This is a textbook tutorial encompassing MEMS (micro-electromechanical systems), nanoelectronics, packaging, processing and materials characterization for developing miniaturized smart instruments for aerospace systems, satellites and satellite subsystems.
Author(s): H. Helvajian
Edition: First Edition
Publisher: AIAA
Year: 1999
Language: English
Pages: 709
Front Matter......Page 1
Acknowledgement......Page 6
Preface......Page 3
Table of Contents......Page 0
Table of Contents......Page 7
1.1 Overview......Page 8
1.2 Fabrication Technologies......Page 12
1.3 MEMS Components......Page 23
1.4 Commercial Applications......Page 30
1.5 Trends in MEMS Technology......Page 32
1.6 Journals and Conferences......Page 33
1.7 References......Page 34
2.1 Introduction......Page 36
2.2 Spacecraft Applications......Page 50
2.3 Silicon Satellites......Page 64
2.4 Manufacturing Future Space Systems......Page 67
2.5 Conclusions......Page 71
2.7 References......Page 72
3.1 Introduction......Page 80
3.2 Stress and Strain in MEMS......Page 82
3.3 Constitutive Relations......Page 85
3.4 Piezoelectricity......Page 93
3.5 Failure Theories......Page 94
3.6 Fracture Mechanics......Page 96
3.7 Mechanical Properties of MEMS Structures......Page 100
3.8 Fatigue......Page 107
3.9 Microstructure of MEMS Materials......Page 112
3.10 Other MEMS-Related Subjects......Page 114
3.11 Examples......Page 115
3.12 Future Challenges......Page 119
3.13 References......Page 121
4.2 Material Properties of SiC......Page 125
4.3 Thin Film Growth......Page 126
4.4 Processing Techniques......Page 129
4.5 Micromachining of SiC......Page 131
4.6 SiC-on-Insulator Technologies......Page 137
4.7 SiC Devices and Applications......Page 141
4.9 References......Page 146
5.1 Introduction......Page 151
5.2 Laser Processing......Page 153
5.3 Physical Principles of Laser Processing......Page 157
5.4 Supporting Systems in Laser Processing......Page 166
5.5 Utility and Limitations of Laser Processing......Page 170
5.6 Microengineering Applications......Page 172
5.7 A Case Study: Developing a PLD Materials-Processing Tool......Page 185
5.8 Conclusions and Brief Overview of Trends......Page 200
5.9 References......Page 201
6.1 Introduction......Page 206
6.2 Historical Development of Lithium Batteries......Page 207
6.3 The Li-ion Battery......Page 210
6.4 Plastic Li-ion Batteries......Page 222
6.5 Conclusion......Page 228
6.7 References......Page 229
7.1 Introduction......Page 232
7.2 Simulation Software......Page 233
7.3 Microsystem Fabrication Technologies......Page 238
7.4 Two Microsystem Investigation Examples at LAAS......Page 244
7.5 Reliability......Page 256
7.6 Conclusions......Page 261
7.8 References......Page 262
8.2 Basic Concepts......Page 264
8.3 Engineering Considerations for Packaging......Page 288
8.4 Advanced Approaches......Page 319
8.5 Conclusions......Page 347
8.6 References......Page 348
9.1 Introduction......Page 352
9.2 Principle of Operation......Page 356
9.3 Mechanical Structure......Page 360
9.4 Electrical Interface and Signal Processing......Page 375
9.5 Design Trade-offs......Page 388
9.6 Future of Micromachined Gyroscopes......Page 389
9.7 References......Page 390
10.1 Introduction......Page 393
10.2 MEMS-Based Monitoring System for Space Applications......Page 394
10.3 Macro System-Level Architecture......Page 395
10.4 The Plug-and-Play COTS Approach......Page 412
10.5 Wireless Integrated Network Sensors......Page 415
10.6 Design of a Microinstrumentation Cluster......Page 416
10.7 Fabrication and Testing of the Mu Cluster......Page 437
10.8 Appendixes......Page 444
10.9 References......Page 448
11.1 Introduction......Page 453
11.2 Chemical Microsensor Technologies......Page 463
11.5 References......Page 486
12.2 Fabrication Technology......Page 489
12.3 Sliders, Rotating Hubs, Microhinges, and Microlatches......Page 491
12.4 Actuators......Page 494
12.5 Micromirrors for Adaptive Optics......Page 499
12.6 Micromirrors for Beam Steering......Page 503
12.8 Fresnel Lens......Page 509
12.9 Gratings......Page 510
12.10 Microoptical Bench and Automated Assembly of Microsystems......Page 516
12.12 References......Page 519
13.1 Introduction......Page 523
13.2 Future Communication System Design Requirements......Page 525
13.3 Micropackage Fabrication and Testing Method......Page 529
13.4 Micropackaged High-Isolation Interconnects......Page 536
13.5 Conformally Micropackaged LNA......Page 543
13.6 Discrete Micromachined Packages......Page 546
13.7 Micromachined Filters for High-Density Integration......Page 550
13.8 Conclusions......Page 554
13.9 References......Page 555
14.1 Introduction......Page 557
14.2 Shear Stress Imager......Page 561
14.3 Shear Stress Measurements and Fluid/Actuator Interaction......Page 568
14.4 Integration......Page 574
14.5 Control......Page 575
14.6 Electronics......Page 579
14.8 References......Page 582
15.1 Introduction......Page 585
15.2 To Distribute or not to Distribute?......Page 588
15.3 Issues and Problems......Page 609
15.4 Generalized Analysis......Page 625
15.5 Conclusions......Page 636
15.6 References......Page 638
16.3 Calculation of Theoretical Performance......Page 640
16.4 Calculation of Thrust......Page 641
16.5 Propellant Characteristics......Page 643
16.6 Special Propellant Considerations for Microthrusters......Page 644
16.7 Propellants: Cold-Gas Systems_11......Page 645
16.8 Monopropellants......Page 646
16.9 Bipropellants......Page 648
16.10 Solid Propellants......Page 650
16.11 Propellant Delivery and Combustion Concepts......Page 651
16.13 Appendixes......Page 654
16.14 References......Page 657
17.1 Introduction......Page 659
17.2 Micronozzles......Page 665
17.3 Fluid Actuators......Page 670
17.4 Laser-Based Processing of Glass/Ceramic Materials......Page 673
17.5 Microthruster Fabrication......Page 676
17.6 Microthruster Performance......Page 686
17.7 Micropropulsion via Bioenergetic Decay Processes......Page 689
17.10 References......Page 694
C......Page 699
D......Page 700
I......Page 701
M......Page 702
P......Page 705
S......Page 707
T......Page 708
Y......Page 709
