The HDI Handbook

The HDI Handbook Cover
Table of Contents
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Foreword
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Preface
Author's Bios
Chapter 1: Introduction to High-Density Interconnects by Happy Holden
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Chapter 2: The HDI Market by Karen Carpenter
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Chapter 3: Design of Advanced Printed Circuits (HDI) by Happy Holden
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Chapter 4: Electrical Performance by Eric Bogatin
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Chapter 5: Materials for HDI by John Andresakis
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Chapter 6: The HDI Manufacturing Processes by Happy Holden
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Chapter 7: Small Hole Via Formation by Michael Carano
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Chapter 8: Desmear and Metallization by Michael Carano
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Chapter 9: Fine-Line Imaging and Etching by Michael Carano and Karl Dietz
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Chapter 10: Electrodeposition and Solderable Finishes for HDI by Michael Carano
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Chapter 11: Electrical Test of High-Density Interconnects by Christophe Vaucher
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Chapter 12: Quality, Acceptability and Reliability by Happy Holden
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Chapter 13: Assembly and Test Processes for HDI by Mark Laing and Matt Wuensch
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Chapter 14: Embedded Components by Happy Holden and Per Viklund
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Chapter 15: Advanced HDI Structures and Next Generation Technologies by Happy Holden
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Chapter 16: Advanced Packaging and System-in-Packages by Per Viklund
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Index