This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.
Author(s): Jan A. Dziuban
Edition: 1
Year: 2006
Language: English
Pages: 349
Tags: Приборостроение;Микро- и наносистемная техника;
1402045786......Page 1
Contents......Page 7
Acknowledgments......Page 11
List of Acronyms and Symbols......Page 12
1. Introduction......Page 18
2. Some remarks on microsystem systematic and development......Page 19
2.1. Literature......Page 29
3.1. Micromechanical substrates and mechanical properties of silicon......Page 30
3.2. Wet anisotropic etching of silicon......Page 38
3.2.1. Etching solutions, chemical reactions, etching models......Page 42
3.2.2. Etching in KOH......Page 44
3.2.3. Electrochemical etching......Page 55
3.2.4. Fast wet etching......Page 58
3.2.5. Isotropic etching......Page 68
3.3.1. Membranes......Page 72
3.3.2. V-grooves, vials and holes......Page 95
3.3.3. Movable constructions; wheels, gears, beams, beams and seismic mass......Page 106
3.3.4. Tips, arrays of tips......Page 119
3.4. Literature......Page 124
4. Bonding......Page 134
4.1. Surface cleaning and activation......Page 135
4.1.1. Silicon wafers and silicon wafers covered with SiO[sub(2)]......Page 136
4.1.2. Glass substrates......Page 139
4.2. High temperature fusion bonding......Page 140
4.2.1. Hydrophilic bonding......Page 141
4.2.2. Hydrophobic bonding......Page 154
4.2.3. Bonding of silicon to other materials......Page 155
4.2.4. Application of fusion bonding in microsystem technology – some chosen examples......Page 156
4.3.1. Modified hydrophilic bonding......Page 166
4.3.2. Boron, amorphous layer and fluorine bonding......Page 168
4.3.3. Bonding through low temperature melting glass......Page 169
4.3.4. Room temperature bonding......Page 172
4.3.5. Eutectic bonding......Page 176
4.3.6. Application of low temperature bonding in microsystem technology – some chosen examples......Page 178
4.4. Anodic (electrostatic) bonding......Page 179
4.4.1. Glass for anodic bonding......Page 185
4.4.2. Mechanism of bonding......Page 194
4.4.3. Technology of bonding......Page 218
4.4.4. Application of anodic bonding......Page 261
4.5. Literature......Page 319
5. Classification of bonding and closing remarks......Page 333
5.1. Literature......Page 344
