Cambridge, UK: Woodhead Publishing, 2014. - 634 p.
Metallic films are critical components in many of the modern technologies important to our daily lives, including integrated circuits, information storage systems, displays and sensors. These technologies require exploitation of the electronic, magnetic, optical, mechanical and thermal properties unique to metallic materials. This book brings together a series of chapters on the structure, processing and properties of metallic films by authorities in the field that review the fundamentals and summarize the latest research findings. The book addresses techniques for structure characterization by X-ray scattering
(diffraction) as well as by electron scattering-based crystal orientation mapping in scanning and transmission electron microscopes. The evolution of grain structure during deposition and upon post-deposition coarsening is addressed in two separate chapters. Three of the chapters address phase transformations and reactions in the context of their respective technology applications. The remaining chapters review the fundamental mechanical, electrical, magnetic, optical and thermal properties of modern metallic films, and how these differ from the properties of bulk metals. The book should serve well as a textbook in advanced undergraduate or first-year graduate courses on thin films and as a reference for practicing engineers and scientists.
X-ray diffraction for characterizing metallic films
Crystal orientation mapping in scanning and transmission electron microscopes
Structure formation during deposition of polycrystalline metallic thin films
Post-deposition grain growth in metallic films
Fabrication and characterization of reactive multilayer films and foils
Metal silicides in advanced complementary metaloxide-semiconductor (CMOS) technology
Metallic thin films: stresses and mechanical properties
Electron scattering in metallic thin films
Optical properties of metallic films
Thermal properties of metallic films
Index