Content: Analytical approaches and expert systems in the characterization of microelectronic devices / D.E. Passoja, Lawrence A. Casper, and A.J. Scharman --
Electrical characterization of semiconductor materials and devices / Dieter K. Schroder --
Dopant profiles by the spreading resistance technique / Robert G. Mazur --
Scanning electron microscopic techniques for characterization of semiconductor materials / Rodney A. Young and Ronald V. Kalin --
Semiconductor materials defect diagnostics for submicrometer very large scale integration technology / G.A. Rozgonyi and D.K. Sadana --
Applications of secondary ion mass spectroscopy to characterization of microelectronic materials / Mary Ryan-Hotchkiss --
Applications of Auger electron spectroscopy in microelectronics / Paul A. Lindfors, Ronald W. Kee, and Douglas L. Jones --
X-ray photoelectron spectroscopy applied to microelectronic materials / William F. Stickle and Kenneth D. Bomben --
Application of neutron depth profiling to microelectronic materials processing / R.G. Downing, J.T. Maki, and R.F. Fleming --
Thermal-wave measurement of thin-film thickness / Allan Rosencwaig --
Characterization of materials, thin films, and interfaces by optical reflectance and ellipsometric techniques / D.E. Aspnes --
Measurement of the oxygen and carbon content of silicon wafers by Fourier transform IR spectrophotometry / Aslan Baghdadi --
Application of the Raman microprobe to analytical problems of microelectronics / Fran Adar --
Characterization of gallium arsenide by magneto-optical photoluminescent spectroscopy / D.C. Reynolds --
Thermal-wave imaging in a scanning electron microscope / Allan Rosencwaig --
Fourier transform mass spectrometry in the microelectronics service laboratory / W.H. Penzel --
Materials characterization using elemental and isotopic analyses by inductively coupled plasma mass spectrometry / B. Shushan, E.S.K. Quan, A. Boorn, D.J. Douglas, and G. Rosenblatt --
Activation analysis of electronics materials / Richard M. Lindstrom --
Trace element survey analyses by spark source mass spectrography / Fredric D. Leipziger and Richard J. Guidoboni --
Characterization of components in plasma phosphorus-doped oxides / Jana Houskova, Kim-Khanh N. Ho, and Marjorie K. Balazs --
Process control of vacuum-deposited nickel-chromium for the fabrication of reproducible thin-film resistors / Vineet S. Dharmadhikari --
Characterization of spin-on glass films as a planarizing dielectric / Satish K. Gupta and Roland L. Chin --
Effects of various chemistries on silicon-wafer cleaning / D. Scott Becker, William R. Schmidt, Charlie A. Peterson, and Don C. Burkman --
Monitoring of particles in gases with a laser counter / C.E. Nowakowski and J.V. Martinez de Pinillos --
Microelectronics processing problem solving : the synergism of complementary techniques / J.N. Ramsey.
Author(s): Lawrence A. Casper (Eds.)
Series: ACS Symposium Series 295
Publisher: American Chemical Society
Year: 1986
Language: English
Pages: 449
City: Washington, DC
Title Page......Page 1
Half Title Page......Page 3
Copyright......Page 4
ACS Symposium Series......Page 5
FOREWORD......Page 6
PdftkEmptyString......Page 0
PREFACE......Page 7
1 Analytical Approaches and Expert Systems in the Characterization of Microelectronic Devices......Page 9
Problem Solving - A Look at Expert Systems......Page 13
Some Expert's Opinions......Page 14
Some Guidelines for Problem Solving(6)......Page 15
Some Features of the Analytical Image Space......Page 16
Geometric Elements and Physical Constraints......Page 17
Defects in an Oxide Film......Page 19
Analytical Requirements......Page 22
Conclusions......Page 23
Appendix......Page 24
2 Electrical Characterization of Semiconductor Materials and Devices......Page 26
Device Characteristics......Page 27
Resistivity......Page 29
C-V Profiling......Page 31
Secondary Ion Mass Spectroscopy......Page 32
Recombination-Generation Lifetime......Page 34
Deep Level Transient Spectroscopy......Page 37
Mobility......Page 39
Summary......Page 40
Literature Cited......Page 41
3 Dopant Profiles by the Spreading Resistance Technique......Page 42
The Spreading Resistance Technique......Page 43
Spreading Resistance Profile Accuracy......Page 50
Spreading Resistance Applications......Page 55
Literature Cited......Page 56
4 Scanning Electron Microscopic Techniques for Characterization of Semiconductor Materials......Page 57
Working Principle......Page 58
Beam-Specimen Interactions......Page 60
Imaging Techniques......Page 61
X-Ray Micro Analysis......Page 64
Electrical Techniques......Page 70
SEM's Role in VLSI Processing......Page 75
Literature Cited......Page 80
Optical Microscopy......Page 83
Preferential Etching......Page 87
Impurity Analysis in Semiconductor Matrices; Secondary Ion Mass Spectroscopy......Page 91
Transmission Electron Microscopy......Page 96
Conclusions......Page 102
Literature Cited......Page 103
6 Applications of Secondary Ion Mass Spectroscopy to Characterization of Microelectronic Materials......Page 104
SIMS INSTRUMENTS......Page 105
CHARACTERISTICS OF SIMS......Page 107
MODES OF SIMS ANALYSIS......Page 110
CONCLUSION......Page 121
Literature Cited......Page 122
7 Applications of Auger Electron Spectroscopy in Microelectronics......Page 126
Analysis Volume......Page 127
Detection Limits......Page 129
Preparation of Specimens......Page 132
Characterization of Physical Defects Such as Particles......Page 133
Lead Bonding......Page 136
Characterization of Thin Films......Page 138
Study of Si-Cr Thin Film Resistors......Page 140
Study of Defect Stringers Following Plasma Etching......Page 143
Future Uses of AES in Microelectronics......Page 145
Literature Cited......Page 148
8 X-ray Photoelectron Spectroscopy Applied to Microelectronic Materials......Page 152
X-Ray Photoelectron Spectroscopy......Page 154
Applications......Page 161
Literature Cited......Page 167
9 Application of Neutron Depth Profiling to Microelectronic Materials Processing......Page 171
Foundations of NDP......Page 172
Application......Page 177
Synergism......Page 182
Literature Cited......Page 185
10 Thermal-Wave Measurement of Thin-Film Thickness......Page 189
Literature Cited......Page 199
11 Characterization of Materials, Thin Films, and Interfaces by Optical Reflectance and Ellipsometric Techniques......Page 200
General Principles......Page 201
Examples......Page 203
Literature Cited......Page 214
12 Measurement of the Oxygen and Carbon Content of Silicon Wafers by Fourier Transform IR Spectrophotometry......Page 216
Oxygen and Carbon in Silicon......Page 217
Infrared Absorption Measurements......Page 223
Measurements of the Oxygen Content of Silicon Wafers......Page 229
Literature Cited......Page 234
13 Application of the Raman Microprobe to Analytical Problems of Microelectronics......Page 238
Microanalysis - Organic Contamination......Page 239
Stress in Laser Annealed Silicon on Silicon Qxide......Page 244
Other Areas of Applicability of the RMP......Page 245
Literature Cited......Page 246
14 Characterization of Gallium Arsenide by Magneto-optical Photoluminescent Spectroscopy......Page 248
Exciton Spectra......Page 249
Magneto-Optical Spectroscopy Techniques......Page 250
Identification of Donors in Doped GaAs......Page 256
Literature Cited......Page 259
15 Thermal-Wave Imaging in a Scanning Electron Microscope......Page 261
Experimental Configuration......Page 264
Conclusion......Page 272
Literature Cited......Page 274
16 Fourier Transform Mass Spectrometry in the Microelectronics Service Laboratory......Page 275
Equipment......Page 277
Applications......Page 279
Acknowledgments......Page 290
Literature Cited......Page 291
Instrumentation......Page 292
Results & Discussion......Page 294
Literature Cited......Page 301
18 Activation Analysis of Electronics Materials......Page 302
Basic Features of the Neutron Activation Method......Page 303
Step 1: Pretreatment of Samples......Page 308
Step 5: Chemistry......Page 309
Step 7: Calculation of Elemental Concentration......Page 310
Some Applications of NAA in Electronic Materials Studies......Page 311
Related Nuclear Analytical Techniques......Page 312
Literature Cited......Page 313
19 Trace Element Survey Analyses by Spark Source Mass Spectrography......Page 316
Instrument Design......Page 317
Sample Requirements......Page 319
Mass Spectra......Page 322
Application to Semiconductor Technology......Page 323
Literature Cited......Page 327
20 Characterization of Components in Plasma Phosphorus-Doped Oxides......Page 328
Literature Cited......Page 340
21 Process Control of Vacuum-Deposited Nickel-Chromium for the Fabrication of Reproducible Thin-Film Resistors......Page 341
Process Background and Requirements......Page 342
Process Development and Characterization......Page 343
Control Charts......Page 350
Process Influence and Improvements......Page 352
Literature Cited......Page 355
22 Characterization of Spin-On Glass Films as a Planarizing Dielectric......Page 357
Spin-On Dielectrics......Page 358
Results and Discussion......Page 360
Acknowledgments......Page 371
Literature Cited......Page 373
23 Effects of Various Chemistries on Silicon-Wafer Cleaning......Page 374
Contaminants......Page 375
Cleaning Chemistries......Page 376
Experimental Procedures......Page 378
Results and Discussion......Page 380
Literature Cited......Page 383
Laser Aerosol Spectrometer......Page 385
Pressure Reduction Diffuser......Page 386
Isokineticity Requirements......Page 391
Literature Cited......Page 404
25 Microelectronics Processing Problem Solving: The Synergism of Complementary Techniques......Page 406
Examples of Problem Solving by Molecular Analysis......Page 408
Acknowledgments......Page 429
Literature Cited......Page 432
Author Index......Page 434
A......Page 435
C......Page 436
D......Page 437
E......Page 438
G......Page 439
I......Page 440
M......Page 441
N......Page 442
P......Page 443
R......Page 444
S......Page 445
T......Page 447
X......Page 448
Y......Page 449
