Printed circuit boards (PCB) are at the heart of every electronic product manufactured today. Yet, engineers rarely learn to design PCBs from a class or course. They learn it by doing, by reading app notes, watching YouTube videos and sitting by the side of an experienced engineer.
This book is the foundation building book for all engineers starting out to design PCBs. It teaches good habits designing a PCB, first for connectivity, and secondly, introduces the four most important principles to reduce noise.
A seven-step process is presented: developing a plan of record, creating a Bill of Materials, completing the schematic, completing the layout, completing the assembly, conducting bring up and troubleshooting and documenting the project. Each step is developed in detail. In particular, the emphasis in this book is on risk management: what can be done at each step of the process to reduce the risk of a hard-error which requires a complete re-spin, or a soft error, which requires some sort of on-the-fly repair.
After connectivity is designed, it’s important to develop good habits to minimize the potential noise from ground bounce, power rail stitching noise, stack up design and reducing switching noise in signal paths. These techniques apply to all designs from 2-layer to 8-layer and more, for bandwidths below 200 MHz.
The best practices for manual lead-free soldering are presented so that everyone can become a soldering expert.
The best measurement practices using common lab instruments such as the DMM, the constant current/constant voltage power supply, and oscilloscopes are presented so that common artifacts are minimized. Features in the design that help you find design or assembly errors quickly and the troubleshooting techniques to find and fix problems are introduced.
Applying the habits presented in this book will help every engineer design their next circuit board faster, with less chance of an unexpected problem, with the lowest noise. This textbook will also have embedded videos to visually demonstrate many of the hands-on processes introduced in this book.
Author(s): Eric Bogatin
Publisher: Artech House
Year: 2021
Language: English
Pages: 519
City: Norwood
BOGATIN’S PRACTICAL GUIDE to PROTOTYPE BREADBOARD and PCB DESIGN
Table of Contents
Chapter 1 A Getting-Started Guide
1.1 Who This Book Is For
1.2 Getting Stuff Done
1.3 Cost-Performace Trade-offs
1.4 Errors, Best Practices, and Habits
1.5 Learn to Design-in Success
1.6 A Getting-Started Guide for Signal Integrity
1.7 The Seven-Step Process
1.8 Risk Management and Mitigation
1.9 Two Risk Management Design Strategies
1.0 Master of Murphy's Law
1.11 Proof of Concept
1.12 Practice Questions
Chapter 2
PCB Technology
2.1 PCB, PWB, or PCA?
2.2 Physical Design of a PCB
2.3 Vias Technologies
2.4 Thermal and Thermal Relief Vias
2.5 Other Layers
2.6 The Soldermask Layer
2.7 Surface Finishes
2.8 The Silk Screen
2.9 What the Fab Vendor Needs
2.10 Practice Questions
Chapter 3
Signal Integrity and
Interconnects
3.1 Transparent Interconnects
3.2 When Interconnets are NOT Transparent
3.3 Where Signal Integrity Lives
3.4 Six Categories of Electrical Noise
3.5 Families of SI/PI/EMI Problems
3.6 In Principle and In Practice
3.7 Net Classes and Interconnect Problems
3.9 Design for X
3.10 Practice Questions
Chapter 4
Electrical Properties of
Interconnects
4.1 Ideal vs Real Circuit Elements
4.2 Equivalent Electrical Circuit Models
4.3 Parasitic Extraction of R, L, and C Elements
4.4 Describing Cross Talk
4.5 Estimating Mutual Inductance
4.6 Training Your Engineer’s Mind’s Eye
4.7 Electrically Long Interconnects
4.8 Electrically Short and Electrically Long
4.9 Practice Questions
Chapter 5
Trace Width Considerations:
Max Current
5.1 Best design practices
5.2 Minimum Fabrication Trace Width
5.3 Copper Thickness as Ounces of Copper
5.4 Maximum Current Handling of a Trace
5.5 Maximum Current Through a Via
5.6 Thermal Runaway with Constant Current
5.7 Practice Questions
Chapter 6
Trace Width Considerations:
Series Resistance
6.1 Resistance of Any Uniform Conductor
6.2 Sheet Resistance of a Copper Layer
6.3 Measuring Very Low Resistances
6.4 Voltage Drop Across Traces
6.5 The Thevenin Model of a Voltage Source
6.6 How Much Trace Resistance Is too Much?
6.7 The Resistance of a Via
6.8 Resistance of a Thermal Relief Via
6.9 Practice Questions
Chapter 7
The Seven Steps in Creating a
PCB
7.1 Step 1: Plan of Record
7.2 Step 2: Create the BOM
7.3 Step 3: Complete the Schematic
7.4 Step 4: Complete the Layout, Order the Parts
7.5 Steps 5 and 6: Assembly and Bring-Up
7.6 Step 7: Documentation
7.7 Practice Questions
Chapter 8
Step 1, POR: Risk Mitigation
8.1 Visualize the Entire Project Before You Begin
8.2 Avoid Feature Creep
8.3 Estimate Everything You Can
8.4 Preliminary BOM: Critical Components
8.5 Risk Assessment
8.6 Risk Mitigation: Tented Vias
8.7 Risk Mitigation: Qualified Parts
8.8 Practice Questions
Chapter 9
Risk Reduction: Datasheets,
Reverse Engineering, and
Component Selection
9.1 Take Responsibility for Your Design
9.2 Reducing the Risk of a Design Problem
9.3 Understand Your Circuit
9.4 Read Datasheets Critically
9.5 Build Simple Evaluation Prototypes
9.6 Reverse Engineer Components
9.7 Reuse Parts
9.8 Practice Questions
Chapter 10
Risk Reduction: Virtual and
Real Prototypes
10.1 Getting Started with Circuit Simulation
10.2 Practice Safe Simulation
10.3 Simulating a 555 Circuit
10.4 Purchase an Evaluation Board
10.5 Real Prototypes with Modules
10.6 Practice Questions
Chapter 11
Risk Reduction: Prototyping
with a Solderless Breadboard
11.1 Build a Real Prototype
11.2 Solderless Breadboards for POC
11.3 Features of a Solderless Breadboard
11.4 Bandwidth Limitations
11.5 A Simple Breakout Board
11.6 The Mini Solderless Breadboard
11.7 Best Wiring Habits
11.8 Habit #1: Consistent Column Assignments
11.9 Habit #2: Color Code the Wires
11.10 Habit #3: Keep Signal Traces Short
11.11 Habit #4: Avoid a Shared Return Path
11.12 Habit #5: Route Signal-Return Pairs
11.13 Habit #6: Keep Component Leads Short
11.14 Practice Questions
Chapter 12
Switching Noise and Return
Path Routing
12.1 The Origin of Switching Noise
12.2 Signal-Return Path Loops
12.3 Where Does Return Current Flow?
12.4 A Plane as a Return Path
12.5 Ground
12.6 Avoid Gaps in the Return Plane
12.7 Summary of the Best design practices
12.8 Practice Questions
Chapter 13
Power Delivery
13.1 Origin of Power Rail Switching Noise
13.2 Calculating Loop Inductance
13.3 Measuring PDN Switching Noise
13.4 The Role of Decoupling Capacitors
13.5 Where Do Decoupling Capacitors Go?
13.6 The Power Delivery Path
13.7 Inrush Current
13.8 Summary of the Eight Habits for Using a SSB
13.9 Practice Questions
Chapter 14
Design for Performance: The
PDN on a PCB
14.1 VRM specifications
14.2 Voltage Regulator Module
14.3 Self- and Mutual-Aggression Noise
14.4 Power and Ground Loop Inductance
14.5 Decoupling Capacitors
14.6 A Decoupling Capacitor Myth; Part 1
14.7 A Decoupling Capacitor Myth; Part 2
14.8 Routing for Power Distribution
14.9 Ferrite Beads
14.10 Summary of the Best design practices
14.11 Practice Questions
Chapter 15
Risk Reduction: Design for
Bring-Up
15.1 Test is Too General a Term
15.2 What Does It Mean to “Work”?
15.3 Design for Bring-Up
15.4 Add Design for Bring-Up Features
15.5 Jumper Switches
15.6 LED indicators
15.7 Test Points
15.8 The Power Rail as a Diagnostic
15.9 Practice Questions
Chapter 16
Risk Reduction: Design
Reviews
16.1 The Preliminary Design Review
16.2 The Critical Design Review
16.3 DRC for DFM in the CDR
16.4 DRC for Signal Integrity
16.5 Layout Review
16.6 Practice Questions
Chapter 17
Step 2: Surface-Mount or
Through-Hole Parts
17.1 Through-Hole and Surface-Mount
17.2 Types of SMT Parts
17.3 Integrated Circuit Components
17.4 Practice Questions
Chapter 18
Finding the One Part in a
Million
18.1 An Important Selection Process
18.2 Trade-offs in Selecting Parts
18.3 The Search Order to Select a Part
18.4 Selecting Resistors
18.5 Selecting Capacitors
18.6 The BOM
18.7 Summary of the Best Design Practices
18.8 Selecting Parts for Automated Assembly
18.9 Practice Questions
Chapter 19
Step 3: Schematic Capture and
Final BOM
19.1 Picking a Project Name
19.2 Schematic Capture
19.3 Take Ownership of Reference Designs
19.4 Add Options to Your Schematic
19.5 Best design practices for Schematic Entry
19.6 Design Review and ERC
19.7 Practice Questions
Chapter 20
Step 4: Layout — Setting Up
the Board
20.1 Layout
20.2 Board Dimensions
20.3 The Layers in a Board Stack
20.4 Negative and Positive Layers
20.5 Examples of Some Fab Shop DFM Features
20.6 Setting Up Design Constraints
20.7 Thermal Reliefs in Pads and Vias
20.8 Set Up Board Size and Keepout Layer
20.9 Practice Questions
Chapter 21
Floor Planning and Routing
Priority
21.1 Part Placement
21.2 The Order of Placement and Routing
21.3 First Priority: Ground Plane on the Bottom Layer
21.4 Second Priority: Decoupling Capacitors
21.5 Third Priority: Ground Connections
21.6 Fourth Priority: Digital Signals, Congested Signals
21.7 Fifth Priority: Power Paths
21.8 The Silk Screen
21.9 Check the Soldermask
21.10 Soldermask Color
21.11 Layout — Critical Design Review
21.12 Practice Questions
Chapter 22
Six Common Misconceptions
about Routing
22.1 Myth #1: Avoid 90 Deg Corners
22.2 Myth #2: Add Copper Pour on Signal Layers
22.3 Myth #3: Use Different Value Decoupling Capacitors
22.4 Myth #4: Split Ground Plan
22.5 Myth #5: Use Power Planes
22.6 Myth #6: Use 50 Ohm Impedance Traces
22.7 Practice Questions
Chapter 23
Four-Layer Boards
23.1 Two-Layer Stack-Ups
23.2 A 4-Layer Board
23.3 Four-Layer Stack-Up Options
23.4 Stack-Up Options with Two Planes
23.5 The Recommended 4-Layer Stack-Up
23.6 When Signals Change Return Planes
23.7 Practice Questions
Chapter 24
Release the Board to the Fab
Shop
24.1 Gerber Files
24.2 Cost Adders
24.3 Board Release Checklist
24.4 Practice Questions
Chapter 25
Step 6: Bring-Up
25.1 Does Your Widget Work?
25.2 Prototype or Production Testing
25.3 Design for Bring-Up
25.4 Find the Root Cause
25.5 Problems to Expect
25.6 Troubleshoot Like a Detective
25.7 Trick #1: Recreate the Problem
25.8 Trick #2: Seen This Problem Before?
25.9 Trick #3: Round Up the Usual Suspects
25.10 Trick #4: Three Possible Explanations
25.11 A Methodology
25.12 Forensic Analysis
25.13 Coding Issues
25.14 Practice Questions
Chapter 26
Step 7: Documentation
Chapter 27
Concluding Comments
Chapter 28
About Eric Bogatin
