Electrodissolution Processes: Fundamentals and Applications discusses the basic principles involved in high-rate anodic dissolution processes and their application in advanced machining, micromachining, and finishing operations. The fundamentals section of the book discusses the anodic dissolution behavior of different classes of metals and the influence of mass transport, current distribution, and surface film properties on the metal removal rate and surface finishing. The applications section of the book presents essential elements of electrochemical and assisted techniques for precision machining, micromachining, and polishing of advanced materials, including hard-to-machine conducting ceramic materials.
Features
- A first-of-its-kind book that provides updated scientific and engineering information related to high-rate anodic dissolution processes
- Highlights the importance of the understanding of basic principles required for designing and optimizing ECM/EMM/EP processes
- Gives equal emphasis to the fundamentals and applications of electrodissolution processes
- Discusses the high-rate anodic dissolution of two broad classes of materials, namely, engineering and refractory materials
- Presents case studies to demonstrate the capabilities of different electrochemical and assisted machining, micromachining, and finishing operations
- Presents a dedicated chapter on electrochemical planarization of copper interconnects
Madhav Datta is the Chairman of Amrita Center for Industrial Research and Innovation and a Distinguished Professor in the Department of Chemical Engineering and Materials Science, Amrita University, Coimbatore, India.
Author(s): Madhav Datta
Publisher: CRC Press
Year: 2020
Language: English
Pages: 312
City: Boca Raton
Cover
Half Title
Title Page
Copyright Page
Table of Contents
Preface
Author
Chapter 1 Open-Circuit Metal Dissolution Processes
1.1 Introduction
1.2 Corrosion
1.2.1 Types of Corrosion
1.2.2 Fundamentals of Corrosion
1.2.2.1 Corrosion Thermodynamics
1.2.2.2 Corrosion Kinetics
1.2.3 Pitting Corrosion
1.2.4 Corrosion Prevention
1.3 Chemical Etching
1.3.1 Photochemical Etching
1.3.2 Printed Circuit Boards
1.3.3 Anisotropy Considerations
1.4 Chemical Mechanical Polishing
1.4.1 CMP in Copper Interconnect Technology
1.4.1.1 Dishing and Erosion
1.4.2 CMP Slurry Components
1.4.3 Final Remarks
References
Chapter 2 Anodic Behavior of Metals
2.1 Introduction
2.2 Active Dissolution
2.3 Passivation
2.3.1 Experimental Techniques for the Study of Passive Films
2.3.2 Anodic Passive Films on Metals
2.3.2.1 Passive Films on Ni, Fe, and Their Alloys
2.3.2.2 Anodic Oxide Films on Valve Metals
2.4 Transpassivity
2.4.1 Pitting
2.4.2 Film Oxidation and Electropolishing
2.4.3 Oxygen Evolution and High-Rate Transpassive Dissolution
2.5 Anodic Reaction Stoichiometry
References
Chapter 3 Transpassive Films and Their Breakdown under ECM Conditions
3.1 Introduction
3.2 Factors Influencing Transpassive Dissolution
3.3 Microscopic Investigation of Transpassive Film Breakdown
3.4 AES/XPS Studies of Transpassive Films on Ni and Fe
3.4.1 Transpassive Films on Nickel
3.4.2 Transpassive Films on Iron
3.5 Transpassive Dissolution Mechanism
References
Chapter 4 Mass Transport and Current Distribution
4.1 Introduction
4.2 Mass Transport
4.2.1 Convective Diffusion
4.2.2 Anodic Limiting Current
4.2.3 Mass Transport in Pulsating Current Dissolution
4.3 Current Distribution
4.4 Experimental Tools for the Investigation of High-Rate Anodic Dissolution Processes
4.4.1 Rotating Disk Electrode
4.4.2 Flow Channel Cell
Appendix
References
Chapter 5 High-Rate Anodic Dissolution of Fe, Ni, Cr, and Their Alloys
5.1 Introduction
5.2 Iron and Nickel in Chloride Electrolytes
5.3 Iron and Nickel in Nitrate Electrolytes
5.4 Iron and Nickel in Chlorate Electrolytes
5.5 FeCr Alloys in Chloride and Nitrate Electrolytes
5.6 Mass Transport-Controlled Salt Film Formation
5.7 Pulsed Dissolution
5.8 Influence of Metallurgical Factors
5.8.1 Pitting and Grain Boundary Attack
5.8.2 Flow Streak Formation
References
Chapter 6 High-Rate Anodic Dissolution of Ti, W, and Their Carbides
6.1 Introduction
6.2 High-Rate Anodic Dissolution of Titanium
6.2.1 Anodic Behavior of Ti
6.2.2 High-Rate Anodic Dissolution of Titanium and Titanium Alloys under ECM Conditions
6.3 High-Rate Anodic Dissolution of Tungsten
6.3.1 Anodic Behavior of Tungsten
6.3.2 High-Rate Anodic Dissolution of Tungsten under ECM Conditions
6.4 High-Rate Anodic Dissolution of Carbides of Ti and W
6.4.1 Anodic Behavior of Ti and W Carbides
6.4.2 High-Rate Anodic Dissolution of TiC, WC, and Hardmetals under ECM Conditions
References
Chapter 7 Anodic Dissolution of Metals in Electropolishing Electrolytes
7.1 Introduction
7.2 Electropolishing of Selected Metals and Alloys: Rate-Controlling Species
7.2.1 Copper
7.2.2 Fe, Cr, and Their Alloys
7.2.2.1 Fe
7.2.2.2 Cr and FeCr Alloys
7.2.3 Ti and NiTi Alloys
7.2.3.1 Titanium
7.2.3.2 NiTi (Shape Memory Alloy)
7.2.4 Niobium
7.3 Current Oscillations
7.4 Transport Mechanism of Electropolishing
References
Chapter 8 Electrochemical Machining
8.1 Introduction
8.2 ECM Reactions
8.3 Process Description
8.3.1 ECM Equipment
8.3.2 ECM Electrolytes
8.3.3 The Interelectrode Gap
8.3.4 Process Monitoring and Control
8.4 Current Efficiency and Metal Removal Rate
8.5 Mass Transport and Surface Finish
8.6 Machining Accuracy
8.6.1 Passivating Electrolytes
8.6.2 Pulse ECM
8.6.3 Other Methods
8.7 Shape Prediction and Tool Design
8.8 ECM Techniques and Applications
8.8.1 Die Sinking and Combined Tool Machining
8.8.2 Electrochemical Drilling
8.8.3 Electrochemical Deburring
8.9 Assisted ECM
8.9.1 Electrochemical Grinding
8.9.2 Ultrasonic-Assisted ECM
8.9.3 Ultrasonic-Assisted ECG
8.9.4 Electrochemical Honing
8.10 Environmental and Safety Issues
References
Chapter 9 Electrochemical Micromachining: Maskless Techniques
9.1 Introduction
9.2 Jet Electrochemical Micromachining
9.3 Electrochemical Microdrilling
9.4 Wire Electrochemical Micromachining
9.5 Assisted Electrochemical Micromachining
9.5.1 Laser-Assisted Jet Electrochemical Micromachining
9.5.2 Vibration/Ultrasonic-Assisted Wire Electrochemical Micromachining
9.5.3 Abrasive-Assisted Jet Electrochemical Micromachining
9.6 EMM Case Studies
9.6.1 Wire Electrochemical Micromachining of Aluminum Rings for the Fabrication of Corrugated Horns
9.6.2 Electrochemical Saw Using Pulsating Voltage
References
Chapter 10 Through-Mask Electrochemical Micromachining
10.1 Introduction
10.2 Photoresist and Lithography
10.3 Mass Transport in a Cavity
10.4 Shape Evolution Modeling
10.5 TMEMM Challenges
10.5.1 Uniformity Considerations
10.5.2 Anisotropy Considerations
10.5.3 Island-Formation Issues in One-Sided TMEMM
10.6 TMEMM Tools
10.6.1 One-Sided TMEMM Tool
10.6.2 Two-Sided TMEMM Tool
10.6.3 Precision Electroetching Tool for Semiconductor Processing
10.7 TMEMM Applications: Case Studies
10.7.1 Fabrication of Ink-Jet Nozzle Plates
10.7.2 Fabrication of Cone Connectors
10.7.3 Fabrication of Metal Masks
10.7.4 TMEMM of Titanium for Biological Applications
10.7.5 TMEMM of Titanium Using Laser Patterned Oxide Film Masks
References
Chapter 11 Electropolishing in Practice
11.1 Introduction
11.2 Electropolishing Process Description
11.2.1 Operating Conditions
11.2.2 Monitoring and Control
11.2.3 Surface Evaluation
11.2.4 Quality Control
11.2.5 Environmental Issues
11.3 Applications
11.4 Case Studies
11.4.1 Electropolishing of Nitinol Stents
11.4.2 Fabrication of STM Probes
11.4.3 Electropolishing of Print Bands
11.5 Assisted Electropolishing
11.5.1 Magneto-Electropolishing
11.5.2 Plasma Electropolishing
11.5.3 Pulse and Pulse Reverse Electropolishing
References
Chapter 12 Electrochemical Planarization of Copper Interconnects
12.1 Introduction
12.2 Planarization by Electropolishing
12.2.1 Electropolishing Mechanism
12.2.2 Planarization Issues
12.3 Planarization by Electrochemical and Mechanical Actions
12.3.1 Electrochemical Mechanical Deposition
12.3.2 Electrochemical Mechanical Planarization
12.3.2.1 Mechanical Factors
12.3.2.2 Electrolyte Composition
12.4 Removal of the Barrier Layer
12.5 Summary and Final Remarks
References
Index
