product iamge

Failure Analysis

This document was uploaded by one of our users. The uploader already confirmed that they had the permission to publish it. If you are author/publisher or own the copyright of this documents, please report to us by using this DMCA report form.

Download
Search on Amazon

Simply click on the Download Book button.

Yes, Book downloads on Ebookily are 100% Free.

Sometimes the book is free on Amazon As well, so go ahead and hit "Search on Amazon"

The book presents a unique view of failure analysis of high technology devices. It describes capabilities and limitations of many analytical techniques and testing paths and decisions best followed in example failure analysis studies.

Author(s): Daniel J D Eric J Sullivan Carleton
Publisher: De Gruyter
Year: 2022

Language: English
Pages: 130
City: Berlin

Contents
Chapter 1 Introduction to FA
Chapter 2 Why is FA important?
Chapter 3 Planning out an FA
Chapter 4 Typical types of failure mechanisms
Chapter 5 Destructive versus nondestructive analysis
Chapter 6 Optical Microscopy (OM)
Chapter 7 Scanning Acoustic Microscopy/Tomography (SAM or SAT)
Chapter 8 X-ray imaging (2D and 3D)
Chapter 9 Time Domain Reflectometry (TDR)
Chapter 10 Selecting the path before destructive analysis begins
Chapter 11 Destructive work
Chapter 12 Electrical Failure Analysis (EFA)
Chapter 13 EMMI/OBIRCH/IR
Chapter 14 Cross sections (X-sections)
Chapter 15 Parallel lapping (p-lap)
Chapter 16 Focused Ion Beam (FIB)
Chapter 17 Scanning Electron Microscopy (SEM)
Chapter 18 Transmission Electron Microscopy (TEM)
Chapter 19 Energy Dispersive X-ray spectroscopy (EDX)
Chapter 20 Use of additional materials analytical techniques and processes
Chapter 21 How should these results be used?
References
Appendix
List of figures
Index