When it comes to electronics, demand grows as technology shrinks. From consumer and industrial markets to military and aerospace applications, the call is for more functionality in smaller and smaller devices. Culled from the second edition of the best-selling Electronics Handbook, Microelectronics, Second Edition presents a summary of the current state of microelectronics and its innovative directions. This book focuses on the materials, devices, and applications of microelectronics technology. It details the IC design process and VLSI circuits, including gate arrays, programmable logic devices and arrays, parasitic capacitance, and transmission line delays. Coverage ranges from thermal properties and semiconductor materials to MOSFETs, digital logic families, memory devices, microprocessors, digital-to-analog and analog-to-digital converters, digital filters, and multichip module technology. Expert contributors discuss applications in machine vision, ad hoc networks, printing technologies, and data and optical storage systems. The book also includes defining terms, references, and suggestions for further reading. This edition features two new sections on fundamental properties and semiconductor devices. With updated material and references in every chapter, Microelectronics, Second Edition is an essential reference for work with microelectronics, electronics, circuits, systems, semiconductors, logic design, and microprocessors.
Author(s): Jerry C. Whitaker
Edition: 2nd
Publisher: CRC Press
Year: 2005
Language: English
Pages: 435
Microelectronics, Second Edition......Page 1
Preface......Page 5
Contributors......Page 6
Contents......Page 8
1.1 Introduction......Page 10
Elemental (IV–IV) Semiconductors......Page 11
Compound III–V Semiconductors......Page 12
Three-Dimensional Crystal Lattice......Page 13
Crystal Directions and Planes......Page 14
1.3 Energy Bands and Related Semiconductor Parameters......Page 15
Conduction and Valence Band......Page 16
Direct Gap and Indirect Gap Semiconductors......Page 17
Effective Masses of Carriers......Page 18
Intrinsic Carrier Densities......Page 19
Substitutional Dopants......Page 21
1.4 Carrier Transport......Page 23
Low Field Mobilities......Page 24
Saturated Carrier Velocities......Page 25
Point Defects......Page 27
Line Defects......Page 28
Surface Defects: The Reconstructed Surface......Page 29
Defining Terms......Page 30
Further Information......Page 32
2.2 Fundamentals of Heat......Page 34
Thermal Conductivity......Page 35
Gases......Page 36
Semiconductors......Page 37
2.4 Engineering Data......Page 38
Temperature Compensation......Page 39
Defining Terms......Page 40
Further Information......Page 41
Semiconductors......Page 42
3.2 Diodes......Page 43
Defining Terms......Page 44
Further Information......Page 45
4.1 Introduction......Page 46
Strong-Inversion Characteristics......Page 48
Threshold Voltage......Page 49
Driving Ability and ID,sat......Page 52
Transconductance......Page 54
Subthreshold Control......Page 55
Hot-Electron Effects......Page 56
Acknowledgments......Page 57
References......Page 58
Further Information......Page 59
5.2 High-Speed Design Techniques......Page 60
Clocks and Clock Schemes in High-Speed Circuit Design......Page 61
Asynchronous Circuits and Systems......Page 65
Interconnect Parasitics and Their Impact on High-Speed Design......Page 66
Defining Terms......Page 67
Further Information......Page 68
6.1 Introduction......Page 69
6.3 General Considerations in IC Design......Page 70
Device Scaling......Page 71
Geometric Design Rules......Page 72
6.4 Design of Small-Scale and Medium-Scale Integrated Circuits......Page 74
NMOS Inverters......Page 75
NMOS Gates......Page 77
CMOS Gates......Page 79
6.5 LSI and VLSI Circuit Design......Page 80
Multiphase Clocking......Page 81
6.6 Increasing Packing Density and Reducing Power Dissipation in MOS Circuits......Page 82
6.7 Gate Arrays......Page 83
Programmable Logic Array......Page 84
Resistance-Capacitance (RC) Delay Lines......Page 87
Superbuffers......Page 88
6.11 Output Buffers......Page 90
References......Page 91
Further Information......Page 92
7.1 Introduction......Page 93
7.2 Transistor-Transistor Logic......Page 94
7.3 CMOS Logic......Page 98
7.4 Emitter-Coupled Logic......Page 102
7.5 Programmable Logic......Page 105
Programmable Array Logic......Page 106
Field Programmable Gate Arrays and Complex PLDs......Page 107
Further Information......Page 109
8.1 Introduction......Page 111
Memory Hierarchy......Page 112
System Level Memory Organization......Page 113
Memory Device Organization......Page 114
Masked Read-Only Memory (ROM)......Page 115
Erasable Programmable Read-Only Memory (EPROM)......Page 116
Electrical Erasable Read-Only Memory (EEPROM)......Page 117
Flash-EEPROM......Page 118
Static Random Access Memory (SRAM)......Page 119
Direct Random Access Memory (DRAM)......Page 121
Content Addressable Memory (CAM)......Page 124
8.4 Interfacing Memory Devices......Page 125
Fast Page Mode (FPM) or Page Mode......Page 126
Nibble Mode......Page 127
Column Address Strobe (CAS) Before RAS Refresh (Self-Refresh)......Page 129
References......Page 130
Further Information......Page 131
9.2 Architecture Basics......Page 132
Complex Instruction Set Computer (CISC) and Reduced Instruction Set Computer (RISC) Processors......Page 133
Logical Similarity......Page 134
Short Chronology of Microprocessor Development......Page 136
The Motorola Family of Microprocessors......Page 138
RISC Processor Development......Page 139
Further Information......Page 140
10.2 D/A and A/D Circuits......Page 142
D/A Conversion Processes......Page 143
A/D Conversion Processes......Page 144
A/D Converter ICs......Page 145
Selection Criteria for D/A and A/D Converter ICs......Page 147
Defining Terms......Page 148
Further Information......Page 149
11.1 Introduction......Page 150
11.2 Full Custom ASICs......Page 151
Gate Arrays......Page 152
Standard Cells......Page 159
Functional Blocks......Page 162
Analog Arrays......Page 165
References......Page 166
Further Information......Page 167
Fundamentals......Page 168
Structures......Page 171
Design Techniques......Page 172
Multirate and Adaptive FIR Filters......Page 173
12.3 Infinite Impulse Response (IIR) Filters......Page 174
IIR Filter Design......Page 175
Analog Filters......Page 177
Butterworth Filters......Page 178
Chebyshev Filters (Type I Chebyshev Filters)......Page 179
Comparison......Page 180
Design Using Bilinear Transformations......Page 181
Design Example 2......Page 182
12.4 Finite Wordlength Effects......Page 183
Fixed-Point Quantization Errors......Page 184
Floating-Point Quantization Errors......Page 185
Roundoff Noise......Page 186
Limit Cycles......Page 187
Overflow Oscillations......Page 188
Coefficient Quantization Error......Page 189
Defining Terms......Page 190
References......Page 191
Further Information......Page 192
13.2 Multichip Module Technology Definitions......Page 193
13.3 Design, Repair, and Test......Page 200
13.4 When to Use Multichip Modules......Page 202
13.5 Issues in the Design of Multichip Modules......Page 203
Defining Terms......Page 204
Further Information......Page 205
14.2 Defect Types......Page 206
Traditional Faults and Fault Models......Page 207
Types of Test......Page 208
External Stored Response Testing......Page 209
BIST......Page 210
Scan......Page 211
IDDQ......Page 212
Defining Terms......Page 213
Further Information......Page 214
15.1 Discrete Semiconductor Failure Modes......Page 215
15.2 Integrated Circuit Failure Modes......Page 219
15.4 Memory IC Failure Modes......Page 221
15.5 IC Packages and Failures......Page 222
15.6 Lead Finish......Page 226
15.7 Screening and Rescreening Tests......Page 227
15.8 Electrostatic Discharge Effects......Page 228
Defining Terms......Page 230
References......Page 231
Further Information......Page 233
16.2 Defining a Computer Architecture......Page 234
16.3 Single Processor Systems......Page 235
16.4 Multiple Processor Systems......Page 239
16.5 Memory Hierarchy......Page 240
16.6 Implementation Considerations......Page 241
Technology Considerations......Page 243
Wafer Scale Integration (WSI)......Page 245
Defining Terms......Page 246
Magazines and Journals......Page 247
17.1 Introduction......Page 248
17.2 The Notion of Software......Page 249
17.3 The Nature of Software Engineering......Page 252
17.4 A New Approach......Page 256
17.5 Apollo On-Board Flight Software Effort: Lessons Learned......Page 257
17.6 Development Before the Fact......Page 259
17.8 Process......Page 262
17.9 Select the Right Paradigm and then Automate......Page 264
Defining Terms......Page 266
References......Page 267
Further Information......Page 268
18.2 Neuron cell......Page 269
18.3 Feedforward Neural Networks......Page 271
Correlation Learning Rule......Page 273
Widrow-Hoff LMS Learning Rule......Page 274
Linear Regression......Page 275
Delta Learning Rule......Page 276
Error Backpropagation Learning......Page 277
Functional Link Network......Page 279
Feedforward Version of the Counterpropagation Network......Page 280
WTA Architecture......Page 281
Cascade Correlation Architecture......Page 282
Radial Basis Function Networks......Page 283
Autoassociative Memory......Page 284
Bidirectional Associative Memories (BAM)......Page 285
Fuzzification......Page 286
Defuzzification......Page 287
Selection and Reproduction......Page 289
Reproduction......Page 290
Mutation......Page 291
References......Page 292
19.1 Introduction......Page 294
Relationship to Other Fields......Page 295
Imaging Geometry......Page 296
Sampling and Quantization......Page 297
Color Vision......Page 298
Triangulation......Page 299
19.3 Segmentation......Page 300
Gradient......Page 301
Laplacian of Gaussian......Page 302
Region Formation......Page 303
Other Segmentation Methods......Page 304
Polygonalization......Page 305
Feature Extraction......Page 306
Matching......Page 307
Template Matching......Page 308
Recognition System Components......Page 309
Constructive Solid Geometry......Page 310
Generalized Cone......Page 311
19.6 Dynamic Vision......Page 312
Difference Pictures......Page 313
Optical Flow......Page 314
Segmentation Using a Moving Camera......Page 315
Medical Image Analysis......Page 316
Industrial Inspection and Robotics......Page 317
References......Page 318
Further Information......Page 319
20.1 Introduction......Page 320
20.2 The Signal Subspace Approach......Page 321
20.3 Short-Term Spectral Estimation......Page 324
20.4 Multiple State Speech Model......Page 325
20.5 Second-Order Statistics Estimation......Page 326
20.6 Concluding Remarks......Page 328
Defining Terms......Page 329
21.2 Routing Algorithms......Page 331
Proactive Algorithms......Page 332
Reactive Algorithms......Page 334
Hybrid Algorithms......Page 335
21.3 Medium Access Protocols......Page 336
Protocols Categories......Page 337
IEEE 802.11......Page 339
Bluetooth......Page 340
Other Protocols......Page 341
21.4 TCP over Ad Hoc Networks......Page 343
MAC Layer Impact......Page 344
Ad Hoc TCP......Page 345
21.5 Capacity of Ad Hoc Networks......Page 346
IEEE802.11......Page 347
Increasing the Capacity of Ad Hoc Networks......Page 348
References......Page 349
Use of Top-Down Business Oriented Approach......Page 353
Use of Open Systems Interconnection (OSI) Model......Page 355
Differentiation Among Major Categories of Networking......Page 356
Physical Topologies......Page 357
User Issues......Page 358
Local Communication......Page 359
File Sharing and Application Sharing......Page 360
Anticipated Growth is Key......Page 361
Network Printing......Page 362
Network Management......Page 363
Local Area Network Architectures......Page 364
FDDI......Page 365
Servers......Page 366
Concentrators......Page 367
Applications: What Can Internetworking Do for You?......Page 368
The OSI Model and Internetworking Devices......Page 370
Bridge Functionality......Page 371
Bridge Categorization......Page 372
Router Functionality......Page 373
Determination of Best Path......Page 374
Wide Area Network Architecture......Page 375
Packet Switching......Page 376
Defining Terms......Page 378
References......Page 379
Further Information......Page 380
Resolution and Addressability......Page 381
Grayscale......Page 382
23.2 Printing Technologies......Page 383
Continuous Ink Jet......Page 384
Drop On Demand (DOD) Ink Jet......Page 385
Thermal Ink Jet/Bubble Jet DOD Printers......Page 386
Piezoelectric DOD Printers......Page 387
Grayscale Methods for DOD Ink Jet Printers......Page 389
Ink and Paper for Ink Jet Devices......Page 390
Direct Thermal......Page 391
Resistive Ribbon Thermal Transfer......Page 392
Printing Process Steps......Page 393
23.6 Magnetographic and Ionographic Technologies......Page 395
23.7 System Issues......Page 396
Color Management......Page 397
References......Page 398
Further Information......Page 399
RAID Elements......Page 400
RAID Level 0......Page 401
RAID Level 2......Page 402
RAID Level 3......Page 403
RAID Level 5......Page 404
Other RAID Levels......Page 405
Further Information......Page 406
25.2 The Optical Head......Page 407
The Servosystem......Page 409
Optical Recording and Read Channel......Page 411
Phase-Change Recording......Page 413
25.4 Magneto-Optic Technology......Page 414
25.5 Compact Disk-Recordable (CD-R)......Page 416
Recording Modes of CD-R......Page 417
Disks......Page 418
Applications of Optical Library Systems......Page 419
Future Technology and Improvements in Optical Storage......Page 421
References......Page 422
Further Information......Page 423
26.1 Background......Page 424
26.2 Introduction......Page 425
26.4 Code Families......Page 426
26.5 Linear Block Codes......Page 427
Decoding Linear Block Codes......Page 428
26.6 Convolutional Codes......Page 429
Turbo Codes......Page 431
26.8 Applications......Page 432
Defining Terms......Page 433
Further Information......Page 434
