page 241
7.2.2 Resonant Accelerometers......Page 246
7.2.3 Resonant Gas Flow Sensors......Page 248
7.3.1 Sensing Principle......Page 250
7.3.2 Structure of MEMS EFS......Page 252
7.3.4 Testing and Characteristic......Page 255
7.4.1 Microhotplate Gas Sensor......Page 257
7.4.2 Microgas Sensor Array......Page 259
7.4.3 Nanofiber Based Gas Sensing Materials......Page 261
7.5 Waveguide-Based Nanoporous Thin-Film Sensors for Chemical, Biological and Gas Detection......Page 263
7.6.1 Ion-Sensitive Field Effect Transistor (ISFET) pH Sensors......Page 272
7.6.2 Hemoglobin Biosensors Based on ISFET......Page 276
7.6.3 Amperometric Immunosensors......Page 280
References......Page 283
8.1 Introduction......Page 290
8.2 MEMS Design Tools......Page 293
8.2.1 CAD Framework......Page 294
8.2.2 Analysis, Optimization and Fabrication Tools......Page 295
8.3 Bulk-Micromachining Based MEMS Design......Page 296
8.4 Surface-Micromachining Based MEMS Design......Page 304
8.5 Future Trends and Summary......Page 310
References......Page 311
9 MEMS Processing and Fabrication Techniques and Technology—Silicon-Based Micromachining......Page 316
9.1.1 Introduction......Page 317
9.1.2 Standard Surface Micromachining Technology and Multilayer Polysilicon......Page 319
9.1.3 Metallization......Page 320
9.1.3.1 Silicide......Page 321
9.1.3.2 Electroless Metal-Plated Capsulation......Page 325
9.1.4 Isolation......Page 327
9.1.5 Monolithic Integrated Surface Micromachining Technology......Page 334
9.1.6 3D Surface Maching......Page 337
9.1.7 Other Surface Micromachining Technology......Page 339
9.2 Bulk Micromachining......Page 343
9.2.1.1 Silicon Wet Etch......Page 344
9.2.1.2 DRIE: A Deep Silicon Etch Technique......Page 346
9.2.1.3 Wafer Bonding......Page 347
9.2.2 Sets of Bulk Micromaching Process......Page 348
9.2.3 Combining Wafer Bonding with DRIE......Page 349
9.2.3.1 Basic SOG Process......Page 350
9.2.3.2 SOG Process with Interconnection on Glass Substrate......Page 353
9.2.3.3 SOG Process with Isolation Structure......Page 354
9.2.4 SOI MEMS......Page 358
9.2.5 SCREAM......Page 362
9.2.6.1 Integrated SOI MEMS Technology......Page 364
9.2.6.2 CMOS MEMS Process with High-Aspect-Ratio Structure......Page 366
9.2.6.3 Integrated SCREAM Process......Page 367
9.2.6.4 IBMURIT......Page 368
References......Page 371
10 Optical MEMS and Nanophotonics......Page 382
10.1.1 Electrostatic Actuation......Page 383
10.1.2 Magnetic Actuation......Page 384
10.1.3 Thermal Actuation......Page 385
10.2.1.1 Texas Instruments’ Digital Micromirror Device (DMD)......Page 386
10.2.1.2 GLV Display......Page 388
10.2.1.3 Microvision Retinal Display......Page 389
10.2.1.4 OCT (Optical Coherence Tomography) and Confocal Microscopy......Page 390
10.2.1.5 Adaptive Optics......Page 396
10.2.1.6 Other Examples......Page 397
10.2.2.1 2D MEMS Switch......Page 398
10.2.2.2 3D MEMS Switch......Page 403
10.2.2.3 Wavelength-Selective Switches (WSS)......Page 407
10.2.2.4 Dynamic Sspectral Eequalizers......Page 413
10.2.2.5 Optical Attenuator......Page 414
10.2.2.6 Tunable WDM Devices......Page 416
10.2.2.7 Diffractive Optical MEMS......Page 419
10.2.2.8 Free-Sspace Ooptical Ccommunication......Page 421
10.2.3.1 Photonics Crystal Switches......Page 424
10.2.3.2 Superprism......Page 426
10.2.3.3 Waveguide-Based Switches......Page 428
10.2.3.4 Microdisk and Microring Optical Add-Drop Switches......Page 430
References......Page 432
11.1 Introduction......Page 444
11.2 MEMS Packaging Fundamentals......Page 445
11.3 Contemporary MEMS Packaging Approaches......Page 447
11.4.2 Anodic Bonding for MEMS Packaging Applications......Page 449
11.4.5 Solder Bonding......Page 452
11.4.6 Localized Heating and Bonding......Page 453
11.5.1 Integrated Micromachining Processes......Page 454
11.5.2 Post-Packaging Process......Page 457
11.5.3 Localized Heating and Bonding......Page 461
11.6 Packaging Reliability and Accelerated Testing......Page 463
11.7 Future Trends and Summary......Page 468
References......Page 470
Nanotechnology......Page 476
12.1 Introduction......Page 478
12.2 Fundamental Mechanism of Laser-Assisted Direct Imprinting (LADI)......Page 482
12.2.1 Elastodynamic Modeling of Imprinting Process......Page 483
12.2.2 Numerical Simulation Results......Page 486
12.2.3 Experimental Verification of LADI’s Mechanism......Page 488
12.3 Roller-Based Laser-Assisted Direct Imprinting......Page 492
12.3.1 Experimental Setup for Roller-Based LADI......Page 494
12.3.2 Experimental Results of Roller-Based LADI......Page 495
12.3.3 Analysis and Conclusion......Page 498
12.4.1 Direct Metal Film Patterning Using IR Laser Heating......Page 500
12.4.2 Experimental Details and Results......Page 502
12.4.3 Discussions......Page 508
12.5.1 Basic Idea and Experimental Setup......Page 509
12.5.2 Experimental Details and Results......Page 510
12.6 Conclusions and Future Perspectives......Page 516
References......Page 519
13.1 Introduction......Page 524
13.2 The Manipulation and Processing of Single Atoms and Molecules......Page 525
13.3 Nanolithography on Surfaces......Page 529
13.4 Nanoscale Surface Processing Based on Electrochemical Reactions......Page 531
13.5 Metal Nanostructures Fabricated with Field Evaporation......Page 532
13.6 Dip-pen Nanolithography......Page 533
13.7 Nanografting......Page 535
13.8 Nanoprocess with Heatable AFM Tips......Page 536
References......Page 537
14.1 Introduction......Page 542
14.2.1 Projection Printing EBL......Page 544
14.2.2 Direct Writing and Lift-Off Process......Page 546
14.3 Ion Beam Lithography (IBL)......Page 549
14.3.1 IBL Projection Printing......Page 550
14.3.2 FIBL Direct Writing/Milling......Page 552
14.3.3 FIBL Direct Writing/Implantation......Page 554
14.3.4 FIBL Direct Writing/Deposition......Page 555
14.4.1 Development of NIL......Page 558
14.4.2 Variations in NIL......Page 560
14.4.3 Critical Parameters and Challenges......Page 562
14.5.1 Nanoscale Manipulation......Page 564
14.5.2 Material Modification......Page 569
14.5.3 Material Deposition......Page 570
14.5.4 Material Removal and Etching......Page 572
14.6.1 Nanoscale Manipulation......Page 573
14.6.3 Material Oxidation......Page 576
14.6.4 Material Removal......Page 579
14.6.5 Parallel Processing......Page 583
14.7 Dip-Pen Nanolithography (DPN)......Page 584
14.7.1 Biological-Based Nanostructures by DPN......Page 585
14.7.2 DPN of Chemical Materials......Page 586
14.7.3 Parallel Processing of DPN......Page 588
14.8.1 Pattern Formation and Transfer Mediated by Self-Assembly......Page 589
14.8.2 Templated Self-Assembly Using Biological Structures......Page 590
14.8.3 Force Field Directed Self-Assembly......Page 591
14.9 Concluding Remarks......Page 593
References......Page 596
15.1.1 Review of MEMS Fabrication Technologies......Page 608
15.1.2 MEMS Techniques for Nanometric Fabrication......Page 612
15.1.3 Potential and Capability of MEMS for the Down-Scale Integration......Page 613
15.2 Technical Trend from MEMS to NEMS......Page 614
15.3 Integrated Nanomachining Technologies......Page 616
15.4 Nanoelectromechanical Size-Effect......Page 622
15.5 Typical MEMS-Made NEMS Devices......Page 628
15.6 Prospect of NEMS Technology......Page 631
References......Page 632
Application Issues......Page 636
16.1 Brief History and Trends of Microelectro-Mechanical System......Page 638
16.2 Application of MEMS......Page 642
16.3 An Important Opening Application Field-Bio-Medical Applications......Page 643
16.4 Applications of Implantable MEMS—Physical Therapy, Medical Care and Drug Developments......Page 644
References......Page 646
17.1.1 Microelectro-Mechanical Systems (MEMS)......Page 648
17.1.2 Microelectromechanical Sensor-Based System......Page 649
17.1.2.2 Multi-MEMS Sensor Information Fusion......Page 650
17.1.2.3 Integrated Design of Sensor-Based System......Page 651
17.1.2.4 Requirement for Functional Diversity......Page 652
17.1.3 Coordinate Relation of a Microelectromechanical Sensor-Based System......Page 653
17.2.1 Rotary Coordinate System......Page 654
17.2.2.1 Earth’s Magnetic Field......Page 658
17.2.2.2 Earth’s Gravity Field......Page 659
17.2.3 Determination of Attitude Angles by Using Outputs of Sensor Fixed on a Moving Object......Page 660
17.3 Attitude Estimation Algorithm of Multi-Sensor System......Page 662
17.4 Assembly Orthogonal Error Compensation Technology for Sensing System......Page 667
17.5 Microelectromechanical Sensor-Based Application Systems......Page 670
17.5.1 Airspeed Meter......Page 671
17.5.2 Digital Compass......Page 672
17.5.3 Microelectromechanical Attitude Measurement System......Page 674
17.5.4 Relationship Between Two Rotation Coordinate Systems, and Application of Cervical Vertebra Attitude Measurement......Page 676
17.5.5 Microautopilot......Page 677
17.6 Concluding Remarks......Page 678
References......Page 679
18 A Surface Micromachined Accelerometer with Integrated CMOS Detection Circuitry......Page 682
18.2 Background—Literature......Page 683
18.2.1 Accelerometer Theory......Page 684
18.2.1.1 Open-Loop Design......Page 685
18.2.1.2 Force-Balance Design......Page 690
18.2.1.3 Steady-State Response......Page 691
18.2.1.4 Comparisons......Page 692
18.2.1.5 Sensing Principles: Piezoresistive......Page 694
18.2.1.6 Sensing Principles: Capacitive......Page 695
18.2.1.7 Sensing Principles: Resonant......Page 696
18.2.1.9 Mechanical Modeling......Page 697
18.2.2 Accelerometer Modeling......Page 699
18.2.2.1 Noise Analysis......Page 700
18.2.3.1 Open-Loop Design......Page 703
18.3 Experimental Design: Accelerometer Design......Page 707
18.3.1 Sensing Element......Page 708
18.3.2 Mechanical Suspension......Page 709
18.3.3 Capacitive Bridge......Page 712
18.3.4 Input Buffer......Page 713
18.3.5.1 Feedthrough......Page 715
18.3.5.3 Simulation......Page 716
18.3.6 Electromechanical ∑-Δ Modulation......Page 718
18.3.6.1 Electromechanical ∑-Δ Modulctor......Page 719
18.4 Fabrication Technology......Page 724
18.4.1 Process Integration......Page 726
18.4.3 Tungsten Metallization......Page 728
18.4.3.1 Rapid Thermal Process......Page 729
18.4.3.2 Process Description......Page 730
18.5 Experimental Results......Page 734
18.5.2 Electrical and Mechanical Measurement......Page 738
18.5.3 Accelerometer Measurement—Static Response......Page 739
18.5.4 Dynamic Response......Page 740
18.5.5 Turnover Test......Page 741
18.6 Conclusions and Future Research......Page 742
18.6.1 Future Research......Page 743
References......Page 744
19.1 Overview of Automotive MEMS......Page 750
19.2.1 IC Technology......Page 755
19.2.3 Micromachining Technology......Page 756
19.2.3.4 Microelectroforming[16–18]......Page 757
19.2.4 Materials......Page 759
19.2.5 Packaging and Testing......Page 760
19.3 Automotive MEMS......Page 762
19.3.1 Pressure Sensor......Page 763
19.3.2 Accelerometer......Page 768
19.3.3 Solid-State Gyroscope......Page 771
19.3.4 Automotive Vision Assistant Detector Systems......Page 775
19.3.4.2 Thermal Infrared Detector......Page 777
19.3.5.1 Microswitch and Relay......Page 780
19.3.5.2 MEMS for Wireless Communication......Page 781
19.4 Concluding Remark......Page 782
References......Page 784
20.1 Introduction......Page 788
20.2 Historical Background and Present Condition......Page 790
20.3 Microarray Chip......Page 791
20.4.1.1 Fabricaiton of DNA Microarray Chip......Page 794
20.4.1.4 Fabrication of Cell Microarray Chip......Page 795
20.4.2 Detection Methods......Page 796
20.4.2.3 SPR Technology......Page 797
20.4.2.6 MALDI-TOF/MS Technology......Page 798
20.5 Sample Pretreatment Microfluidic Chip......Page 799
20.5.1.1 Method of Microfiltration......Page 800
20.5.1.2 Dielectrophoresis (DEP) Method......Page 803
20.5.1.4 Ultrasonic Technique......Page 804
20.5.2.3 Electronic-Based Lysis......Page 805
20.5.2.4 Thermal Lysis......Page 806
20.5.3 Solid Phase Extraction Chip (SPE-Chip)......Page 807
20.5.4.3 Liquid/Liquid Extraction (LLE)......Page 810
20.5.5 Mixing Biochip......Page 811
20.6 PCR Biochip......Page 812
20.7.1 Structure and Development......Page 816
20.7.2 Integrated CE Chip......Page 819
20.7.3 Application......Page 820
20.8.1 Gas Chromatography......Page 823
20.9 Microfluidic Hybridization and Immunoassay Biochips......Page 824
20.9.2 Microfluidic Immunoassay Biochip......Page 825
20.10.1 Introduction......Page 827
20.10.2 Application......Page 828
20.11.1 Substrate Material for Microfluidic Chip......Page 831
20.11.2.2 Processing Technology for Macromolecule Polymer Chip......Page 832
20.11.3 Liquid Pumping and Controlling Technology in TAS......Page 834
20.11.5 Special Problems in TAS Chips......Page 835
20.11.6.1 Optical Detection......Page 836
20.11.6.4 Nonlabel Detection......Page 837
References......Page 839
21.1 Introduction......Page 848
21.2.1 DNA/RNA Extraction and Purification......Page 851
21.2.2.1 Microfluidic Systems for PCR......Page 853
21.2.2.2 Reverse-Transcription Polymerase Chain Reaction......Page 856
21.2.2.3 Digital-Microfluidic PCR......Page 857
21.2.3.1 Microcapillary Electrophoresis Chips......Page 858
21.2.3.2 Capillary Electrophoresis Chips with Online Optical Detection Functions......Page 859
21.2.4 DNA Manipulation......Page 861
21.2.5.1 Cell Culture Chips......Page 863
21.2.5.2 Cell Sorting and Counting Chips......Page 864
21.2.6.1 Molecular Diagnosis of Pathogens......Page 866
21.2.6.2 On-Chip Immunoassay......Page 868
21.2.6.3 On-Chip Electrochemical Detection......Page 869
References......Page 871
22.1 Introduction: The Need for Microfluidic Platforms......Page 882
22.2.1 Lateral Flow Assays......Page 886
22.2.2 Unit Operations......Page 887
22.2.4 Strengths and Challenges of the Platform......Page 889
22.3 Microfluidic Large-Scale Integration (LSI)......Page 890
22.3.1 Unit Operations on the Platform......Page 891
22.3.2 Application Examples......Page 892
22.4 Centrifugal Microfluidics......Page 894
22.4.1 Unit Operations on the Platform......Page 895
22.4.2 Application Examples......Page 898
22.4.3 Strengths and Challenges of the Platform......Page 899
22.5 Electrokinetic Platforms......Page 900
22.5.1 Unit Operations on the Platform......Page 901
22.6 Droplet-Based Microfluidic Platforms......Page 903
22.6.1 Pressure-Driven Unit Operations and Applications......Page 904
22.6.2 Electrowetting-Driven Unit Operations and Applications......Page 907
22.6.3 Surface Acoustic Wave-Driven Unit Operations and Applications......Page 910
22.6.4 Strengths and Challenges of the Platform......Page 911
22.7.1 Unit Operations on the Platform......Page 912
22.7.2 Application Examples......Page 914
22.8 Conclusion......Page 916
References......Page 917
Development and Prospects......Page 926
23.1 Microsystems Technologies: MEMS and NEMS......Page 928
23.1.1 Micro- and Nano-Technologies......Page 929
23.1.2 Silicon Micromachining......Page 930
23.1.3 New Materials, New Technologies......Page 931
23.2.1 Introduction......Page 933
23.2.2 Comparison to Microelectronics......Page 934
23.2.3 The Systems Approach to MEMS......Page 936
23.2.4 Future Applications......Page 937
23.3.2 History and Our Experience......Page 938
23.3.3 My Vision......Page 942
23.4 Not Nearly Enough…Past Experience and Future Predictions for Emerging Micro-Nano Technologies......Page 943
23.4.1 Background Influences......Page 944
23.4.2 Basic Wisdoms......Page 945
Check if you are using the Appropriate Technology......Page 946
Don’t Waste Time and Money Re-proving Established Principles......Page 947
Always Design in a Healthy Safety Margin—Always have a ‘Plan B’......Page 948
Know When to Compute and When to Cut......Page 949
Failure is Rarely Due to a Single Cause......Page 950
‘Rogue’ Test Results will Tend to be Ignored for as Long as Possible......Page 951
Get Organised! …......Page 952
Beware of ‘Specification Creep’......Page 953
Money has the Power to Change the Most Inflexible Customer Specification......Page 954
23.4.4 Predicting the Future......Page 955
References......Page 957
Index Color Figures......Page 960