Electromechanical Coupling Theory, Methodology and Applications for High-Performance Microwave Equipment

Cover
Title Page
Copyright
Contents
About the Authors
Preface
Chapter 1 Background of Electromechanical Coupling of Electronic Equipment
1.1 Introduction
1.2 Characteristics of Electronic Equipment
1.3 Components of Electronic Equipment
1.3.1 Mechanical and Structural Part of Electronic Equipment
1.3.2 Electrical Part of Electronic Equipment
1.4 On research of Electromechanical Coupling (EMC) of Electronic Equipment
1.4.1 Current Status of Research on Electromechanical Coupling of Electronic Equipment
1.4.2 The Development Trends of Electronic Equipment
1.4.2.1 High Frequency and High Gain
1.4.2.2 Broad Bandwidth, Multiband, and High Power
1.4.2.3 High Density and Miniaturization
1.4.2.4 Fast Response and High Pointing Accuracy
1.4.2.5 Good Environmental Adaptability
1.4.2.6 Integration
1.4.2.7 Intelligence
1.5 Problem of the Traditional Design Method of Electronic Equipment
1.5.1 Traditional Design Method and Problems with Electronic Equipment
1.5.2 The Electromechanical Coupling Problem of Electronic Equipment and Its Solution
1.6 Main Science and Technology Respects of Design for Electronic Equipment
1.6.1 Holism of Electronic Equipment System Design
1.6.2 Electromechanical Coupling Theory of Electronic Equipment
1.6.3 Test and Evaluation Methods of Electronic Equipment
1.6.4 Environmental Adaptability (Thermal, Vibration, and EMC) and Reliability of Electronic Equipment
1.6.5 Special Electronic Equipment
1.6.6 Electromechanical Coupling Design of Electronic Equipment
1.6.6.1 Electromechanical Coupling Design of Antennas
1.6.6.2 Integrated Design of Radar Antenna Servo System
1.6.6.3 Coupling Design of High‐Density Chassis
1.7 Mechatronics Marching Toward Coupling Between Mechanical and Electronic Technologies
References
Chapter 2 Fundamental of Establishing Multifield Coupling Theoretical Model of Electronic Equipment
2.1 Introduction
2.2 Mathematical Description of Electromagnetic (EM), Structural Deformation (S), and Temperature (T) Fields
2.2.1 Electromagnetic Field
2.2.2 Structural Displacement Field
2.2.3 Temperature Field
2.3 Consideration of Establishing Multifield Coupling Model
References
Chapter 3 Multifield Coupling Models of Four Kinds of Typical Electronic Equipment
3.1 Introduction
3.2 Reflector Antennas
3.2.1 Influence of Main Reflector Deformation
3.2.2 Influence of the Feed Position Error
3.2.3 Effect of Feed Pointing Error
3.2.4 Electromechanical Two‐field Coupling Model
3.2.5 Dual Reflector Antenna
3.2.6 Experiment
3.2.6.1 Basic Parameters
3.2.6.2 The Basic Idea of the Experiment
3.2.6.3 Working Conditions and Deformation
3.2.6.4 Measurement and Environment
3.2.6.5 Calculated and Measured Results
3.3 Planar Slotted Waveguide Array Antennas
3.3.1 Effect of Position Error of the Radiation Slot
3.3.2 Effect of Radiation Slot Pointing Deflection
3.3.3 Effect of Seam Cavity Deformation on Radiation Seam Voltage
3.3.4 Two‐field Electromechanical Coupling Model
3.3.5 Experiment
3.3.5.1 Basic Parameters
3.3.5.2 Basic Idea
3.3.5.3 Working Condition and Deformation
3.3.5.4 Testing and Environment
3.3.5.5 Calculated and Measured Results
3.4 Active Phased Array Antennas
3.4.1 Effect of Change of Position and Attitude of the Radiation Unit
3.4.2 Effect of Array Surface Manufacturing and Assembly Errors
3.4.3 Effect of Radiation Array Element Manufacturing and Assembly Errors
3.4.3.1 Waveguide Flange Connection Discontinuity
3.4.3.2 Influence of Waveguide Inner Wall Roughness
3.4.3.3 Effect of Temperature Drift of T/R Components
3.4.4 Effect of Mutual Coupling of Radiation Elements on the Radiation Performance of Antennas
3.4.5 Theoretical Model of Electromagnetic–Displacement–Temperature Fields Coupling
3.4.6 Experiment
3.4.6.1 Basic Parameters
3.4.6.2 Basic Ideas
3.4.6.3 Working Conditions and Array Surface Errors
3.4.6.4 Measurement and Environment
3.4.6.5 Calculated and Measured Results
3.5 High‐density Cabinets
3.5.1 Effect of Contact Gaps
3.5.2 Effect of Heat Sink Holes and Structural Deformation
3.5.3 Theoretical Model of Electromagnetic–Displacement–Temperature Fields Coupling
3.5.4 Experiment
3.5.4.1 Basic Parameters
3.5.4.2 Measurement and Environment
3.5.4.3 Calculated and Measured Results
References
Chapter 4 Solving Strategy and Method of the Multifield Coupling Problem of Electronic Equipment
4.1 Introduction
4.2 Solving Strategy of the Multifield Coupling Problem
4.3 Solving Method of the Multifield Coupling Problem
4.3.1 Solution Method of Direct Coupling Analysis
4.3.2 Solution Method of Sequential Coupling Analysis
4.3.3 Solution Method for Mathematical Decoupling Analysis
4.3.4 Solution Method of Integrated Optimization Analysis
4.4 General Approach Method of the Multifield Coupling Problem
4.4.1 Neighborhood Interpolation Method
4.4.2 Mapping Method
4.4.3 Spline Function Interpolation Method
4.4.4 Continuation Method
4.5 The Mesh Matching Among Different Fields
4.5.1 Generated Directly in the Structural Finite Element Mesh
4.5.2 Mesh Mapping from Structure to EM
4.6 Mesh Transformation and Information Transfer
4.6.1 Transmission of Deformation Information
4.6.2 Extraction of Deformed Meshes
References
Chapter 5 Influence Mechanism (IM) of Nonlinear Factors of Antenna‐Servo‐Feeder Systems on Performance
5.1 Introduction
5.2 Data Mining of ISFP
5.2.1 Data Modeling Method
5.2.2 Acquisition of Data Samples
5.2.2.1 Building the Initial Data Warehouse
5.2.2.2 Obtaining the Data Samples Needed for Modeling
5.2.2.3 Data Conversion and Normalized Processing
5.2.3 Multicore Regression Method for Data Mining
5.2.4 Application of Data Mining
5.3 ISFP of Reflector Antennas
5.3.1 Data Collection and Mining
5.3.2 The Establishment of an Analysis Model of the Influence Mechanism
5.3.3 Experiment
5.4 ISFP of Planar Slotted Waveguide Array Antennas
5.4.1 Hierarchical Relationship Model of Structural Factors and Electrical Properties
5.4.2 Influence of Structural Factors on the Amplitude Phase of a Unit in a Radiated Functional Component
5.4.2.1 Influence of Slot Deviation on Conductance and Resonance Length
5.4.2.2 The Relationship Between Frequency and Admittance, Amplitude Phase
5.4.2.3 Influence of Waveguide Wall Thickness on Admittance, Amplitude Phase
5.4.2.4 Influence of Slot Width on Admittance, Amplitude Phase
5.4.2.5 Influence of Slot Length on Amplitude and Phase
5.4.3 Influence of Structural Factors on the Amplitude Phase of a Unit in a Coupling Functional Component
5.4.3.1 Influence of the Inclination Angle of the Slot on the Resonance Length and Resonance Resistance
5.4.3.2 Influence of Inclination Angle and Slot Length on Amplitude and Phase
5.4.3.3 Influence of Waveguide Wall Thickness on Impedance, Amplitude Phase
5.4.3.4 Influence of Slot Width on Impedance, Amplitude Phase
5.4.4 Influence of Structural Factors on Voltage Standing Wave Ratio in the Excitation Functional Components
5.4.4.1 Weighting Analysis of the Influence of the structural Factors on the Amplitude and Phase in the Incentive Function Component
5.4.4.2 Results and Discussion
5.4.5 Prototype Design and Experiment
5.5 ISFP of Microwave Feeder and Filters
5.5.1 Hierarchical Relationship Model of the Influence of Structural Factors on the Resonant Cavity Filters
5.5.2 Influence of Structural Factors on the No‐load Q Value of the Resonant Cavity
5.5.2.1 Influence of Geometric Shape, Size, and Position Deviation on the No‐load Q Value
5.5.2.2 Relationship Between Surface Roughness and Equivalent Conductivity
5.5.2.3 Relationship Between Coating Quality and Equivalent Conductivity
5.5.2.4 Influence of Coaxial Cavity Assembly Connection Quality on No‐load Q Value
5.5.3 Influence of Structural Factors on the Coupling Coefficient
5.5.3.1 Influence of Coupling Hole Structure Factors on the Coupling Coefficient
5.5.3.2 Analysis of the Influence of the Position and Size of the Coupling Diaphragm and the Length of the Resonant Rod on the Coupling Coefficient
5.5.4 Influence of Tuning Screw on Resonance Frequency and Coupling Coefficient
5.5.4.1 Effect of Screw‐in Depth on Resonant Frequency
5.5.4.2 Relationship of the Influence of the Tuning Screw on the Coupling Coefficient
5.5.5 Influence of Structural Factors on the Power Capacity of Microwave Filters
5.5.6 Prototype Production and Experiment
5.6 ISFP of Radar‐Servo Mechanism
5.6.1 Influence of Clearance on the Performance of the Servo System
5.6.1.1 Influence of Gear Meshing Clearance
5.6.1.2 Influence of Bearing Clearance
5.6.2 Influence of Friction on the Performance of the Servo System
5.6.2.1 Influence of Gear Meshing Friction
5.6.2.2 Influence of Bearing Friction
5.6.3 Construction of Servo System Prototype and Experiment
5.6.3.1 Servo System Prototype
5.6.3.2 Experiment
5.7 ISFP of Active Phased Array Antennas with Radiating Arrays
5.7.1 Decomposition and Accuracy Transfer of Multilayer Conformal Surfaces
5.7.1.1 Decomposition of Multilayer Conformal Surfaces
5.7.2 Accuracy Characterization of Base Support Surfaces
5.7.3 Accuracy Characterization of Spliced Conformal Surfaces
5.7.4 Accuracy Characterization of Discrete Array Metasurfaces
References
Chapter 6 EMC‐Based Measure and Test of Typical Electronic Equipment
6.1 Introduction
6.2 EMC‐Based Analysis of Measure and Test Factors
6.2.1 Objective Coupling Degree Calculation Method – Data Envelopment Analysis Method
6.2.2 Subjective Coupling Degree Calculation Method – Subjective Scoring Method
6.2.3 Combination of Subjective and Objective Coupling Degrees/Weighting
6.2.3.1 Entropy‐Based Metrics
6.2.3.2 Measure of the Degree of Coupling Deviation
6.3 EMC‐Based Measure and Test Technology for Typical Case
6.3.1 Planar Slotted Array Antenna
6.3.1.1 Analysis of the Coupling Degree of PSAA Test Factors
6.3.1.2 Key Test Techniques
6.3.2 Three‐dimensional Antenna Base Test Technology
6.3.2.1 Three‐dimensional Antenna Base Test Factor Coupling Degree Analysis
6.3.2.2 Key Test Techniques
6.3.3 Electrically Tuned Duplex Filter Test Technique
6.3.3.1 Electrically Tuned Duplex Filter Test Factor Coupling Degree Analysis
6.3.3.2 Key Test Techniques
6.4 EMC‐Based Measure and Test System for Typical Case
6.4.1 Planar Slotted Array Antenna‐integrated Test Platform
6.4.2 Three‐dimensional Antenna Base‐integrated Test Platform
6.4.3 Electrically Tuned Duplex Filter‐integrated Test Platform
References
Chapter 7 Evaluation on EMC of Typical Electronic Equipment
7.1 Introduction
7.2 On Correctness of EMC Theory and IM
7.2.1 Fuzzy–Gray Integrated Test Method
7.2.1.1 Gray Estimation as the Estimation of Overall True Value
7.2.1.2 Conversion of Affiliation Order to Affiliation Function
7.2.1.3 Determination of xL and xU
7.2.1.4 Two Overall Mean Hypothesis Tests
7.2.2 Coincidence Degree
7.3 On Validation of EMC Theory and IM
7.4 Evaluation of EMC Theory and IM for PSAA
7.5 Evaluation of EMC Theory and IM for a Radar Servo Mechanism
7.6 Evaluation of EMC Theory and IM for Filter
References
Chapter 8 EMC‐ and IM‐based Optimum Design of Electronic Equipment
8.1 Introduction
8.2 EMC‐ and IM‐based Reflector Optimum Design
8.2.1 Mathematical Description of the Electromechanical Coupling Optimization Design
8.2.2 Numerical Simulation and Engineering Applications
8.3 EMC‐ and IM‐based Cabinet Optimum Design
8.3.1 Mathematical Description of the Optimal Design of Electromechanical–Thermal Coupling
8.3.2 Numerical Optimization Design of the Practical Chassis
8.4 EMC‐ and IM‐based Radar Servo Mechanism Optimum Design
8.4.1 Design Method of Structural Subsystem of Servo Control System
8.4.2 Design Method of the Control Subsystem of Servo System
8.4.3 Design Method with Integration of Structural and Control Technologies for Radar Servo System
8.4.4 Numerical Simulation and Experimental Validation
8.5 A General Design‐vector‐based Optimum Design of Electronic Equipment
References
Chapter 9 Computer Software Platform for Coupling Analysis and Design of Electronic Equipment
9.1 Introduction
9.2 General Method and System Project
9.3 Integration of the Professional Software
9.4 Software Development of EM‐S‐T Field Coupling Analysis
9.4.1 Basic Ideas and Framework
9.4.2 Interactive Interface for Field Coupling Analysis
9.4.3 Data Exchange Interface
9.4.4 The Software System
9.4.4.1 Parametric Modeling and Data Processing Module
9.4.4.2 Field Coupling Analysis Module for Several Typical Electronic Equipment
9.5 Software Development of IM of Structural Factors on Performance
9.5.1 Basic Ideas and Framework
9.5.2 The Software of the Influence Mechanism of the Antenna Feeder System
9.5.3 The Software of Servo System's Influence Mechanism
9.5.3.1 Topological Structure Management of Radar Antenna Servo System
9.5.3.2 Calculation of Structural Parameters
9.5.3.3 Controller Selection and Control Parameter Setting
9.5.3.4 Influence Mechanism Analysis
9.6 Software of EMC‐ and IM‐based Measure and Test and Evaluation
9.6.1 Basic Idea and Framework
9.6.2 The Working Process
9.6.3 Database
9.6.4 Test Data Interface
9.6.4.1 Test Data Interface for Planar Slotted Array Antennas
9.6.4.2 Test Data Interface of Three‐dimensional Antenna Base
9.6.4.3 Test Data Interface of Electrically Tuned Duplex Filter
9.6.5 Comprehensive Assessment Software System
9.6.5.1 The Module of Coupling Analysis Among Test Factors
9.6.5.2 Comprehensive Evaluation Module
References
Chapter 10 Engineering Applications of EMC Theory and IM of Electronic Equipment
10.1 Introduction
10.2 Application of Moon‐exploration Antenna with the Diameter of 40 m
10.3 Application of the Servomechanism of the Gun‐guided Radar System in Warship
10.4 Application of Planar Slotted Array Antennas
10.5 Application of the Filter with Electrical Adjustable and Double Functioning
10.6 Application of FAST‐500 M Aperture Spherical Radio Telescope
References
Chapter 11 Development Trends of Electromechanical Coupling Theory and Method of Electronic Equipment
11.1 Introduction
11.2 Extreme Frequencies
11.3 Extreme Environments
11.4 Extreme Power
References
Index
EULA