Second Edition, IEEE Press - Wiley, 2006, 812 pages, ISBN-13 978-0-471-46609-X, ISBN-IO 0-471-46609-3This book reflects the changes in the electronic packaging industry, as well as feedback from students, engineers, and educators since the publication of the First Edition in 1999. Like the First Edition, each chapter is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout.As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained.An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. Examples illustrate real-world applications, which are then reinforced by the extensive use of exercises to enable readers themselves to place their newfound knowledge into practice. In addition, references are provided that guide readers to more in-depth information and primary resources in specialized topics.Fully updated, this comprehensive reference remains the preeminent graduate-level textbook in its field as well as an essential reference for engineers and scientists.Introduction and overview of microelectronic packaging.
Materials for microelectronic packaging.
Processing technologies.
Organic printed circuit board materials and processes.
Ceramic substrates.
Electrical considerations, modeling, and simulation.
Thermal considerations.
Mechanical design considerations.
Discrete and embedded passive devices.
Electronic package assembly.
Design considerations.
Radio frequency and microwave packaging.
Power electronics packaging.
Multichip and three-dimensional packaging.
Packaging of MEMS and MOEMS: challenges and a case study.
Reliability considerations.
Cost evaluation and analysis.
Analytical techniques for materials characterization.
