Fracture Mechanics of Piezoelectric and Ferroelectric Solids presents a systematic and comprehensive coverage of the fracture mechanics of piezoelectric/ferroelectric materials, which includes the theoretical analysis, numerical computations and experimental observations. The main emphasis is placed on the mechanics description of various crack problems such static, dynamic and interface fractures as well as the physical explanations for the mechanism of electrically induced fracture.
The book is intended for postgraduate students, researchers and engineers in the fields of solid mechanics, applied physics, material science and mechanical engineering.
Dr. Daining Fang is a professor at the School of Aerospace, Tsinghua University, China; Dr. Jinxi Liu is a professor at the Department of Engineering Mechanics, Shijiazhuang Railway Institute, China.
Author(s): Daining Fang, Jinxi Liu (auth.)
Edition: 1
Publisher: Springer-Verlag Berlin Heidelberg
Year: 2013
Language: English
Pages: 417
Tags: Continuum Mechanics and Mechanics of Materials; Characterization and Evaluation of Materials; Mechanical Engineering
Front Matter....Pages N1-xii
Introduction....Pages 1-7
Physical and Material Properties of Dielectrics....Pages 9-32
Fracture of Piezoelectric/Ferroelectric Materials — Experiments and Results....Pages 33-76
Basic Equations of Piezoelectric Materials....Pages 77-95
General Solutions to Electromechanical Coupling Problems of Piezoelectric Materials....Pages 97-124
Fracture Mechanics of Homogeneous Piezoelectric Materials....Pages 125-160
Interface Fracture Mechanics of Piezoelectric Materials....Pages 161-181
Dynamic Fracture Mechanics of Piezoelectric Materials....Pages 183-234
Nonlinear Fracture Mechanics of Ferroelectric Materials....Pages 235-292
Fracture Criteria....Pages 293-311
Electro-elastic Concentrations Induced by Electrodes in Piezoelectric Materials....Pages 313-341
Electric-Induced Fatigue Fracture....Pages 343-376
Numerical Method for Analyzing Fracture of Piezoelectric and Ferroelectric Materials....Pages 377-416
Back Matter....Pages 417-417
