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Handbook of Multilevel Metallization for Integrated Circuits - Materials, Technology, and Applications

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This book answers an important need by pulling together in one volume a thorough technical summary of each of the key areas that make up a multilevel metal system. Included are associated design, analysis, materials, and manufacturing topics. It functions as a good learning tool for the engineer newly assigned to work in metallization. It also serves as a reference text for any MLM engineer, new or experienced, who wishes to refresh their memory. For someone who wants to further specialize in one topical area, an extensive listing of references has been provided.

Author(s): Wilson, S.R.; Tracy, C.J.; Freeman, J.L., Jr.(eds.)
Publisher: William Andrew Publishing/Noyes
Year: 1993

Language: English
Commentary: 576
Pages: 887
Tags: Приборостроение;Полупроводниковые приборы;Интегральные схемы;


Content:
• Front Matter
• Preface
• Table of Contents
1. Introduction
2. Silicides and Contacts for ULSI
3. Aluminum Based Multilevel Metallizations in VLSI/ULSICs
4. Inorganic Dielectrics
5. Organic Dielectrics in Multilevel Metallization of Integrated Circuits
6. Planarization Techniques
7. Lithography and Etch Issues for a Multilevel Metallization System
8. Electro- and Stress-Migration in MLM Interconnect Structures
9. Multilevel Metallization Test Vehicle
10. Manufacturing and Analytic Methods
11. Characterization Techniques for VLSI Multilevel Metallization
12. Electronic Packaging and its Influences on Integrated Circuit Design and Processing
13. Future Interconnect Systems
• Index