Microcontroller and Smart Home Networks

Front Cover
Microcontroller and Smart: ptHome Networks
Contents
Preface
Acknowledgment
List of Figures
List of Tables
List of Abbreviations
Section I: Inter-integrated Circuits (IIC)
1 Inter-integrated Circuits (IIC/I2C)
1.1 Introduction
1.1.1 I2C Revisions
1.2 I2C Bus Terminology
1.3 I2C Protocol
1.3.1 Transaction Format–Message Format
1.3.2 Timing Diagram
1.4 The I2C Bus Hardware Structure
1.4.1 Electrical Consideration
1.4.1.1 Types of devices that can be connected to I2C bus
1.4.1.2 Electrical considerations that limits I2C bus length
1.5 The Physical Bus–I2C Bus Interface
1.6 SDA and SCL Signals
1.7 Masters and Slaves
1.7.1 Buffering and Multiplexing
1.8 I2C Data Validity
1.9 Voltage Levels and Resistor Values
1.10 Start/Stop Sequence
1.11 Repeated START Condition
1.12 Addressing Structure
1.12.1 7-bit Addressing
1.12.2 Acknowledge Scheme
1.12.3 I2C Addresses Standard: 10-bit Addressing
1.12.3.1 I2C bus transactions in case of 10-bit address
1.12.4 I2C Addresses Standard: Special Addresses and Exceptions in 7-bit Address Space
1.12.4.1 Reserved and none-reserved addresses in 7-bit address space
1.12.4.1.1 Reserved addresses in 7-bit address space
1.12.4.2 Non-reserved addresses in 7-bit address space
1.13 I2C Bus Transaction
1.13.1 I2C Bus Events 1: Master (Transmitter) to Slave (Receiver) Data Transfer
1.13.2 I2C Bus Events 2: Slave (Transmitter) to Master (Receiver) Data Transfer
1.13.3 I2C Bus Events 3: Bidirectional Read and Write in Same Data Transfer
1.14 Clock Stretching
1.15 Possible Modifications on the Timing Diagram
1.16 Bus Clear
1.17 Applicability of I2C Bus Features
1.18 I2C Modes: Bus Speeds
1.18.1 Low-speed Mode or Standard Mode
1.18.2 Enhanced I2C (Fast Mode)
1.18.3 Fast-mode plus (FM+)
1.18.4 High-speed Mode (HS mode)
1.18.4.1 Electrical characteristics of HS mode
1.18.4.2 Transmission format of high-speed mode
1.18.5 Ultra-fast Mode (UFm)
1.19 I2C as a Multi-master Bus: Bus Arbitration
1.19.1 Arbitration
1.19.2 Bus Monitoring
1.19.3 Possibility of Collision
1.19.4 Clock Synchronization and Handshaking
1.19.4.1 Clock synchronization
1.19.4.2 Handshaking: Using the clock synchronizing mechanism as a handshake
1.20 I2C Interface: Connecting I2C Bus to a PC
2 Design of I2C Bus and Operation
2.1 Design of I2C Bus
2.1.1 Open-drain Lines
2.1.1.1 Open-drain for Bidirectional Communication
2.1.2 Calculation of the Pull-up Resistor
2.1.2.1 Supply voltage (Vcc)
2.1.2.2 Total bus capacitance (CBUS or Cb) and Rp(max)
2.1.2.3 Total high-level input current (IIH): Input leakage
2.1.2.4 Bus speed versus power consumption
2.1.3 Maximum Clock Frequency of I2C Bus
2.1.3.1 Using repeaters: Effect of increasing the number of devices—use of repeaters
2.1.3.2 I2C bus without a repeater
2.1.3.3 I2C bus with a repeater
2.1.4 Series Protection Resistors
2.1.4.1 Effect of the serial resistance on static low level of I2C line
2.1.4.2 Serial resistance and debugging
2.1.4.3 Termination versus capacitance
2.1.5 Cross Channel Capacitance: Crosstalk between SDA and SCL
2.2 Operating above the Maximum Allowable Bus Capacitance
2. 2.1 Reduced fSCL
2.2.2 Higher Drive Outputs
2.3 Managing the Delays in Large Systems: Use of Buffers, Repeaters, Multiplexers and Switches
2.4 Bus Buffers, Repeaters, Multiplexers, and Switches
2.4.1. Use of Buffers/Repeaters
2.4.2 Use of Multiplexors and Switches
2.4.3 Switched Pull-up Circuit
2.5 Use of Multiplexor/Switches to Solve Address Conflict
2.5.1 Use of Multiplexor to Solve Address Conflict
2.5.2 Use of Switches to Solve the Slave Address Conflict
2.5.3 Control Register
2.5.4 Level Shifters
2.5.5 Switches and Level Shifting
2.6 Advantages and Limitation of I2C Communication
2.7 Common Problems in I2C Bus Systems
2.7.1 Obscure Problems in Systems
2.7.1.1 Analyzing obscure problems
2.7.2 Typical Problems on the I2C Bus
2.7.2.1 Blocked I2C Bus
2.7.2.2 No acknowledge from I2C slave
2.7.2.3 Master reports arbitration lost
2.7.2.4 Data bytes from slave are 0xff
2.8 Case Study: I2C in AVR
2.8.1 AVR Atmega32 I2C Registers
2.8.1.1 TWBR (TWI bit rate register)
2.8.1.2 TWSR (TWI status register)
2.8.1.3 TWCR (TWI control register)
2.8.1.4 TWDR (TWI data register)
2.8.1.5 TWAR [TWI (slave) address register]
2.8.2 Programming of the AVR TWI in Master Operating Mode
2.8.2.1 Initialize the TWI in master operating mode
2.8.2.2 Transmit START Condition
2.8.2.3 Send Data
2.8.2.4 Receive Data
2.8.2.5 Transmit STOP Condition
2.8.3 Use I2C/TWI (Two-wire Interface) in AVR ATmega32
2.8.3.1 Circuit diagram
2.8.3.2 Code explanation for MASTER controller
2.8.3.3 Code explanation for slave controller
3 Improved Inter-integrated Circuits (I3C)
3.1 Derivative Technologies
3.2 Improved Inter-integrated Circuits (I3C)
3.2.1 Challenges with Existing I2C-based Architectures
3.2.2 MIPI I3C Interface
3.2.3 I3C Bus Configuration and Device Roles
3.2.4 I3C Features
3.2.4.1 Dynamic addressing
3.2.4.2 Provisional ID
3.2.4.3 Possibility of collision during dynamic address assignment (DAA)
3.2.4.4 Rule of CCC in dynamic address assignment
3.2.4.5 Hot-join
3.2.4.6 In-band Interrupt (IBI)
3.2.4.6.1 Interrupts
3.2.5 Multiple Masters
3.2.6 Increased Throughput
3.2.7 Power Consumption
3.2.7.1 Pull-up resistor
3.7.2.2 High-keeper
3.2.8 I3C Bus Activity States
3.2.9 I3C Bus Conditions When the Bus Is Considered Inactive
3.2.10 Time-stamping Capability Defined in the I3C Bus
3.2.11 Error Detection and Recovery Methods in I3C
3.2.12 Maximum Capacitance Load Allowed on the I3C Bus
3.2.13 Maximum Wire Length for I3C Communication
3.2.14 Repeaters and I3C
3.2.15 Resolving Communication Conflicts on the I3C Bus
3.2.16 Can I3C Devices Cause the Communication Bus to "Hang"?
3.2.17 MIPI I3C Specifications and Software Development
3.2.18 Expected New Features for MIPI I3C
Summary
References
Section II: Controller Area Network (CAN)
4 Controller Area Network (CAN)
4.1 Introduction to CAN: Overview
4.1.1 What is CAN?
4.1.1.1 Meaning of Massage-based Protocol
4.1.2 The Benefits of CAN Bus in Automobile Industry
4.1.3 CAN History
4.1.3.1 Higher layer implementations: Higher layer protocols (HLPs)
4.1.4 Error Detection and Security in CAN
4.1.5 The Application of CAN Bus
4.2 CAN Standard
4.2.1 CAN Architecture: OSI 7 layer reference model and CAN model
4.2.2 Higher Layer Protocols (HLPs)
4.3 CAN Features and Characteristics
4.3.1 Some Features of CAN Bus
4.3.2 Key characteristics of CAN
4.4 CAN Physical Layer
4.4.1 CAN Bus Description
4.4.1.1 Electrical consideration
4.4.1.1.1 Inverted logic of CAN bus
4.4.1.1.2 Robustness
4.4.1.1.3 Bus lengths
4.4.1.1.4 Bit rates and bus lengths
4.4.1.1.5 Propagation delay
4.4.1.1.6 Cables
4.4.1.1.7 Shield termination
4.4.1.1.8 Grounding
4.4.1.1.9 Bus termination–line termination
4.4.1.1.10 Connectors
4.4.2 CAN Node
4.4.2.1 CAN nodes types
4.4.3 Sublayers of the CAN Physical Layer
4.4.3.1 The physical coding sublayer: Overview
4.4.3.1.1 Bit-timing setting for Standard CAN
4.4.3.1.1.1 The Can Bit Time
4.4.3.1.1.2 Sample point
4.4.3.1.1.3 Implementation of bit segments in practical CAN controllers
4.4.3.1.1.4 Information processing time (IPT)
4.4.3.1.2 Bit timing setting for CAN FD
4.4.3.2 Calculation of baud-rate and sample point
4.4.3.3 Synchronization jump width (SJW)
4.4.3.4 Bit timing control registers
4.4.3.5 Synchronizing the bit time
4.4.3.6 Oscillator tolerance
4.4.3.7 Propagation delay
4.4.3.8 Synchronization: Synchronization Mechanisms used in CAN
4.4.3.9 Calculating oscillator tolerance for SJW
4.4.3.10 Configuring the bit
4.4.3.11 The physical media attachment sublayer
4.4.3.12 The medium-dependent sublayer
4.4.4 Maximum Number of Nodes
4.5 CAN Transceiver
4.5.1 CAN Transceiver Features
4.5.1.1 Supply voltage
4.5.1.2 High short-circuit protection
4.5.1.3 High ESD protection
4.5.1.4 High input impedance
4.5.1.5 Controlled driver output transition times
4.5.1.6 Low current standby and sleep modes
4.5.1.7 Thermal shutdown protection
4.5.1.8 Glitch free power up and power down
4.5.1.9 Unpowered node does not disturb the bus
4.5.1.10 Reference voltage
4.5.1.11 V-Split
4.5.1.12 Loopback
4.5.1.13 Autobaud loopback
4.5.2 CAN Transceiver Example: MCP2551 CAN TRANSCEIVER
4.5.2.1 General MCP2551 Operation
4.5.2.1.1 Transmit
4.5.2.1.2 Receive
4.5.2.1.3 Recessive STATE
4.5.2.1.4 Dominant STATE
4.5.2.2 Modes of operation
4.5.2.2.1 HIGH SPEED
4.5.2.2.2 SLOPE CONTROL
4.5.2.2.3 STANDBY
4.5.2.3 Permanent dominant detection on transmitter
4.5.2.3.1 Power-on reset and brown-out
4.5.2.3.2 Power-On Reset (POR)
4.5.2.3.3 Brown-out detection (BOD)
4.5.2.3.4 Ground offsets
5 CAN Data Link Layer
5.1 Data Link Layer
5.1.1 CAN Communication Services
5.1.1.1 Communication services
5.1.1.2 Remote transmission requests (RTR): Read object service
5.1.2 Multiple Bus Access
5.1.2.1 Meaning of CSMA/CD+AMP
5.1.2.2 Bus arbitration
5.1.3 Standard CAN or Extended CAN
5.1.3.1 The bit fields of standard CAN and extended CAN
5.1.3.2 Standard (base) CAN frame
5.1.3.3 Extended frame format
5.1.4 CAN Messages
5.1.4.1 CAN Frames
5.1.4.1.1 Data frame
5.1.4.1.2 Remote data frame
5.1.4.1.3 Error frame
5.1.4.1.4 Overload frame
5.1.4.1.5 Bit stuffing
5.2 CAN Bus Error Handling
5.2.1 Error Detection Methods
5.2.2 Form Error
5.2.3 CRC Error
5.2.4 Acknowledge Error
5.2.5 Stuff Error
5.2.6 Bit Error
5.2.7 Local Errors in EOF
5.2.8 Message Doubling
5.2.9 Error States of CAN Node
5.2.10 Transmit Error Counter
5.2.11 Receive Error Counter
5.2.12 Recovery from Bus Off
5.2.13 Error Confinement Mechanisms
5.2.14 Bus Loading
5.2.15 Time-triggered Protocols
5.3 CAN FD—The Basic Idea
5.4 ISO 11898 Review and Optional Modes
5.4.1 Bus Monitoring Mode
5.4.2 Time-Triggered Communication (TTC)
5.5 CAN in Action
References
External Links
Section III: ZigBee
6 IEEE 802.15.4 and ZigBee
6.1 Introduction
6.1.1 ZigBee General Description
6.1.2 ZigBee: Overview
6.1.3 Evolution of LR-WPAN Standardization
6.1.4 ZigBee History
6.1.5 ZigBee Application Profiles
6.2 ZigBee Wireless Sensor and Control Network
6.2.1 ZigBee Network Characteristics
6.2.1.1 ZigBee versus Bluetooth
6.2.2 ZigBee Device Types and Operating Modes
6.2.2.1 Operating modes
6.2.3 ZigBee Topologies
6.2.3.1 Forming the ZigBee network
6.2.3.2 Joining the ZigBee Network
6.2.4 End Device Addressing
6.2.5 Depth of a Network, Number of Children, and Network Address Allocation
6.3 ZigBee Protocol Stack Overview
6.3.1 Application Layer (APL)
6.3.1.1 ZigBee Device Objects (ZDO)
6.3.1.2 APS (application support sublayer)
6.3.1.2.1 ZigBee APS frame format
6.3.1.2.2 APS Ack frames
6.3.1.2.3 APS command frames
6.3.1.3 Application framework
6.3.2 Network Layer (NWK)
6.3.2.1 ZigBee network layer frame format
6.3.3. Security Services
6.3.3.1 Basic security model
6.3.3.2 Security architecture
6.3.3.3 Network layer security
6.3.3.4 APL layer security
6.3.3.5 Trust center role
6.3.4 ZigBee Address Assignment
6.4 IEEE 802.15.4 Standard
6.4.1 IEEE 802.15.4 Standard
6.4.2 Device Types
6.4.3 Network Topology
6.4.3.1 Star topology
6.4.3.2 Mesh topology, also, peer-to-peer topology
6.4.3.3 Tree topology
6.4.3.4 Cluster tree topology
6.4.4 802.14.5 Architecture
6.4.4.1 PHY layer
6.4.4.1.1 Function of physical layer in ZigBee architecture
6.4.4.1.2 Frequency band, data rate, and channel numbering
6.4.4.1.3 IEEE 802.15.4 frequencies and frequency bands
6.4.4.1.4 ZigBee frequency bands and data rates
6.4.4.1.5 IEEE 802.15.4 modulation formats
6.4.4.1.6 ZigBee physical layer frame format-PPDU
6.4.4.2 Receiver energy detection (ED)
6.4.4.3 Link quality indication (LQI)
6.4.4.4 Clear channel assessment (CCA)
7 ZigBee Stack Layers
7.1 ZigBee Mac Layer
7.1.1 Superframe Structure
7.1.1.1 Updating superframe configuration
7.1.2 CSMA-CA Algorithm
7.1.3 Data Transfer Model
7.1.4 Network Formation: Starting a PAN
7.1.5 Network Joining
7.1.5.1 Network discovery
7.1.5.2 Network join
7.1.5.2.1 Network join–child
7.1.5.2.2 Network join–parent
7.1.6 Association and Disassociation
7.1.6.1 Orphan notification
7.1.7 Synchronization
7.1.8 Transmission, Reception, and Acknowledgment
7.1.9 GTS Allocation and Management
7.1.10 MAC Layer Frame
7.1.10.1 Data frame
7.1.10.2 Beacon frame
7.1.10.2.1 Beacon generation
7.1.10.3 Acknowledgment frame
7.1.10.4 MAC command frame
7.1.11 Channel Access Mechanism
7.1.12 GTS Allocation and Management
7.1.13 Related MAC Standards
7.2 ZigBee Routing (Network) Layer
7.2.1 Broadcasting
7.2.2 ZigBee Routing Protocols
7.2.2.1 AODV: Ad hoc on-demand distance vector
7.2.2.2 AODVjr
7.2.2.3 Multicast route
7.2.2.4 Dynamic source routing (DSR)
7.2.2.5 Tree hierarchical routing protocol (HERA) or ZBR (ZigBee Routing)
7.2.2.6 ZigBee cluster label (ZiCL)
7.2.2.7 ZigBee multipath hierarchical tree routing (Z-MHTR)
7.2.2.8 Neighbor table-based routing techniques
7.2.2.8.1 Neighbor table
7.2.2.9 Many-to-one routing
7.2.2.10 ZigBee RF4CE
7.2.2.11 RF4CE multi-star topology
7.2.2.12 ZigBee RF4CE pairing process
7.2.2.13 ZigBee smart energy V2
8 ZigBee PRO and ZigBee SECURITY
8.1 ZigBee and ZigBee PRO Feature Sets
8.1.1 Management and Addressing
8.1.1.1 Link management
8.1.1.2 Group addressing
8.1.1.3 Compatibility
8.1.1.4 Power management
8.1.2 Improved Security
8.1.2.1 Trust center
8.1.3 Scalability
8.1.3.1 Stochastic addressing
8.1.3.2 Route aggregation
8.1.4 Improved Ease-of-Use and Operation
8.1.4.1 Fragmentation
8.1.4.2 Commissioning
8.1.5 Improved Resiliency
8.1.5.1 Asymmetric link
8.1.5.2 Frequency agility
8.1.5.3 PAN ID conflict resolution
8.2 ZigBee Security
8.2.1 802.15.4 Security: Overview
8.2.1.1. 802.15.4 Access control list
8.2.2 ZigBee Security
8.2.2.1 ZigBee security services
8.2.3 ZigBee Security Models
8.2.3.1 ZigBee security architecture
8.2.3.2 Network layer security
8.2.3.3 APL layer security
8.2.3.4 MAC Layer Security
8.2.3.5 Trust center role
8.2.4 ZigBee Security Keys
8.2.5 Key Management
8.2.5.1 Security key modification
8.2.6 ZigBee Stack Security Measures
8.2.7 ZigBee Vulnerabilities
8.2.7.1 Implementation vulnerabilities
8.2.7.2 Protocol Vulnerabilities
8.2.7.3 Security risks
8.2.7.4 Security key weaknesses
8.2.8 Measures for Maximizing ZigBee Security
8.2.8.1 Protecting the network key
8.2.8.2 Rolling the network key
8.2.8.3 Preventing spoof leave notifications key
8.2.8.4 Preventing rejoin security attacks
8.2.8.5 Persisting essential data when using cloud services
8.2.8.6 Key establishment cluster and security certificates
8.2.9 ZigBee Security–Conclusion
8.3 Applications of ZigBee Technology
8.4 Advantages of ZigBee Technology
8.4.1 ZigBee Technology Advantages
8.4.2 Disadvantages
8.4.3 Conclusion
8.5 Future Scope Of ZigBee
References
Section IV: Bluetooth
9 Bluetooth
9.1 Introduction: Overview
9.1.1 History of Bluetooth
9.1.2 Piconets and Scatternets
9.1.3 Bluetooth Spectrum
9.1.4 Bluetooth Frequency and Connectivity Ranges
9.1.5 Data Rate and Modulation
9.2 Bluetooth Stack Architecture
9.2.1 Relation between Classic Bluetooth, OSI model, and 802.11 Wi-Fi
9.2.2 Classical Bluetooth Stack
9.2.2.1 Bluetooth stack as core and profile
9.3 Bluetooth Stack Layers
9.3.1 Bluetooth Radio
9.3.2 Baseband
9.3.3 Link Manager Protocol (LMP)
9.3.4 Host Controller Interface (HCI)
9.3.5 Logical Link Control and Adaptation Protocol (L2CAP)
9.3.6 Radio Frequency Communications (RFCOMM)
9.3.7 Adapted Protocols
9.3.8 Service Discovery Protocol
9.3.9 Server-Client Model
9.4 Device Discovery
9.4.1 Inquiry
9.4.2 Page
9.4.3 Optional Paging Schemes
9.5 Service Discovery and Access
9.5.1 Bluetooth Service Discovery Protocol
9.5.1.1 Format
9.5.1.2 Service record
9.5.1.3 Representation of data
9.5.1.4 Searching and browsing services
9.5.2 Examples of SDP: Universal Plug and Play
9.5.2.1 Architecture overview
9.5.2.2 Operations overview
9.6 Bluetooth Security
9.6.1 Basic Means of Providing Bluetooth Security
9.6.2 Bluetooth Security and Trust Modes
9.6.2.1 Bluetooth security modes
9.6.2.1.1 Security mode 2 role
9.6.2.2 Bluetooth trust modes
9.6.3 Discoverability in Devices
9.6.4 Bluetooth Security Services
9.6.5 Built-in Security Features
9.7 Bluetooth Vulnerabilities and Threats
9.7.1 Vulnerabilities in Bluetooth Versions
9.8 Reasons for Bluetooth Vulnerabilities
9.8.1 Vulnerability to Eavesdropping
9.8.2 Potential Weaknesses
9.8.2.1 Encryption mechanisms
9.8.2.2 Association models of SSP
9.8.2.3 Device configuration
9.8.2.4 Bad coding during development of RFCOMM stack implementation
9.8.2.5 Re-use of older services for different protocols
9.8.2.6 IrMC permissions
9.9 Common Bluetooth Attacks
9.10. Bluetooth Risk Mitigation and Countermeasures
9.10.1 Mitigation Techniques
9.10.2 Applications for Protecting Bluetooth Devices
References
Sources
10 Z-Wave Technology
10.1.1 Introduction: What is Z-Wave?
10.1.1 Z-Wave Operating Characteristics
10.1.2 Technical Characteristics: Z-Wave frequency bands
10.1.3 Z-Wave Features
10.1.4 Z-Wave History
10.2 Z-Wave Protocol
10.2.1 Overview
10.2.2 Z-Wave Basic Device Classes: Controller and Slave Nodes
10.2.2.1 Controllers
10.2.2.1.1 Portable Controller
10.2.2.1.2 Static controller
10.2.2.1.3 Static update controller
10.2.2.1.4 SUC ID server
10.2.2.1.5 Installer controller
10.2.2.1.6 Bridge controller
10.2.2.2 Slaves
10.2.2.2.1 Slave
10.2.2.2.2 Routing slave
10.2.2.2.3 Enhanced slave
10.2.2.3 Home ID and Node ID
10.2.2.4 Z-Wave chip
10.2.2.5 Z-Wave frame structure
10.2.2.5.1 Z-Wave messaging
10.2.3 Z-Wave Physical Layer
10.2.4 Z-Wave MAC Layer
10.2.4.1 Z-Wave MAC frame types
10.2.4.2 Collision avoidance
10.2.5 Z-Wave Transport Layer
10.2.5.1 Singlecast frame type
10.2.5.2 ACK frame type
10.2.5.2.1 Multicast frame type
10.2.5.2.2 Broadcast frame type
10.2.6 Z-Wave Network Layer (Routing Layer)
10.2.6.1 Frame Layout
10.2.6.1.1 Routed singlecast frame type
10.2.6.1.2 Routed acknowledge frame type
10.2.6.2 Routing table
10.2.6.3 Route to node
10.2.7 Application Layer
10.2.7.1 Frame layout
10.2.7.2 Node information
10.2.7.2.1 Node information frame flow
10.3 Z-Wave Network Operation
10.3.1 Z-Wave Network Setup
10.3.1.1 Including and removing device in the network: 'pairing' operation
10.2.1.2 Z-wave network enrollment and button associations
10.2.1.3 Button pairs versus on/off toggles
10.4 Z-Wave Security
10.4.1 Vulnerabilities
10.4.1.1 Impersonation
Summary
References
11 Smart Home Protocols: Comparison
11.1 Introduction
11.2 ZigBee versus Z-Wave
11.2.1 ZigBee versus Z-Wave: Specifications and Capabilities
11.2.2 ZigBee versus Z-Wave: The Differences
11.2.3 Z-Wave versus ZigBee: The Devices
11.3 Z-Wave and ZigBee versus INSTEON
11.3.1 INSTEON Overview (www.insteon.com)
11.3.2 INSTEON Main Characteristics compared with other Technologies
11.3.3 INSTEON versus Z-Wave and ZigBee: Comparison
11.3.4 Z-Wave, ZigBee, and INSTEON Compared: Summary
11.4 Z-Wave versus THREAD Protocol: Comparison
11.4.1 Internet of Things (IoT)
11.4.2 Thread Protocol
11.4.3 Thread General Characteristics
11.4.3.1 Network stack: Thread versus z-wave stack
11.5 Wi-Fi versus INSTEON and Z-Wave
11.5.1 Wi-Fi Overview
11.5.2 Z-Wave Compared with Wi-Fi
11.5.3 INSTEON Compared with Wi-Fi
11.6 Bluetooth Compared with Z-Wave, ZigBee, Wi-Fi, and INSTEON
11.7 X10 Technology
11.7.1 X10: Overview
11.7.2 INSTEON Compared with X10
11.8 Universal Powerline Bus (UPB)
11.8.1 UPB an Overview
11.8.2 INSTEON Compared with UPB
11.9 Intellon
11.9.1 Intellon: Overview
11.9.2 Intellon Compared with INSTEON Technology
References
Index
About the Authors
Back Cover