This book provides a comprehensive introduction to the current status and future trends of materials and component design for fifth-generation (5G) wireless communications and beyond. Necessitated by rapidly increasing numbers of mobile devices and data volumes, and acting as a driving force for innovation in information technology, 5G networks are broadly characterized by ubiquitous connectivity, extremely low latency, and very high-speed data transfer. Such capabilities are facilitated by nanoscale and massive multi-input multi-output (MIMO) with extreme base station and device densities, as well as unprecedented numbers of antennas. This book covers semiconductor solutions for 5G electronics, design and performance enhancement for 5G antennas, high frequency PCB materials and design requirements, materials for high frequency filters, EMI shielding materials and absorbers for 5G systems, thermal management materials and components, and protective packaging and sealing materials for 5G devices. It explores fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications of 5G-and-beyond wireless communications. Future challenges and potential trends of 5G-and-beyond applications and related materials technologies are also addressed. Throughout this book, illustrations clarify core concepts, techniques, and processes. At the end of each chapter, references serve as a gateway to the primary literature in the field. This book is essential reading for today’s students, scientists, engineers and professionals who want to understand the current status and future trends in materials advancement and component design in 5G and beyond, and acquire skills for selecting and using materials and 5G component design that takes economic and regulatory aspects into account.
Author(s): Colin Tong
Series: Springer Series in Materials Science, 327
Publisher: Springer
Year: 2022
Language: English
Pages: 275
City: Cham
Preface
Contents
Abbreviations
About the Author
Chapter 1: 5G Technology Components and Material Solutions for Hardware System Integration
1.1 Evolution of 5G Technology
1.2 5G Technology Components
1.2.1 5G Spectrum
1.2.2 Massive Multiple-Input Multiple-Output (MIMO) Antennas
1.2.3 Network Slicing
1.2.4 Dual Connectivity and Long Term Evolution (LTE) Coexistence
1.2.5 Support for Cloud Implementation and Edge Computing
1.3 Materials Solutions for 5G Hardware System Integration
1.3.1 Evolution of the Cellular Base Station and Its Construction Materials
1.3.2 Drivers to 5G Hardware System Integration
1.3.3 Materials and Electronic Components for 5G Packaging Technology
1.3.3.1 Packaging Requirements for 5G Systems
1.3.3.2 Dielectric Materials for 5G Module Packages
1.3.3.3 Microwave Circuit Design and Materials
1.3.3.4 Thermal Conductors and Thermal Management for 5G
1.3.3.5 Integration of Passive Components
1.3.3.5.1 Discrete Lumped Circuits for sub6 GHz 5G Bands
1.3.3.5.2 Distributed Components for mm-Wave
1.3.3.6 Antenna Systems in Package
1.3.3.7 High-Precision Patterning in Heterogeneous Package Integration for 5G
1.3.4 Nanomaterials for Nanoantennas in 5G
1.4 Challenges in 5G and Beyond – 6G
1.5 Outlook and Future Perspectives
References
Chapter 2: Semiconductor Solutions for 5G
2.1 Evolution of 5G Semiconductor Technologies
2.2 Effect of CMOS Technology Scaling on Millimeter Wave Operations
2.3 Distributed and Lumped Design Approaches for Fabricating Passives
2.3.1 Distributed Approach
2.3.2 Lumped approach
2.4 Comparison of Silicon and III-V Semiconductors
2.5 Transistor Model Design Challenge in CMOS Technology
2.6 GaN and GaN-on-SiC Wide Bandgap Semiconductors for 5G Applications
2.6.1 Characteristics of GaN Devices Applied in 5G Technology
2.6.2 GaN Power Integration for MMIC in 5G Technology
2.6.2.1 GaN Power Integration for MMICS
2.6.2.2 GaN Base Station PAs
2.6.2.3 GaN Frequency Synthesis
References
Chapter 3: Design and Performance Enhancement for 5G Antennas
3.1 5G Antenna Classification
3.1.1 Classification Based on Input and Output Ports
3.1.2 Classification Based on Antenna Types
3.2 Performance Enhancement Techniques for 5G Antenna Design
3.2.1 General Antenna Performance Enhancement Techniques
3.2.2 Mutual Coupling Reduction (Decoupling) Techniques
3.3 Structural Design and Building Materials of 5G Antennas
3.3.1 SISO Wideband Antennas
3.3.1.1 Single Element Antenna
3.3.1.2 Multielement Antennas
3.3.2 SISO Multiband Antenna
3.3.3 MIMO Wideband Antennas
3.3.3.1 Multielement Without Metal Rim Antennas
3.3.3.1.1 Dual Element Antenna Without Metal Rim
3.3.3.1.2 Multielement Antenna Without Metal Rim
3.3.3.1.3 Multielement Antenna with Metal Rim
3.3.4 MIMO Multiband Antennas
References
Chapter 4: PCB Materials and Design Requirements for 5G Systems
4.1 The Evolution of Printed Circuit Boards
4.1.1 History
4.1.2 Materials and Fabrication Process
4.2 RF and High Frequency PCB Technologies
4.2.1 Basic Circuit Configuration of High-Frequency PCBs
4.2.2 Transmission Line Parameters Used in RF/High Frequency PCB Design
4.3 Designing High-Frequency PCBs
4.3.1 Variables Affecting the Performance of High-Frequency PCBs
4.3.2 High-Frequency PCB Layout Techniques
4.4 Materials Selection of PCBs for Millimeter Wave Applications
4.4.1 High-Frequency PCB Material Selection Guidelines
4.4.2 PCB Materials Used for High-Frequency Applications
4.4.2.1 PCB Substrate Materials
4.4.2.2 Conductors for High-Frequency PCBs
4.5 The Role of Materials in High Frequency PCB Fabrication
4.6 Material Issues Related to 5G Applications
4.6.1 Mixed Signal Acceptance Circuit Board Designs
4.6.2 EMI Shielding Challenges
4.6.3 Impedance Control and Signal Loss
4.6.4 Thermal Management Challenges
4.6.5 Moisture Absorption
References
Chapter 5: Materials for High Frequency Filters
5.1 The 5G Effect on Filter Technologies
5.1.1 Current Status of Mobile Device Filter Technologies
5.1.2 The 5G Filter Performance Challenges
5.1.2.1 The 5G Frequency Spectrum
5.1.2.2 The 5G Filter Requirements
5.1.2.3 Physical Design and Emerging Solutions for the 5G Filters
5.2 Materials and Design for Acoustic Filters
5.2.1 Current Application and Band Allocation of Acoustic Filter Technology
5.2.2 Basic Working Principle of the BAW Filter
5.2.2.1 Structure of the BAW Resonator
5.2.2.2 Key Parameters of the BAW Resonator
5.2.2.3 Topology of the BAW Filter
5.2.3 Materials for the BAW Resonator
5.2.3.1 Piezoelectric Materials
5.2.3.2 Electrode Materials
5.2.4 Temperature Compensation
5.2.5 Frequency Tenability
5.2.6 Lithium Niobate and Laterally Excited Bulk-Wave Resonators (XBAR)
5.3 Microwave and Millimeter Wave Filters Based on MEMS Technology
5.3.1 Micromachined Filters
5.3.1.1 Surface Micromachining Superconductor Filters
5.3.1.2 Planar Microstrip Filters
5.3.1.3 Coplanar Waveguide Filters
5.3.1.4 Micromachined Dielectric Waveguide Resonate Filters
5.3.2 Micromachined Tunable Filters
5.4 Metamaterial and Metasurface Filters for 5G Communications
References
Chapter 6: EMI Shielding Materials and Absorbers for 5G Communications
6.1 EMI Shielding Design Principle in 5G Systems
6.2 Component Package-Level EMI Shielding for 5G Modules
6.3 Board Level EMI Shielding for 5G Systems
6.4 Design and Materials Selection for 5G Absorbers
6.5 Advanced Metallic Composite Materials for High-Frequency EMI Shielding
6.5.1 Hollow and Porous Metal-Based EMI Shielding Materials
6.5.2 Metal-Based EMI Shielding Composites with Frequency-Selective Transmission
6.5.3 Particle-Based EMI Shielding Metallic Composites
6.5.4 MXene-Based EMI Shielding Composites
6.5.5 Metal-Based Flexible EMI Shielding Materials
6.6 Emerging Polymer-Based EMI Shielding and Absorber Materials
References
Chapter 7: Thermal Management Materials and Components for 5G Devices
7.1 Thermal Management Challenges and Strategies in 5G Devices
7.1.1 Form Factor-Constrained Thermal Management Solutions
7.1.2 5G Mobile Device Level Thermal Management
7.1.3 Base Station Level Thermal Management
7.1.4 Emerging Thermal Management Challenges and Strategies
7.2 Thermal Management Materials and Components for 5G-Enabled Mobile Devices
7.2.1 Thermal Management Design and Fundamental Solutions for Smartphones
7.2.1.1 Thermal Management Design Guideline
7.2.1.2 Fundamental Thermal Management Solutions
7.2.1.2.1 Heat Conduction and Spreading
7.2.1.2.2 Convective Air Cooling
7.2.1.2.3 Convective Liquid Cooling
7.2.2 Material Selection for Heat Spreaders and Heat Sinks
7.2.3 Flat Plate Heat Pipes and Vapor Chambers for Mobile Electronic Devices
7.2.4 Thermal Interface Materials
7.2.5 Thermal Insulation Materials
7.2.6 Thermal Metamaterials
7.3 Thermal Management of 5G Base Station Antenna Arrays
7.3.1 Cooling in Traditional AESA’s
7.3.2 Cooling in Planar AESA’s
7.3.3 Antenna Array Cooling at Millimeter Waves
7.4 Thermal Management of 5G Edge Computing
References
Chapter 8: Protective Packaging and Sealing Materials for 5G Mobile Devices
8.1 Design of 5G Millimeter Wave Compatible Covers for High-End Mobile Devices
8.1.1 Dielectric Cover Design
8.1.2 Metallic Cover Design with Inserted Dielectric Slots
8.1.3 Integration Design Consideration
8.2 Thin Film Encapsulation in 5G Electronic Packaging
8.3 Adhesives and Sealants for 5G Systems
References
Chapter 9: Perspectives on 5G and Beyond Applications and Related Technologies
9.1 Applications in Industry Verticals and Their Needs
9.1.1 5G in Automotive
9.1.2 Big Data Analytics in 5G
9.1.3 5G Emergency Communications
9.1.4 Future Factories Enabled by 5G Technology
9.1.5 Smart Health-Care Network Based on 5G
9.1.6 5G Technology for Smart Energy Management and Smart Cities
9.1.6.1 5G Technology for Smart Cities
9.1.6.2 Applications of 5G Technology in the Construction Industry and Infrastructures
9.1.6.3 Smart Building System Integrated with 5G Communication Technology
9.2 Perspectives on 6G Wireless Communications
9.3 Challenges and Prospects of Core Materials and Components for 5G and Beyond
9.3.1 Ultralow-Loss High-Reliability Copper-Clad Laminates
9.3.2 5G Metamaterials and Low-Loss High-Performance RF Technology
9.3.3 5G Low-Loss Magnetoelectric Functional Materials and Devices
9.3.4 Multimodule Integrated Printed Circuit Boards
9.3.5 Manufacturing Technology of Photoelectric Integrated Cables
9.3.6 Photonics-Assisted Ultrabroadband RF Transceiver Integrated Modules
9.3.7 All-Optical Network and Superlarge-Core Fiber Optic Cables
References
Index
