Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems. Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration). Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis. Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.
Author(s): Yi-Kan Cheng, Ching-Han Tsai, Chin-Chi Teng, Sung-Mo (Steve) Kang
Edition: 1
Publisher: Springer
Year: 2000
Language: English
Pages: 210
Preliminaries......Page 1
Contents......Page 6
List of Figures......Page 10
List of Tables......Page 16
Preface......Page 18
Acknowledgments......Page 22
1. INTRODUCTION......Page 28
2. POWER ANALYSIS FOR CMOS CIRCUITS......Page 46
3. TEMPERATURE-DEPENDENTMOS DEVICE MODELING......Page 70
4. THERMAL SIMULATION FOR VLSI SYSTEMS......Page 86
5. FAST-TIMING ELECTROTHERMAL SIMULATION......Page 120
6. TEMPERATURE-DEPENDENT ELECTROMIGRATION RELIABILITY......Page 146
7. TEMPERATURE-DRIVEN CELL PLACEMENT......Page 182
8. TEMPERATURE-DRIVEN POWER AND TIMING ANALYSIS......Page 206
Index......Page 230
