High-Speed Circuit Board Signal Integrity (Artech House Microwave Library (Hardcover))

This document was uploaded by one of our users. The uploader already confirmed that they had the permission to publish it. If you are author/publisher or own the copyright of this documents, please report to us by using this DMCA report form.

Simply click on the Download Book button.

Yes, Book downloads on Ebookily are 100% Free.

Sometimes the book is free on Amazon As well, so go ahead and hit "Search on Amazon"

This engineering reference book covers the theoretical and practical aspects of high-speed digital signalling at the level of the printed circuit board.

Author(s): Stephen C. Thierauf
Year: 2004

Language: English
Pages: 264

TeamLiB......Page 0
Cover......Page 1
Contents......Page 8
Preface......Page 14
1.2 Unit System 1......Page 15
1.3 PWB Construction 2......Page 16
1.4 PWB Traces 7......Page 21
1.5 Vias 10......Page 24
1.7 Summary 14......Page 28
2.2 Resistance at Low Frequencies 17......Page 31
2.3 Loop Resistance and the Proximity Effect 20......Page 34
2.4 Resistance Increase with Frequency: Skin Effect 24......Page 38
2.5 Hand Calculations of Frequency-Dependent Resistance 27......Page 41
2.6 Resistance Increase Due to Surface Roughness 29......Page 43
2.7 Summary 30......Page 44
3.2 Capacitance and Charge 31......Page 45
3.3 Parallel Plate Capacitor 33......Page 47
3.4 Self and Mutual Capacitance 35......Page 49
3.5 Capacitance Matrix 37......Page 51
3.6 Dielectric Losses 39......Page 53
3.7 Environmental Effects on Laminate er and Loss Tangent 43......Page 57
3.8 Summary 45......Page 59
4.2 Field Theory 47......Page 61
4.3 Circuit Behavior of Inductance 51......Page 65
4.5 Mutual Inductance 55......Page 69
4.6 Hand Calculations for Inductance 60......Page 74
4.7 Summary 64......Page 78
5.2 General Circuit Model of a Lossy Transmission Line 67......Page 81
5.3 Impedance 71......Page 85
5.4 Traveling Waves 73......Page 87
5.5 Summary and Worked Examples 82......Page 96
6.2 Proper Return Paths 87......Page 101
6.3 Stripline Routed Between Power and Ground Planes 90......Page 104
6.4 Split Planes, Motes, and Layer Changes 95......Page 109
6.5 Connectors and Dense Pin Fields 98......Page 112
6.6 Power Supply Bypass/Decoupling Capacitance 105......Page 119
6.7 Connecting to Decoupling Capacitors 112......Page 126
6.8 Summary 114......Page 128
7.2 Harmonic Contents of a Data Stream 117......Page 131
7.3 Line Codes 125......Page 139
7.4 Bit Rate and Data Rate 126......Page 140
7.5 Block Codes Used in Serial Transmission 128......Page 142
7.6 ISI 130......Page 144
7.7 Eye Diagrams 132......Page 146
7.8 Equalization and Preemphasis 134......Page 148
7.9 DC-Blocking Capacitors 140......Page 154
7.10 Summary 145......Page 159
8.2 Odd and Even Modes 149......Page 163
8.3 Multiconductor Transmission Lines 158......Page 172
8.4 Differential Signaling, Termination, and Layout Rules 165......Page 179
8.5 Crosstalk 173......Page 187
8.6 Summary 182......Page 196
9.2 Stripline 185......Page 199
9.3 Microstrip 193......Page 207
9.4 Losses in Stripline and Microstrip 197......Page 211
9.5 Microstrip and Stripline Differential Pairs 201......Page 215
9.6 Summary 206......Page 220
10.2 Ceramic Surface Mount Capacitors 209......Page 223
10.3 SMT Tantalum Capacitors 223......Page 237
10.4 Replacing Tantalum with High-Valued Ceramic Capacitors 228......Page 242
Appendix: Conversion Factors......Page 245
About the Author......Page 247
Index......Page 249