Hot Embossing: Theory and Technology of Microreplication

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This book is an overview of replication technology for micro- and nanostructures, focusing on the techniques and technology of hot embossing, a scaleable and multi-purpose technology for the manufacture of devices such as BioMEMS and microfluidic devices which are expected to revolutionize a wide range of medical and industrial processes over the coming decade.

The hot embossing process for replicating microstructures was developed by the Forschungszentrum Karlsruhe (Karlsruhe Institute of Technology) where the author is head of the Nanoreplication Group. Worgull fills a gap in existing information by fully detailing the technology and techniques of hot embossing.  He also covers nanoimprinting, a process related to hot embossing, with examples of actual research topics and new applications in nanoreplication.

*A practical and theoretical guide to selecting the materials, machinery and processes involved in microreplication using hot embossing techniques.

*Compares different replication processes such as: micro injection molding, micro thermoforming, micro hot embossing, and nanoimprinting

*Details commercially available hot embossing machinery and components like tools and mold inserts

Author(s): Matthias Worgull
Series: Micro and Nano Technologies
Publisher: William Andrew
Year: 2009

Language: English
Pages: 368
Tags: Специальные дисциплины;Наноматериалы и нанотехнологии;Технологии получения наноматериалов и наноструктур;

Micro & Nano Technologies......Page 2
Copyright......Page 3
Dedication......Page 4
Series Editor's Preface......Page 5
Preface......Page 6
Acknowledgment......Page 8
Introduction......Page 9
Replication Processes......Page 21
Molding Materials for Hot Embossing......Page 64
Molded Parts......Page 120
Hot Embossing Process......Page 144
Modeling and Process Simulation......Page 185
Hot Embossing Technique......Page 232
Hot Embossing Tools......Page 251
Microstructured Mold Inserts for Hot Embossing......Page 287
Hot Embossing in Science and Industry......Page 311
Index......Page 345