Microcomponents and microdevices are increasingly finding application in everyday life. The specific functions of all modern microdevices depend strongly on the selection and combination of the materials used in their construction, i.e., the chemical and physical solid-state properties of these materials, and their treatment. The precise patterning of various materials, which is normally performed by lithographic etching processes, is a prerequisite for the fabrication of microdevices. The microtechnical etching of functional patterns is a multidisciplinary area, the basis for the etching processes coming from chemistry, physics, and engineering. The book is divided into two sections: the wet and dry etching processes are presented in the first, general, section, which provides the scientific fundamentals, while a catalog of etching bath composition, etching instructions, and parameters can be found in the second section. This section will enhance the comprehension of the general section and also give an overview of data that are essential in practice.
Author(s): Michael Kohler
Year: 1999
Language: English
Pages: 387
Tags: Приборостроение;Микро- и наносистемная техника;
Etching in Microsystem Technology......Page 2
Table of Contents......Page 10
Preface......Page 8
Symbols......Page 14
Abbreviations......Page 18
1 Introduction......Page 20
2.1 Etching as a Fashioning Method......Page 24
2.1.2 Subtractive Pattern Generation......Page 25
2.2.2 The Etching Process......Page 28
2.2.3 Transport Processes......Page 29
2.2.4 Process Velocities......Page 30
2.3. Isotropic and Anisotropic Etching......Page 33
2.4.2 Flank Geometry in Isotropic Etching......Page 37
2.4.3 Fabrication of Low Slope Angles by Isotropic Etching......Page 38
2.4.4 Flank Geometries in Anisotropic Etching......Page 40
2.4.5 Setting the Flank Geometry by Partial Anisotropic Etching......Page 42
2.5 Accuracy......Page 43
2.6 Monitoring of Etching Processes......Page 45
3.1 Etching at the Interface Solid-Liquid......Page 48
3.2.1 Surface Condition......Page 49
3.2.2 Cleaning......Page 51
3.2.3 Digital Etching......Page 53
3.3.1 Wet Etching by Physical Dissolution......Page 54
3.3.2 Wet-Chemical Etching of Non-Metals......Page 56
3.4.1 Outer-Currentless Etching......Page 60
3.4.2 Selectivity in Outer-Currentless Etching......Page 72
3.4.3 Etching of Multilayer Systems Forming Local Elements......Page 79
3.4.4 Geometry-Dependent Etch Rates......Page 81
3.4.5 Geometry-Dependent Passivation......Page 88
3.4.6 Electrochemical Etching......Page 91
3.4.7 Photochemical Wet Etching......Page 98
3.4.8 Photoelectrochemical Etching (PEC)......Page 99
3.5.1 Chemical Wet-Etching of Monocrystalline Surfaces......Page 103
3.5.2 Anisotropic Etching of Monocrystalline Metals......Page 106
3.5.3 Anisotropic Etching of Silicon......Page 107
3.5.4 Anisotropic Electrochemical and Photoelectrochemical Etching......Page 117
3.5.5 Porous Silicon......Page 119
3 S.6 Anisotropic Etching of Compound Semiconductors......Page 122
3.6.1 Surface Micromachining......Page 124
3.6.2 Bulk Micromachining......Page 126
3.6.3 Porous Silicon as Sacrificial Material......Page 128
4.1 Removal at the Interface Solid-Gas......Page 130
4.2.1 Plasma-Free Dry-Etching with Reactive Gases......Page 135
4.2.2 Photo-Assisted Dry Etching with Reactive Gases......Page 137
4.2.3 Directly Writing Micropatterning by Laser Scanning Etching......Page 138
4.2.4 Electron-Beam-Assisted Vapour Etching......Page 139
4.3.1 Material Removal by Reactions with Plasma Species......Page 141
4.3.2 Plasma Generation......Page 144
4.3.3 Plasma Etching in the Barrel Reactor......Page 146
4.3.4 Plasma Etching in the Down-Stream Reactor......Page 147
4.3.5 Plasma Etching in the Planar-Plate Reactor......Page 148
4.3.7 Plasma Etching at Low Pressure and High Ion Density......Page 149
4.3.9 Geometry Influence on Plasma Etching......Page 150
4.3.11 Applications of Plasma Etching......Page 152
4.4.1 Sputter-Etching......Page 156
4.4.2 Reactive Ion Etching (RIE)......Page 163
4.4.4 Ion Beam Etching (IBE)......Page 169
4.4.5 Reactive Ion Beam Etching (RIBE)......Page 174
4.4.7 Chemically-Assisted Ion Beam Etching (CAIBE)......Page 175
4.4.8 Reactive Etching with Excitation from Several Sources......Page 176
4.4.9 Electron-Beam-Supported Reactive Ion Etching (EBRE)......Page 177
4.4.10 Focussed Ion Beam Etching (FIB)......Page 178
4.4.11 Nanoparticle Beam Etching (NPBE)......Page 179
4.4.12 Formation of the Structure Sidewall Geometry in Ion Beam Etching......Page 180
4.4.13 Material Defects in Etching with Energized Particles......Page 187
4.4.14 Application of Etching Methods with Energized Particles......Page 188
5.2 Inorganic Resists......Page 192
5.3 Etching of Photosensitive Glasses......Page 193
5.4 Etching of Photo-Damaged Areas......Page 194
5.6 Particle Trace Etching......Page 195
6.1 Explaining the Collection of Recipes......Page 198
6.2 Collection of Recipes......Page 200
References......Page 364
Index......Page 380
