Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics.A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices!Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses:Soldering inspection and designMechanical evaluation in electronics Lead-free solder paste and reflow solderingWave solderingPlating lead-free soldering in electronicsLead-Free Soldering in Electronics will benefit manufacturing, electronics, and mechanical engineers, as well as undergraduate and graduate students in these disciplines.
Author(s): Katsuaki Suganuma
Edition: 1
Year: 2003
Language: English
Pages: 376
Foreword......Page 4
Preface......Page 6
Contents......Page 8
Contributors......Page 10
Introduction to Lead-Free Soldering Technology......Page 12
Materials Science Concepts in Lead-Free Soldering......Page 30
Alloy Selections......Page 60
Plating Lead-Free Soldering in Electronics......Page 102
Tin Whisker Discovery and Research......Page 132
Mechanical Evaluation in Electronics......Page 194
Electrochemical Migration......Page 230
Lead-Free Solder Paste and Reflow Soldering......Page 254
Wave Soldering......Page 282
Soldering Inspection and Design for Lead-Free Solder: Soldering Innovation by Trinity of Design, Process, and Inspection......Page 298
Future of Lead-Free Soldering......Page 340
Index......Page 350
