IEEE Press - Wiley, 2009. - 473 p. - ISBN 978-0-471-70960-2.
This book introduces readers to the implementation of miniaturized communication systems, which have matured significantly over 10 years. The GSM standard became popular around the early 1990s. Its implementation in silicon technology made it a mainstream focus of the semiconductor industry, and it remains an area of interest for major business even today. Over the years, semiconductor technologies have matured significantly, and slowly, integration of communication system blocks has reached maturity since their inception. Today, multiple radios are integrated on the same die, along with integrated circuit (IC) components for performance optimization and miniaturization. This process is motivated by our ever increasing need for improved mobile computing and connectivity. Wired connections are preferred for high bandwidth communications, and they carry much of the backbone traffic in communication systems. In practice, wired and wireless communication systems coexist in a synergistic manner to provide the overall communication system solution.
Fundamental Concepts and Background
Wireless Communication System Architectures
System Architecture for High-Speed Wired Communications
Mixed Building Blocks of Signal Communication Systems
Examples of Integrated Communication Microsystems
Low-Voltage, Low-Power, and Low-Area Designs
Packaging for Integrated Communication Microsystems
Advanced SOP Components and Signal Processing
Simulation and Characterization of Integrated Microsystems