This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the book. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter "mounting defects" shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students.
Author(s): Oommen Tharakan Kuttiyil Thomas, Padma Padmanabhan Gopalan
Series: Springer Tracts in Electrical and Electronics Engineering)
Publisher: Springer
Year: 2022
Language: English
Pages: 154
City: Singapore
Foreword
Preface
The Book
The Purpose
Book Outline
Acknowledgements
Contents
About the Authors
Abbreviations
1 Introduction
1.1 Organization of the Book
Reference
2 Soldering Defects
2.1 Introduction
2.2 Importance of Soldering
2.3 Soldering Process
2.4 Wetting and Dihedral Angle
2.5 Solder Paste
2.5.1 General Flux Formulations
2.6 Reflow Profile
2.7 Guidelines for Production Flow of Electronic Packages
2.8 Soldering Defects
2.8.1 Group 1: Dewetting
2.8.2 Group 2: Demarcation
2.8.3 Group 3: Solder Bridging
2.8.4 Group 4: Excess Solder
2.8.5 Group 5: Overheated Joint
2.8.6 Group 6: Improper Solder Filleting
2.8.7 Group 7: Solder Starved
2.8.8 Group 8: Flux Residue
2.8.9 Group 9: Peel off
2.8.10 Group 10: Solder Balls
2.8.11 Group 11: Solder Bump
2.8.12 Group 12: Offset in Soldering
2.8.13 Group 13: Blow Hole
2.8.14 Group 14: Cold Joint
2.8.15 Group 15: Solder Spreading
2.8.16 Group 16: Fractured Solder Joint
2.8.17 Group 17: Overhang
2.8.18 Group 18: Multiple Soldering
2.8.19 Group 19: Component Tilt
2.8.20 Group 20: Poor Solder
2.8.21 Group 21: Solder Miss
2.8.22 Group 22: Open Joint
References
3 PCB Defects
3.1 Introduction
3.2 PCB Materials
3.3 Quality Control of PCBs
3.3.1 PCB Qualification and Evaluation
3.3.2 Microsection
3.4 PCB Defects
3.4.1 Group 1: White Spots
3.4.2 Group 2: Damage
3.4.3 Group 3: Solder Mask Defects
3.4.4 Group 4: Void
3.4.5 Group 5: Plating Related
3.4.6 Group 6: Annular Ring
3.4.7 Group 7: Copper Visibility
3.4.8 Group 8: Foreign Particles
3.4.9 Group 9: Corrosion
3.4.10 Group 10: Non-wetting
3.4.11 Group 11: Measling
3.4.12 Group 12: Haloing
3.4.13 Group 13: Dull Appearance
3.4.14 Group 14: Pad Lift
3.4.15 Group 15: Grooves in Drill Hole
3.4.16 Group 16: Interface Separation
3.4.17 Group 17: Track Width Reduction
3.4.18 Group 18: Cut
References
4 Mounting Defects
4.1 Introduction
4.2 Mounting Defects
Reference
5 Conformal Coating and Potting Defects
5.1 Introduction
5.2 Commonly Used Materials and Applications
5.3 Basic Requirements
5.4 Defects
References
6 EEE Component Defects
6.1 Introduction
6.2 Defects
References
7 Workmanship Defects
7.1 Introduction
7.2 Defects
Reference
8 Defects Due to the Usage of Non-FFF Components
8.1 Introduction
8.2 Defects
Reference
9 Defects in CAD Layout
9.1 Introduction
9.2 Defects
Reference
